Design & Reuse

Industry Articles

Multi-Die SoCs Gaining Strength with Introduction of UCIe

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August 29, 2022

By Manuel Mota, Sr. Product Marketing Manager, Synopsys

The Universal Chiplet Interconnect Express UCIe specification brings together very competitive performance advantages to multi-die system designers, including high energy-efficiency, high edge usage efficiency and low latency, and more. Read this article to learn all about UCIe and its many advantages for multi-die system designs.

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