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Automotive News

• Keysight and CATARC New Energy Vehicle Inspection Center Expand Strategic Collaboration to Advance Charging Test Technologies (Thursday, May 7, 2026)
• Auto China: Bosch pushes ahead with Level 3 highly automated driving​​​​​​​ (Thursday, April 30, 2026)
• ISO 26262: The Impact of ASIL Metrics on Embedded Software Design (Thursday, April 30, 2026)
• LTSCT Joins imec Automotive Chiplet Program (Thursday, April 30, 2026)
• Arasan achieves the Industry’s First ASIL-D Certification for its CAN XL IP Core (Wednesday, April 22, 2026)
• Bosch, Qualcomm expand partnership to include ADAS technology (Monday, April 20, 2026)
• OmniTrust and Synopsys collaboration enables earlier security validation of embedded systems (Monday, April 13, 2026)
• BOS Semiconductors to Showcase AI Innovations at Auto China 2026 (Thursday, April 9, 2026)
• Renesas’ Radiation Hardened ICs Take Flight on NASA’s Artemis II Crewed Lunar Mission (Monday, April 6, 2026)
• Keysight Unveils Next-Generation In-Vehicle Network Test Solutions at Automotive Ethernet Congress 2026 (Thursday, April 2, 2026)
• Arteris Network-on-Chip IP Deployed in Renesas’ Next-Gen R-Car Automotive Technology (Tuesday, March 24, 2026)
• GlobalFoundries Announces Availability of AutoPro150 eMRAM Technology on Enhanced FDX Platform for Advanced Automotive Applications (Thursday, March 12, 2026)
• Infineon expands DRIVECORE portfolio with three new software bundles, accelerating customer transition toward future RISC‑V automotive microcontrollers (Thursday, March 5, 2026)
• Renesas Expands Auto MCU Portfolio with 28nm RH850/U2C for Vehicle Control and Automotive Safety Applications (Thursday, March 5, 2026)
• Renesas Looks to the Future of Automotive With New Memory and SoC Tech (Monday, March 2, 2026)
• Renesas Develops SoC Technologies for Automotive Multi-Domain ECUs Essential for the SDV Era (Monday, February 23, 2026)
• Renesas Develops SoC Technologies for Automotive Multi-Domain ECUs Essential for the SDV Era (Thursday, February 19, 2026)
• STMicroelectronics Claims First Automotive MCU with Edge AI Acceleration (Thursday, February 19, 2026)
• Aftermarket ADAS kit targets commercial vehicle retrofits (Monday, February 16, 2026)
• STMicroelectronics introduces the first automotive microcontroller with AI acceleration for edge intelligence (Thursday, February 12, 2026)
• Arasan's ultra low power MIPI D-PHY IP achieves ISO26262 Certification (Wednesday, February 4, 2026)
• De-risking the Start of Production for Automotive SoCs (Monday, February 2, 2026)
• Tenstorrent Announces Participation in CHASSIS Program, Joint Initiative for Automotive Chiplet Technology (Thursday, January 29, 2026)
• Keysight Powers the Future of e-Mobility with Test Solutions for High-Power and Megawatt Charging (Monday, January 26, 2026)
• Software-Defined Systems: Reshaping the Future of Modern Cars (Monday, January 26, 2026)
• Italy’s Quiet Exposure to China in Automotive and Power Chips (Thursday, January 22, 2026)
• Faster SDV development with IPG Automotive and Synopsys collaboration (Monday, January 12, 2026)
• SiMa.ai Announces First Integrated Capability with Synopsys to Accelerate Automotive Physical AI Development (Monday, January 12, 2026)
• TES offers CAN Flexible Data-Rate Controller IP Core for System-on-Chip (SoC) Designs (Friday, January 9, 2026)
• Synopsys Showcases Vision For AI-Driven, Software-Defined Automotive Engineering at CES 2026 (Thursday, January 8, 2026)
• Partnership Drives RISC-V Adoption in Automotive (Wednesday, December 24, 2025)
• Siemens' new PAVE360 Automotive drives next-generation vehicle development with real-world validation (Thursday, December 18, 2025)
• Keysight Accelerates Automotive Innovation from Design to Defense at CES 2026 (Thursday, December 18, 2025)
• Chiplet Technology in Automotive Applications: A Cost-Effective Path to Advanced Electronics (Thursday, December 18, 2025)
• Renesas Fast-Tracks SDV Innovation with R-Car Gen 5 SoC-Based End-to-End Multi-Domain Solution Platform (Tuesday, December 16, 2025)
• Synopsys to Showcase Future of Automotive Engineering at CES 2026 (Monday, December 15, 2025)
• Arteris Selected by Black Sesame Technologies for Next Generation of Intelligent Driving Silicon (Tuesday, December 2, 2025)
• SAICEC Partners with Siemens to Accelerate Chip-to-vehicle Validation (Monday, December 1, 2025)
• BOS Semiconductors Eyes Expansion into ‘Intelligent Space’ AI Market Beyond ADAS (Thursday, November 27, 2025)
• Semiconductor supply risk management From firefighting to proactive strategy (Thursday, November 27, 2025)
• Synopsys Convenes Industry Leaders to Discuss Future of Automotive Engineering for Software-Defined Vehicles (Monday, November 24, 2025)
• SEALSQ and IC’Alps Unify Expertise to Deliver Integrated Post-Quantum Cybersecurity and Functional Safety for Autonomous Vehicles (Thursday, November 6, 2025)
• Tesla splits AI5 chip production between Samsung and TSMC in strategic dual-foundry move (Monday, October 27, 2025)
• Tata Technologies collaborates with Synopsys to accelerate Software‑Defined Vehicle innovation (Thursday, October 23, 2025)
• Soitec and CEA partner to develop automotive cybersecurity with advanced FD-SOI technology (Thursday, October 23, 2025)
• Keysight Introduces Optical Automotive Ethernet Transmitter Test Solution for nGBASE-AU Standard (Thursday, October 16, 2025)
• GlobalFoundries, Infineon, Silicon Box, STATS ChipPAC, TIER IV Join imec Automotive Chiplet Program (Thursday, October 16, 2025)
• Keysight Expands End-of-Line Test Portfolio to Power the Future of Electric Mobility (Monday, October 6, 2025)
• Qualcomm and Valeo join hands to provide pre-integrated ADAS & AD platform (Monday, September 15, 2025)
• BOS CSO Highlights Future of Automotive AI at AI Semiconductor Forum (Monday, September 15, 2025)