Interconnect, D2D, C2C / chip to chip IP Core

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Chip to Chip (5)

Die-to-die (25)

Intra SoC Connectivity (9)

Network Interconnect (15)

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UMI™ for Die-to-Memory (D2M) PHY IP

Unlike fixed unidirectional die-to-die solutions, NuLink technology is able to deliver low-power and high-performance D2M solutions....

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Innovative Ultra-High-Speed Chiplet Solution

Innosilicon INNOLINK™ IP provides a leading-edge chiplet solution allowing massive amounts of low-latency data to pass seamlessly between smaller chip...

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Low Power Dual PHY for UCIe low cost robust Chiplets

YorChip UniPHY™ Dual PHY is a flexible version of YorChip's multi-protocol PHY which supports UCIe and BOW standards. The Dual PHY's uni...

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XPHY Low power Chip to Chip SerDes IP, Silicon Proven in ST 28FDSOI

These IPs are targeted at applications requiring high speed, high bandwidth, low-power consumption, and low-latency interfaces....

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Nutcracker XSR Connectivity Chiplet

Core and analog logic may not always deploy at the same time in the same process. Maturing high performance analog typically takes longer in moving to...