Design & Reuse

IonQ Strengthens Quantum Computing Capabilities through Partnerships with imec and NKT Photonics

thequantuminsider.com, Nov. 08, 2024 – 

In a move towards scalable and enterprise-ready quantum systems, IonQ recently announced two new partnerships with imec and NKT Photonics. Both collaborations focus on developing advanced optical systems that are essential for achieving high-performance and reliable quantum systems. In its partnership with imec, IonQ will work to integrate photonic circuits and chip-scale ion trap technology, creating more compact and efficient hardware solutions. The collaboration with NKT Photonics focuses on next-generation laser systems designed to power IonQ's upcoming quantum systems, ensuring the scalability and performance needed for data center applications.

Integrated Photonic Circuits for Enhanced Trapped Ion Quantum Computers

IonQ's latest collaboration with imec, a global research center for nanoelectronics, focuses on the development of photonic integrated circuits (PICs) and chip-scale ion trap technology. According to IonQ, this partnership centers around moving beyond traditional bulk optics, which has long been the standard for delivering and modulating laser light in quantum computers. By transitioning to integrated photonics, IonQ intends to significantly reduce hardware size, improve system performance, and drive down costs.

Dean Kassmann, IonQ's SVP of Engineering and Technology, highlighted the importance of this partnership, noting it "will have a profound impact on our ability to increase the computational power of our quantum computers through the co-development of compact, high-performance electro-optical systems."

This collaboration is expected to enable more compact electro-optical systems, which aligns with IonQ's commitment toward realizing "commercial quantum advantage." By aligning its photonics with imec's ion trap manufacturing, IonQ may be able to reduce the overall cost per qubit and bring high-performance systems to market faster, according to the release.

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