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Blogs
NAND Flash Memory - Key Element For Your Multi-Die Systems Verification - Part 1
(Tuesday, May 9, 2023)
How to Shift Left on Low-Power Design Verification, Early and Quickly
(Tuesday, May 9, 2023)
Pre and Post-Silicon Verification Have Never Been Closer! Leveraging Portable Stimulus for Automatic Test Equipment (ATE)
(Monday, May 8, 2023)
Synopsys Acquires Silicon Frontline Technology
(Monday, May 8, 2023)
An Introduction about ATPG in VLSI
(Friday, May 5, 2023)
Imparé Imparts Its Insights on Verification in the Cloud
(Thursday, May 4, 2023)
Low-Power IC Design: What Is Required for Verification and Debug?
(Wednesday, May 3, 2023)
How the CXL Standard Improves Latency in High-Performance Computing
(Wednesday, May 3, 2023)
RISC-V customization, HW/SW co-optimization, and custom compute
(Tuesday, May 2, 2023)
Moving AMBA forward with multi-chip and CHI C2C
(Tuesday, May 2, 2023)
How Chip Design Was Revolutionized by AI-Enhanced Game Play
(Tuesday, May 2, 2023)
RISC-V customization, HW/SW co-optimization, and custom compute
(Tuesday, May 2, 2023)
CEO Interview: Ravi Thummarukudy of Mobiveil
(Monday, May 1, 2023)
How Arm is making it easier to build platforms that support Confidential Computing
(Monday, May 1, 2023)
RISC-V's Worldwide Expansion and Andes Technology's Contribution
(Monday, May 1, 2023)
The Wonders of Machine Learning: Tackling Lint Debug Quickly with Root-Cause Analysis (Part 3)
(Monday, May 1, 2023)
Arm's prototype chips: What it means for the IC industry?
(Thursday, April 27, 2023)
Stormy Last Days At Arm Under Softbank Ownership
(Thursday, April 27, 2023)
Benchmarking Cadence Tools on Arm-based Servers in the Cloud
(Thursday, April 27, 2023)
Cadence Demonstrates 112G-ELR SerDes IP on TSMC's 3nm Process Technology
(Thursday, April 27, 2023)
Working with the NimbleAI project to push the boundaries of neuromorphic vision
(Thursday, April 27, 2023)
Environmental Noise Cancellation (ENC): Part 2 - Noise types and classic methods for Speech Enhancement
(Thursday, April 27, 2023)
Automotive Battery Management System Using Bluetooth LE
(Thursday, April 27, 2023)
A formal-based approach for efficient RISC-V processor verification
(Wednesday, April 26, 2023)
Design IP Sales Grew 20.2% in 2022 after 19.4% in 2021 and 16.7% in 2020!
(Sunday, April 23, 2023)
Powering the Next Wave of AI Inference with the Rambus GDDR6 PHY at 24 Gb/s
(Thursday, April 20, 2023)
How Is AI Driving the Next Innovation Wave for Electronic Design?
(Thursday, April 20, 2023)
UFS 4.0 Explained: How the Latest Flash Storage Standard Propels Our 5G World
(Tuesday, April 18, 2023)
4nm 112G-ELR SerDes PHY IP
(Monday, April 17, 2023)
PCIe 6.0 - All you need to know about PCI Express Gen6
(Monday, April 17, 2023)
UFS 4.0 Explained: How the Latest Flash Storage Standard Propels Our 5G World
(Monday, April 17, 2023)
Protecting die-2-die interfaces...
(Friday, April 14, 2023)
SNUG Silicon Valley 2023: Catalyzing the Future for Our Smart Everything World
(Friday, April 14, 2023)
Q&A with Sergio Silva, Synopsys Engineering Manager and MIPI Alliance Lifetime Achievement Award Winner
(Thursday, April 13, 2023)
The Future of Silicon Innovation in the Chiplet Era
(Thursday, April 13, 2023)
What do sustainable business practices mean for the energy industry?
(Thursday, April 13, 2023)
Meeting Requirements for UCIe-Based Multi-Die Systems Success
(Wednesday, April 12, 2023)
Cortex-M23: Now Enhanced for Safety-critical Automotive Applications
(Tuesday, April 11, 2023)
A Recap of MemCon 2023 with Mark Orthodoxou
(Tuesday, April 11, 2023)
How the MACsec Protocol Keeps Ethernet Networks Secure
(Tuesday, April 11, 2023)
How the MACsec Protocol Keeps Ethernet Networks Secure
(Monday, April 10, 2023)
Mitigating Side-Channel Attacks In Post Quantum Cryptography (PQC) With Secure-IC Solutions
(Thursday, April 6, 2023)
How to Achieve Faster Signoff of Billion-Gate, Low-Power SoCs
(Thursday, April 6, 2023)
The Future of Silicon Innovation in the Chiplet Era
(Thursday, April 6, 2023)
Mitigating side-Channel Attacks in Post Quantum Cryptography (PQC) with Secure-IC Solutions
(Thursday, April 6, 2023)
4 Critical Characteristics for Automotive SoCs
(Wednesday, April 5, 2023)
Raising RISC-V processor quality with formal verification
(Tuesday, April 4, 2023)
Arm looking to charge phone-makers
(Monday, April 3, 2023)
An Industry-Wide Look at the Move Toward Multi-Die Systems
(Monday, April 3, 2023)
The Five Must-Have Features of Modern Automotive SoC Architectures
(Monday, April 3, 2023)
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