I attended the 3D packaging conference in Burlingame this week. The most interesting presentation to me was by Bryan Black of AMD. He argued very convincingly that Moore's Law is basically over for the PC microprocessor business and the way forward is going to be 3D. AMD are clearly working on all this.

Increased density and performance/power at each node is great, but in the end it is lower cost transistors that drives the transition for all except the leading edge.

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