The collaboration will provide GF with access to A*STARs state-of-the-art R&D facilities, capabilities and technical support for technology development and workforce skills enhancement in advanced packaging
May. 20, 2025 –
GlobalFoundries (Nasdaq: GFS) (GF) today announced plans to expand its capabilities in advanced packaging through a new Memorandum of Understanding (MOU) signed with the Agency for Science, Technology and Research (A*STAR), Singapore’s lead public sector research and development (R&D) agency.
Advanced packaging has become a key R&D priority for the semiconductor industry amid growing demand for artificial intelligence (AI) and other data-intensive applications ranging from high performance data computing and datacenters to 5G / 6G communication and more. To meet these needs, acceleration in advanced packaging technologies will be key to delivering the compact, high-performance and energy-efficient technology solutions needed to drive the industry’s long-term growth.
Under the MOU framework, A*STAR will provide GF with access to its R&D facilities, capabilities and technical support, while GF will provide critical equipment to A*STAR to further its R&D efforts. The collaboration will accelerate GF’s plan to develop and ramp its advanced packaging solutions and expand its offerings to provide customers one-stop solutions for semiconductor chips to be manufactured, processed, packaged and tested at GF’s Singapore manufacturing facility.
“With a robust semiconductor ecosystem and strong R&D support from the government and institutions like A*STAR, Singapore is an ideal location for us to develop and scale our essential innovations at the foundry level,” said Gregg Bartlett, GF’s Chief Technology Officer. “This aligns to our global advanced packaging roadmap and reinforces our commitment to deliver more energy-efficient essential chips that are crucial for our customers, especially in the AI era.”