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Mar. 12, 2019 –

Attopsemi Expands its Proven I-fuse® OTP Portfolio on X-FAB's 180nm Platform (February 26, 2025)
DENSO Adopts Attopsemi's OTP to Upgrade Future Automotive Products (July 17, 2023)
Attopsemi's Revolutionary I-fuse® OTP Silicon-Proven on FinFET Technology (April 24, 2023)
Attopsemi OTP IP embedded in Fingerprints™ biometric solution to facilitate biometric technology (March 6, 2023)
Latest Attopsemi I-fuse OTP Memories Based on Ground-Breaking New Architecture Now Available on X-FAB's 180 nm Technology (May 9, 2022)

LASER 2025: UK Photonics industry surges to £18.5 billion turnover in 2024 (June 24, 2025)
BOS Joins VESA and UCIe to Advance Global Standards in Display and Chiplet Technology (June 23, 2025)
EU Project ELENA Pioneers LNOI Platform for Next-Gen Photonic Circuits & Europe's 1st Commercial Supplier of LNOI Wafers (June 20, 2025)
PCIe 7.0 Keeps Pace with AI Demands (June 18, 2025)
HBM development roadmap revealed: HBM8 with a 16,384-bit interface and embedded NAND in 2038 (June 17, 2025)