D&R News Alert
May 15th, 2025


Welcome to the issue of May 15th, 2025 of D&R SoC News Alert, our email update to provide you with the latest news and information in the System-On-Chip Community.

Foundry and Ecosystem News
■ Rapidus Starts Path to Advanced Chipmaking in Japan Government-backed startup’s 2-nanometer pilot production gets underway
■ Synopsys ramps up collaboration with Taiwan’s TSMC on A16 process
Design Platform
■ Alps Alpine Adopts Silvaco’s Jivaro Pro to Accelerate SPICE Post-Layout Simulation
■ UCIe Full SI Analysis Flow with Compliance Check for Heterogeneous Integration by Cadence
Products
 ❖ Analogue Insight - Chiplet Design services

PUF Security + Ememory
NeoPUF: Pioneering a New Era of Chip Security

Explore NeoPUF Now to Strengthen Your Chip Security！>>
  • PUF-based Security: Generates unclonable true random numbers, enhancing chip protection.
  • Hardware-level Defense: Safeguards systems from the chip level, countering cybersecurity threats.
  • Silicon-proven and Production-ready: Streamlines SoC design flows, accelerating time-to-market.

Chiplets
■ Rambus Delivers Industry-Leading Client Chipsets for Next-Generation AI PC Memory Modules
RISC-V
■ Andes Technology Showcases RISC-V AI Leadership at RISC-V Summit Europe 2025
■ RISC-V International Promotes Andrea Gallo to CEO
Incore FREE RISC-V core for your next chip!
InCore Innovator Access Program

• Zero upfront licensing fees*
• Silicon proven, PPA-optimised RISC-V CPU
• Flexible production pricing
• Comprehensive support and dev resources
     *only for test chip tapeouts

Join the Program     Learn more

Artificial Intelligence
■ Siemens leverages AI to close industry’s IC verification productivity gap in new Questa One smart verification solution
■ The future of AI runs on the GPU
■ See the 2025 Best Edge AI Processor IP at the Embedded Vision Summit
Automotive
■ Arteris Q1 2025 presentation highlights 28% revenue growth, strategic automotive wins
■ Samsung’s 12nm-class Automotive LPDDR5X: DRAM for safety-critical centralized automotive systems
■ Siemens Cre8Ventures Partners with Xiphera to Strengthen Automotive Security and Support EU Chips Act Sovereignty Goals
Keysom

Core Explorer V 1.0

• Unlock Customization, Unleash Performances
• Reliable design exploration of fully customizable
  RISC-V architectures

5G
■ 5G-OT Alliance launched to bring 5G/LTE to OT environments
And what’s next in the high tech world
■ Historic Quantum Technology Agreement Signed by EU, Japan
■ Imec and TNO open Holst Centre Photonics Lab at High Tech Campus
EECONE
European ECOsystem for greeN Electronics
Introduction to the use cases developed
in the EECONE project (part 2)
 Webinar, May 21st 2025, 11.00am - 12.00pm (Paris Time)
 Click here to register! >>

Partner News
■ UK takeover panel gives Qualcomm till May 27 to make a bid for Alphawave
■ QuickLogic Reports Fiscal First Quarter 2025 Financial Results
Business News
■ Renesas Partners with Indian Government to Drive Innovation Through Startups and Industry-Academia Collaboration, Strengthening India’s Semiconductor Ecosystem
■ TSMC Board of Directors Meeting Resolutions
■ SMIC Q2 revenues to take 6% hit due to tool maintenance and validation issues
Visit the freshly renewed B2B unique worldwide portal

>> www.design-reuse.com

listing the best qualified resources for designing IP based Electronic systems







New IP
• CXL Controller IP by WolleyTech

What they said at
IP SoC Silicon Valley 25

Post-Quantum Cryptography for IoT: Challenges and Adoption
Kris Kwiatkowski, Cryptography Architect, PQShield

LDPC based error correction solutions for Storage , Wireless and communication markets
Andrei Vityaev,Jaydeep Bhatt, Technical Advisor,Sr. Manager of IP design, Mobiveil Inc.

Meeting Automotive Design, Safety and Security Challenges with an Integrated HSM Solution
Raj Uppala, Senior Director of Marketing & Partnerships, Rambus, Inc.

Functional Safety Solutions for Automotive SoC Design
Kyle Weng, VP of Marketing and Sales, OPENEDGES Technology, Inc.

TSN Ethernet: Architectures and Applications
Alexander Mozgovenko, Product Manager, CAST

ISP Product for Automotive Camera Systems
Chris Wang, VP of Multimedia Technologies and a Member of CTO Office, VeriSilicon Inc.

Tech Trend of Image Signal Process with AI Technology
Jeiff Kim, SVP of Marketing/Sales, BTREE Co. Ltd.

Professional videography ecosystem and APV CODEC
Andy Lee, Vice president, US marketing, Chips&Media, Inc.

REGISTER:
If this newsletter was forwarded to you by a colleague, you can have it sent directly to you at no cost. To register for D&R SoC News Alert, go to:

UPDATE YOUR PROFILE / UNSUBSCRIBE :
You are subscribed as and you receive this Alert in html format.

* If you wish to unsubscribe, you can do it there: