Design & Reuse

AI chips in 2025: Smaller, faster, smarter

There are two ways to make semiconductors more powerful: scaling technology to shrink transistors in nanometer-level sizes to fit more of them onto a chip and introducing innovative packaging techniques to further enhance data transfer speeds and efficiency.

asianews.network, Feb. 03, 2025 – 

The rapid expansion of artificial intelligence is reshaping the global semiconductors industry, driving an unprecedented surge in demand for faster, smaller and more energy-efficient chips.

This year, the global semiconductors market is expected to grow by about 15 percent, backed by the AI boom, according to market tracker IDC.

To meet growing demand for high-end logic process chips and high-bandwidth memory capable of processing massive data volumes in AI applications, chipmakers will be focusing on cutting-edge process nodes and advanced chip packaging technologies in 2025, pushing the limits of miniaturization and efficiency.

"As AI continues to drive demand for high-end logic process chips and increases the penetration rate of high-priced high bandwidth memory (HBM), the overall semiconductor market is expected to have double-digit growth in 2025," said Galen Zeng, senior research manager at IDC Asia-Pacific.

"The semiconductor supply chain – spanning design, manufacturing, testing and advanced packaging – will create a new wave of growth opportunities under the cooperation between the upstream and downstream industries."

There are basically two ways to make semiconductors more powerful: scaling technology to shrink transistors in nanometer-level sizes to fit more of them onto a chip and introducing innovative packaging techniques to further enhance data transfer speeds and efficiency.

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