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• Rambus Introduces PCIe® 7.0 Switch IP with Time Division Multiplexing for Scalable AI and Data Center Infrastructure (Wednesday, May 6, 2026)
• Two Weebit Nano product customers tape-out; one already demonstrating a functional prototype (Tuesday, May 5, 2026)
• Silicon-Proven 112Gbps SerDes IP Core in 12FFC Redefines High-Speed Connectivity with Unmatched Flexibility and Performance (Monday, May 4, 2026)
• Perceptia Devices and Dolphin Semiconductor Partner to Deliver Best-in-Class IP Portfolio Covering Power Management, Clocking, High-Quality Audio and In-Situ Monitoring (Wednesday, April 29, 2026)
• TES is extending its PMU IP portfolio for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology. (Tuesday, April 28, 2026)
• M31 Collaborates with TSMC to Achieve Tapeout of eUSB2V2 on N2P Process, Advancing Design IP Ecosystem (Monday, April 27, 2026)
• Arasan Announces immediate availability of its UFS 5.0 Host controller IP (Friday, April 24, 2026)
• Menta’s eFPGA Technology Adopted by AIST for Cryptography and Hardware Security Programs (Thursday, April 23, 2026)
• GUC Announces 3nm 12 Gbps HBM4 PHY and Controller (Wednesday, April 22, 2026)
• MIPI A-PHY Tx and Rx IP Cores: Production-Proven, 6.4 Gbps Automotive Connectivity in 12FFC (Tuesday, April 21, 2026)
• DCD-SEMI expands its cryptographic CryptOne system with EdDSA Curve25519 IP core for secure embedded systems (Tuesday, April 21, 2026)
• Protocol, Link, & Physical: Synopsys Debuts First ‘Complete’ Storage (Monday, April 20, 2026)
• IntoPIX Unleashes Zero‑Latency IP Video Streaming With JPEG XS, IPMX & SMPTE 2110 At NAB Show 2026 (Monday, April 13, 2026)
• TES offers a High-Frequency Synthesizer and Clock Generator IP for X-FAB XT018 - 0.18µm BCD-on-SOI technology (Tuesday, April 7, 2026)
• DDR5/LPDDR5/DDR4 Combo PHY & Controller IP Core in 12FFC - Eliminating Memory Interface Risk (Tuesday, April 7, 2026)
• Advancement of NiuXin PCIe IP: From PCIe 3.0 to PCIe 5.0, Strengthening the Foundation of Chip Interconnection (Monday, April 6, 2026)
• Analog & Mixed-Signal IP Licensing Deal with Tier-1 Korean Customer - T2M Expands Global Reach! (Tuesday, March 31, 2026)
• Faraday Highlights 40nm SONOS eNVM as NOR Flash Alternative for MCU Designs (Thursday, March 26, 2026)
• Movellus Advanced Clocking IP Selected for QuickLogic’s Strategic Radiation Hardened FPGA Program (Thursday, March 12, 2026)
• Rambus Sets New Benchmark for AI Memory Performance with Industry-Leading HBM4E Controller IP (Thursday, March 5, 2026)
• Faraday Broadens IP Offerings on UMC’s 14nm Process for Edge AI and Consumer Markets (Tuesday, March 3, 2026)
• TES offers new High-Speed Comparator IPs for X-FAB XT018 - 0.18µm BCD-on-SOI technology. (Monday, March 2, 2026)
• TES offers new High-Speed Comparator IPs for X-FAB XT018 - 0.18µm BCD-on-SOI technology. (Monday, March 2, 2026)
• Chips&Media Accelerates WAVE-N Ecosystem: Redefining the Future of Next-Generation Customized NPUs (Tuesday, February 24, 2026)
• M31 Validates MIPI M-PHY v5.0 IP on 4nm, Advances 3nm Development to Enable UFS 4.1 Applications (Monday, February 23, 2026)
• TES Launches its µEngine: Parallel CPU System for Deterministic Real-Time HDL Applications (Monday, February 16, 2026)
• DVB-S2 Modulator Available For Implementation From Global IP Core (Monday, February 16, 2026)
• We CAN! Now in XL (Thursday, February 12, 2026)
• VeriSilicon Enhanced ISP8200-FS Series IP Achieves ASIL B Functional Safety Certification (Monday, February 9, 2026)
• Omni Design Technologies Advances 200G-Class Co-Packaged Optics IP Portfolio for Next-Generation AI Infrastructure (Monday, February 9, 2026)
• Exclusive Interview: Mika Jäsberg Discusses CoreHW’s RTLS Offering (Monday, February 9, 2026)
• TES offers a programmable precision DC voltage amplifier IP for X-FAB’s XT018 technology (Thursday, February 5, 2026)
• Analogue Insight Safe Announces AISAFE Digital Noise Source IP for Scalable Performance Hardware Entropy Sources in ASICs (Thursday, February 5, 2026)
• IntoPIX And Cobalt Digital Enable Scalable, Low-Latency IPMX Video With JPEG XS TDC At ISE 2026 (Wednesday, February 4, 2026)
• Attopsemi Scales I-fuse® Technology to 7nm FinFET following 12nm Silicon Success (Wednesday, February 4, 2026)
• Semidynamics Unveils 3nm AI Inference Silicon and Full-Stack Systems (Tuesday, February 3, 2026)
• Arasan announces the immediate availability of the industries first xSPI NOR + eMMC NAND Combo PHY IP (Monday, February 2, 2026)
• Qualitas Semiconductor Secures Strategic IP Licensing Agreement for MIPI Solutions (Friday, January 30, 2026)
• TES is extending its PMU IP portfolio for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology. (Wednesday, January 28, 2026)
• Cadence Unwraps DSP IP Purpose-Built for Next-Gen Voice AI and Audio (Monday, January 26, 2026)
• LPDDR6 Has Arrived ! Innosilicon Technology Delivers LPDDR6 Subsystem IP to Leading Clients (Monday, January 26, 2026)
• YorChip and Sofics Expand UCIe PHY Across TSMC Nodes (Friday, January 23, 2026)
• 'ReRAM is the replacement for (NAND) flash': $170 billion US tech company backs tiny startup in race to find the holy Grail of universal memory (Thursday, January 22, 2026)
• Cadence Unveils Tensilica HiFi iQ DSP Purpose-Built for Next-Generation Voice AI and Audio Applications (Thursday, January 22, 2026)
• T2M Presents TGE200 RISC-V IP Core: Ultra-Low-Power for IoT & MCU Platforms (Monday, January 19, 2026)
• eMemory and PUFsecurity’s PUFPQC Achieves NIST FIPS 205 and SP 800-208 Certification, Reaching a Milestone in Comprehensive Post-Quantum Cryptography Protection (Friday, January 16, 2026)
• SST and UMC Announce Immediate Availability of 28nm SuperFlash® Gen 4 Automotive Grade 1 Platform (Friday, January 16, 2026)
• TES is introducing a new 10-bit SAR ADC IP for XFAB’s XT018 technology. (Thursday, January 15, 2026)
• Cadence Delivers Enterprise-Level Reliability with Next-Gen Low-Power DRAM for AI Applications Featuring Microsoft RAIDDR ECC Technology (Wednesday, January 14, 2026)
• MIPS S8200 Delivers Software-First RISC-V NPU To Enable Physical AI at the Autonomous Edge (Thursday, January 8, 2026)