Design & Reuse
6 IP
1
14.0
40G Ultralink D2D PHY for Samsung 7LPP
Proprietary chiplet interconnect solution with high-performance, high-bandwidth, and long reach die-to-die link connectivity The Cadence® UltraLink™ ...
2
14.0
40G Ultralink D2D PHY for GF12LP+
Proprietary chiplet interconnect solution with high-performance, high-bandwidth, and long reach die-to-die link connectivity The Cadence® UltraLink™ ...
3
14.0
UltraLink Controller
Ultralink controller for high performance die-to-die interconnect on streaming, CXS, and AXI protocols The Cadence Ultralink Controller enables a pro...
4
0.0
40G Ultralink D2D PHY for TSMC N6, N7
Proprietary chiplet interconnect solution with high-performance, high-bandwidth, and long reach die-to-die link connectivity The Cadence® UltraLink™ ...
5
0.0
40G Ultralink D2D PHY for TSMC N5P
Proprietary chiplet interconnect solution with high-performance, high-bandwidth, and long reach die-to-die link connectivity The Cadence® UltraLink™ ...
6
0.0
40G Ultralink D2D PHY for TSMC N3P
Proprietary chiplet interconnect solution with high-performance, high-bandwidth, and long reach die-to-die link connectivity The Cadence® UltraLink™ ...