The Nihon Keizai Shimbun (Nikkei) reported on the 1st that the two companies are pushing to develop a new large-capacity memory that reduces power consumption by half compared to high-bandwidth memory (HBM), which is essential for AI devices.
www.mk.co.kr, Jun. 01, 2025 –
The University of Tokyo, Japan's most prestigious university, will also participate in this. Several companies and organizations are also reportedly considering investment and technical cooperation, including the National Institute of Chemical Research (Riken), a national research and development corporation, and the semiconductor package substrate company Shinco Electric Industries.
Softbank and others recently established a company called "Sai Memory" to develop new semiconductors. In addition to Intel's technology, the company plans to use patents owned by Tokyo University and others to make prototypes over the next two years and then determine the possibility of mass production.
Cy Memory is responsible for IP (Intellectual Property) management or chip design while functioning as a head coach for development projects, and entrusts production to external companies. Cy Memory plans to reduce power consumption compared to HBM by changing the structure of wiring between memories when stacking memory DRAMs on a substrate.