Industry Expert Blogs
TSMC OIP Ecosystem Forum: Harnessing the Power of Collaboration-September 24, 2015 |
“The most ambitious ideas come with a million moving pieces. The only way to bring it all together is through the power of collaboration.” —TSMC
Indeed, that collaborative energy was out in full force throughout TSMC Open Innovation Platform® (OIP) Ecosystem Forum on Thursday, Sept. 17, 2015, at the Santa Clara Convention Center.
“There are a lot of myths in this industry, born of the lone innovator working independently,” said Rick Cassidy, president of TSMC North America, in his welcome remarks. “You in this room, frankly, debunk this myth. It’s not the lone genius. It’s a lot of geniuses all working with one another to make the impossible come through.”