D&R News Alert
March 3rd, 2025
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Welcome to the issue of March 3rd, 2025 of D&R SoC News Alert, our email update to provide you with the latest news and information in the System-On-Chip Community.

AlphaWave Semi
64G UCIe D2D PHY and Controller Subsystem

• Fully integrated and highly configurable subsystem: PHY and Controller
• Builds on the success of the most recent 36Gbps UCIe IP subsystem
• 24G silicon-proven with advanced package (2.5D) and standard package (2D)
• Per-lane health monitoring and full DFT features
• In-house 2.5D/3D packaging expertise
 Learn more at awavesemi.com >>

Foundry News
■ GlobalFoundries and MIT Collaborate to Advance Research and Innovation on Essential Chips for AI
■ Intel set to begin 18A tape-outs later this year, according to reports
Power Management IP
■ Dolphin Semiconductor Provides High-Performance LDO Regulators in TSMC 22nm to Ingenic for IPC Applications
CEVA Ceva-XC21 and Ceva-XC23 baseband DSPs for 5G IoT/UE and 5G-Adv/Infrastructure
  • High-efficiency Ceva-XC21 DSP for low-power cellular IoT/UE modems
  • High-performance Ceva-XC23 DSP for Satcom and RAN in 5G-Adv & pre-6G
  • Scalable architecture and dual-thread design with support for AI workloads
  • 5th gen Ceva-XC vector DSP architecture compatible with enhanced 5G ISA
Learn more >>>

Processor
■ 8051s in Modern Systems: Interfacing to AMBA Buses – a CAST Blog
Artificial Intelligence
■ Arm Drives Next-Generation Performance for IoT with World's First Armv9 Edge AI Platform
■ X-Silicon Revolutionizes AI and Graphics at the Edge with "Constellation" Software Platform
■ Nexus: A Lightweight and Scalable Multi-Agent Framework for Complex Tasks Automation
Products
 ❖ PrimisAI Nexus: A Lightweight and Scalable Multi-Agent Framework for Complex Tasks Automation

How to Select a Turnkey Design Service Company?
Synopsys

• For example, Key ASIC has over 150 silicon proven IPs
• Over 100 ASIC designs in mass production
• 100% successful tape out and streamline the process
• Key ASIC also has partnership with renowned foundries

Learn more >>

Security
■ Agile Analog extends leadership in customizable analog security IP with new clock attack monitor
■ CAST Releases First Commercial SNOW-V Stream Cipher IP Core
■ eMemory and PUFsecurity Launch World's First PUF-Based Post-Quantum Cryptography Solution to Secure the Future of Computing
5G
■ Ceva Unveils Latest High-Performance, High-Efficiency Communication DSPs for Advanced 5G and 6G Applications
Space Solution
■ RF and the Moon: Enabling Lunar-Based Infrastructure and Physical AI Communication - a Cadence blog
Internet of Things
■ Introducing Cortex-A320: Ultra-efficient Armv9 CPU Optimized for IoT - an arm Blog
■ Maximum efficiency at minimum power consumption: New options for integrating RFicient® receivers
Video and Image
■ intoPIX Expands its offering for Medical, Human & Machine Vision Applications with TicoRAW & JPEG-XS on Lattice Low-Power FPGAs
Automotive
■ The Road to AEC-Q100 Qualification – a Weebit Nano Blog
Quantum Computing
■ Guest Post: Current Challenges With Protecting Quantum Computing IP
Partner News
■ Synopsys shares gain on stronger-than-expected earnings forecast
■ TSMC’s Efforts In 2nm Production Could See The Company Reaching 50,000 Monthly Wafers In 2025; With Both Facilities Operational, Output Could Reach 80,000 Units
Business News
■ SkyWater to Acquire Infineon's Austin Fab and Establish Strategic Partnership to Expand U.S. Foundry Capacity for Foundational Chips
■ Nvidia’s Record $39.3 Billion Q1, Synopsys Q1 and Blackwell, Plus Chips Act Funding
■ SEALSQ Enters Into Exclusive Negotiations to Acquire 100% of IC’ALPS





New IP
• PCIE4 PHY in SMIC 28HKD 0.9/1.8V by Brite Semiconductor
• DXTP GPU - Advanced graphics and compute acceleration for power constrained devices by Imagination Technologies
• 24-bit audio inductor-less class-D DAC with efficiency and ultra-low latency capability by Dolphin Semiconductor

What they said at
IP SoC EU 24

Interview with Dr. Calliope-Louisa Sotiropoulou - CAST, Inc.

Interview with Patrick Döll - Physical IC Design Engineer - Racyics GmbH

Interview with Luca TESTA - Cofounder & COO - Keysom

Interview with Ettore Antonino Giliberti - Senior Staff Application Engineer - SmartDV Technologies

Innovating the Future with SOIL: Next-Gen IPs, Transfer from Research to Silicon
Damian Panter, Fraunhofer

From silicon to the use cases, SOIL as a test bench for automotive applications
Leonardo Govoni, AED Vantage GmbH

Designing SOC with ABX® - Challenges and Solutions
Florian Bilstein, Director Design Service, Racyics GmbH

Wireless and Batteryless Interface for IoT
Polina Proskurova, Project Manager, NTLab

How to select the best Audio codec architecture to enhance your wearables?
Etienne Faucher, Product Marketing Manager, Dolphin Semiconductor

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