Industry Articles
Multi-Die SoCs Gaining Strength with Introduction of UCIe-August 29, 2022 |
By Manuel Mota, Sr. Product Marketing Manager, Synopsys
The Universal Chiplet Interconnect Express UCIe specification brings together very competitive performance advantages to multi-die system designers, including high energy-efficiency, high edge usage efficiency and low latency, and more. Read this article to learn all about UCIe and its many advantages for multi-die system designs.