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Wednesday, June 25, 2025

• BrainChip and HaiLa Partner to Demonstrate Ultra-Low Power Edge AI Connectivity for IoT Sensor Applications
• Siemens streamlines design and analysis of complex, heterogeneously integrated 3D ICs

Tuesday, June 24, 2025

• Ceva Launches MotionEngine™ Hex: Bringing Precise, Touch-Free, Spatial Control to Smart TV, Gaming, and IoT Interfaces
• Creonic's DVB-S2 and DVB-S2X IP Cores Now Support the New DVB-NIP Standard
• Faraday Delivers Latest SerDes IP to Complete Interface Lineup on UMC’s 22nm Platform

Monday, June 23, 2025

• Mirabilis Design Signs OEM Agreement with Cadence to Deliver VisualSim for System-Level Modeling and Performance Optimization
• BOS Joins VESA and UCIe to Advance Global Standards in Display and Chiplet Technology
• Arteris Addresses Silicon Design Reuse Challenge with New Magillem Packaging Product for IP Blocks and Chiplets
• Siemens turbocharges semiconductor and PCB design portfolio with generative and agentic AI
• Rapidus announces collaboration with Siemens for 2nm semiconductor design
• Certified Automotive Ethernet, CAN XL, and LIN IP Cores — Proven, Qualified, and Ready for Seamless Integration
• True Circuits Announces New and Improved Low-jitter Digital Ultra+ PLL that Offers Exceptional Performance, Features and Ease of Use

Sunday, June 22, 2025

• 3 Trending Sessions Led by Veriest at DAC 2025
• Launch of BrainChip Developer Hub Accelerates Event-Based AI Innovation on Akida™ Platform with Release of MetaTF 2.13

Friday, June 20, 2025

• The Chiplet Economy: Three Pillars for Semiconductor Success
• True Circuits Introduces the Low-jitter Digital Ultra+ PLL at the Design Automation Conference

Thursday, June 19, 2025

• Ireland’s "Silicon Island" strategy could boost Europe’s analog ecosystem
• CAST Launches Multi-Channel DMA IP Core Ideal for Streaming Applications
• BT Group Joins the CHERI Alliance to Advance Cybersecurity Innovation
• Keysight Enables AMD to Showcase Electrical PCI Express® Compliance up to 64 GT/s
• CEA-Leti and Soitec Announce Strategic Partnership to Leverage FD-SOI for Enhanced Security of Integrated Circuits

Wednesday, June 18, 2025

• QuickLogic to Exhibit at Chips to Systems Conference (DAC) 2025
• PCIe 7.0 Keeps Pace with AI Demands
• Siemens collaborates with Samsung Foundry on advanced node product certifications and EDA innovation
• DCD-SEMI Joins MIPI Alliance and Unveils Latest I3C IP at MIPI Plugfest Warsaw 2025

Tuesday, June 17, 2025

• Why Standardized SerDes Interfaces Are Essential for In-Vehicle Networks
• HBM development roadmap revealed: HBM8 with a 16,384-bit interface and embedded NAND in 2038
• Arteris Accelerates AI-Driven Silicon Innovation with Expanded Multi-Die Solution
• Nordic Semiconductor accelerates edge AI leadership with acquisition of Neuton.AI
• Xylon Celebrates 30 Years of Innovation in Embedded Electronics
• Cadence Accelerates SoC, 3D-IC and Chiplet Design for AI Data Centers, Automotive and Connectivity in Collaboration with Samsung Foundry
• Synopsys Accelerates AI and Multi-Die Design Innovation on Advanced Samsung Foundry Processes

Monday, June 16, 2025

• Imec and Tokyo Electron extend partnership to accelerate the development of beyond-2nm nodes
• TSMC's Phenomenal 2nm Yield Rates Would Likely Put Alternatives From Samsung & Intel Foundry Way Behind; Apple, NVIDIA & AMD to Be Major Customers
• TSMC: King Of Data Center AI
• Sustainable semiconductor manufacturing - too little too late or Europe protectionism?
• SmartDV Introduces Advanced H.264 and H.265 Video Encoder and Decoder IP
• Safety Without Security Is an Illusion in the Age of Autonomous Vehicles
• Advanced MIPI IP Cores for Automotive, IoT, Consumer, Imaging & Display SoCs
• InCore Unveils SoC Generator Platform: From Idea to FPGA Validation in Minutes; Demonstrates Silicon Proof of Auto-Generated SoC

Sunday, June 15, 2025

• Samsung, TSMC set stage for fierce race in 2nm chip tech

Friday, June 13, 2025

• Chinese regulator holds off on clearing $35B Synopsys-Ansys merger - report
• Nordic Semiconductor to showcase cutting-edge cellular IoT solutions at MWC Shanghai 2025
• Risks of Lack of Strategy for AI in Supply Chains
• Ai drives power management into top ten fabless chip list
• Samsung Foundry Struggles With 3nm Yields at 50% as TSMC Climbs Past 90%
• M31 Ranked in the Top 5% of TPEx-Listed Companies in the Corporate Governance Evaluation for Four Consecutive Years