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Artificial Intelligence News

• Rambus HBM3-Ready Memory Subsystem Advances AI/ML Performance (Sunday, August 22, 2021)
• Tech Investors Remain Bullish on AI Startups (Monday, August 16, 2021)
• Rambus Advances AI/ML Performance with 8.4 Gbps HBM3-Ready Memory Subsystem (Monday, August 16, 2021)
• BrainChip Receives Akida Chips from Socionext America (Monday, August 16, 2021)
• Akida spiking neural processor could head to FDSOI (Sunday, August 1, 2021)
• AI blockchain platform makes smart contracts intelligent (Sunday, August 1, 2021)
• Breakthrough in AI Cloud systems (Sunday, August 1, 2021)
• Mercury introduces industry-first heterogeneous processing module with integrated artificial intelligence functionality (Tuesday, July 27, 2021)
• JEDEC Publishes New and Updated Standards for Low Power Memory Devices Used in 5G and AI Applications (Tuesday, July 27, 2021)
• BrainChip Discusses AI's Positive Impact on the Human Condition with Public Interest Technology Advocate Katina Michael (Sunday, July 25, 2021)
• Adding Intelligence to the Grid (Tuesday, July 20, 2021)
• Innatera Unveils Neuromorphic AI Chip to Accelerate Spiking Networks (Tuesday, July 13, 2021)
• Winbond, Renesas accelerate building of embedded AI (Tuesday, July 6, 2021)
• LeapMind Acquires Patents for Extremely Low Bit Quantization Technology (Tuesday, June 22, 2021)
• Pre- to Post-AI Transition to Be "Bigger Than the Internet" (Tuesday, June 15, 2021)
• Xilinx Extends Edge Compute Leadership with World's Highest AI Performance-per-Watt (Wednesday, June 9, 2021)
• GUC Tapes Out AI/HPC/Networking Platform on TSMC CoWoS Technology Validating 7.2 Gbps HBM3 Controller and PHY, GLink-2.5D and 112G-LR SerDes IPs (Monday, June 7, 2021)
• Mythic Expands Product Lineup with New Scalable, Power-Efficient Analog Matrix Processor for Edge AI Applications (Monday, June 7, 2021)
• Edge AI Inferencing Opens Up New World of Opportunities (Thursday, May 27, 2021)
• Mirabilis Design and E-Elements Technology team up to provide concept-to-implementation design flow for AI applications (Wednesday, May 26, 2021)
• proteanTecs' UCT to be Exhibited at the TSMC 2021 Online Technology Symposiums for North America, Europe and Taiwan (Tuesday, May 25, 2021)
• Siemens expands Simcenter with AI-driven generative engineering for systems architectures (Tuesday, May 25, 2021)
• Lattice sensAI Solution Stack Simplifies Deployment of AI/ML Models on Smart Edge Devices (Tuesday, May 25, 2021)
• BrainChip highlights its Akida Neural Processor at AI Field Day 2 (Monday, May 24, 2021)
• AI Driving Renewed Interest in Processing-in-Memory (Monday, May 24, 2021)
• Gyrfalcon Showcases AI-X at 2021 Embedded Vision Summit (Wednesday, May 19, 2021)
• Chips&Media Making its Presence at the 2021 Embedded Vision Summit as an Exhibitor (Wednesday, May 19, 2021)
• 48-V Power Architecture for Next-Gen AI Processors (Monday, May 17, 2021)
• Dialog Semiconductor Adds AI, Data Analytics Partners to SmartServer Ecosystem (Tuesday, May 11, 2021)
• BrainChip Demonstrates Akida Neuromorphic Processor as Part of Data Science Week (Monday, May 10, 2021)
• Esperanto Technologies Adopts Movellus Maestro AI, Intelligent Clock Networks for Its ET-SoC-1 Chip (Monday, May 3, 2021)
• Pinnacle Imaging Systems Announces Denali 3.0 Soft ISP & HDR Sensor Module for New Xilinx Kria SOM Platform and Vision AI Starter Kit (Tuesday, April 20, 2021)
• Xilinx Introduces Kria Portfolio of Adaptive System-on-Modules for Accelerating Innovation and AI Applications at the Edge (Monday, April 19, 2021)
• Aspinity Expands into Audio Event Detection (Thursday, April 15, 2021)
• BrainChip Begins Volume Production of Akida AI Processor (Tuesday, April 13, 2021)
• Cloudera collaborates with NVIDIA to accelerate data analytics and AI in the cloud (Monday, April 12, 2021)
• OpenFive Tapes Out SoC for Advanced HPC/AI Solutions on TSMC 5nm Technology (Monday, April 12, 2021)
• Arm's solution to the future needs of AI, security and specialized computing is v9 (Tuesday, March 30, 2021)
• ReRAM Machine Learning Embraces Variability (Monday, March 29, 2021)
• CEVA Unveils MotionEngine Scout, a Highly-Accurate Dead Reckoning Software Solution for Indoor Autonomous Robots (Tuesday, March 23, 2021)
• GLOBALFOUNDRIES and Cadence Add Machine Learning Capabilities to DFM Signoff for GF's Most Advanced FinFET Solutions (Tuesday, March 23, 2021)
• AI Drives Memory Interconnect Evolution (Wednesday, March 10, 2021)
• https://www.eetimes.com/ai-drives-memory-interconnect-evolution (Wednesday, March 10, 2021)
• Eta Compute's Low Power AI Vision Board Accelerates Design, Test, and Deployment of Transformative Embedded Vision Solutions (Tuesday, March 9, 2021)
• Synopsys ARC EV Processor Enables Kyocera Document Solutions to Launch AI-enabled Multifunctional Printer SoC (Monday, March 8, 2021)
• BrainChip's Success in 2020 Advances Fields of On-Chip Learning and Ultra-Low Power Edge AI (Wednesday, March 3, 2021)
• BrainChip's Success in 2020 Advances Fields of On-Chip Learning and Ultra-Low Power Edge AI (Tuesday, March 2, 2021)
• CMC Microsystems and Deeplite seek to advance AI R&D (Tuesday, February 23, 2021)
• Andes Technology and Rambus Collaborate to offer Secure Solution for MCU and IoT Applications (Tuesday, February 23, 2021)
• Khronos and EMVA Collaborate to Gather Requirements for Embedded Camera and Sensor API Standards (Sunday, February 21, 2021)