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Artificial Intelligence News

• Syntiant Adopts Movellus' Clock Network for its Low-Power NDP120 Deep Learning Processor (Sunday, February 21, 2021)
• Enabling AI Vision at the Edge (Wednesday, February 17, 2021)
• Samsung Develops Industry's First High Bandwidth Memory with AI Processing Power (Tuesday, February 16, 2021)
• LeapMind Announces Participation in Alliance Program of Xilinx, a Major US FPGA Innovator (Monday, February 1, 2021)
• Imagination IP in Chinese AI integration (Sunday, January 31, 2021)
• Patent report highlights AI boom (Tuesday, January 26, 2021)
• Edge AI SoC for smart tiny devices (Tuesday, January 26, 2021)
• Flex Logix Pairs its InferX X1 AI Inference Accelerator with the High-Bandwidth Winbond 4Gb LPDDR4X Chip to Set a New Benchmark in Edge AI Performance (Tuesday, January 26, 2021)
• Edge AI company AlphaICs raises $8 million in funding round led by Emerald Technology Ventures and Endiya Partners (Monday, January 25, 2021)
• Nordic Development Kit provides easy access to AI and ML (Tuesday, January 19, 2021)
• CEA-Leti Reports Machine-Learning Breakthrough That Opens Way to Edge Learning (Monday, January 18, 2021)
• Renesas Launches New General-Purpose 64-Bit RZ/G2L Group of MPUs with Latest Arm Cortex-A55 for Improved AI Processing (Monday, January 18, 2021)
• Syntiant Surpasses Milestone of 10 Million Processors Shipped (Tuesday, January 12, 2021)
• CEVA Extends its Leadership in High Performance Scalable Sensor Hub DSPs with 2nd Generation SensPro Family (Monday, January 11, 2021)
• Arteris IP FlexNoc Interconnect and Resilience Package Licensed by Hailo for Artificial Intelligence (AI) Chip (Monday, January 11, 2021)
• Synopsys and Socionext Expand Collaboration to Deploy HBM2E IP for 5-Nanometer Process in AI and High-Performance Computing SoCs (Monday, January 11, 2021)
• Ambarella introduces CV5 high performance AI vision processor for single 8K and multi-imager AI cameras (Sunday, January 10, 2021)
• Official Commercial Launch of Efficiera Ultra-Low Power AI Inference Accelerator IP Core (Sunday, January 10, 2021)
• Edge AI: Energy-saving "building blocks" for smart end devices (Sunday, January 3, 2021)
• United States, Europe and China Leading AI Development (Wednesday, December 23, 2020)
• AIStorm Raises $16M in Oversubscribed Series B Funding to Commercialize AI-in-Sensor Chips (Tuesday, December 15, 2020)
• Platform combines low-power SoC with energy-efficient AI software (Monday, December 14, 2020)
• BrainChip Ships Akida Evaluation Boards (Tuesday, December 8, 2020)
• RISC-V for ultra-low power processing and AI on the edge (Wednesday, December 2, 2020)
• Faster, Smaller and More Accurate Edge AI Using Deeplite and Andes Technology Software + Hardware (Wednesday, December 2, 2020)
• BrainChip Confirms Completion of the Akida Production Design (Wednesday, December 2, 2020)
• Alibaba-Backed Media AI Firm Finds Innovative Applications (Wednesday, December 2, 2020)
• Infineon to set up global AI hub in Singapore (Monday, November 30, 2020)
• The Growing Market for Specialized Artificial Intelligence IP in SoCs (Wednesday, November 25, 2020)
• SK Telecom develops AI processor (Tuesday, November 24, 2020)
• Gyrfalcon Launches AI-X: Full-Stack Solution for Edge-AI Development (Tuesday, November 24, 2020)
• AI Accelerator Targets Video Analytics at the Edge (Sunday, November 22, 2020)
• AI Startup Deep Vision Powers AI Innovation at the Edge (Wednesday, November 18, 2020)
• 18 New AI Startups in France in 2020 vs. 120 in 2019 (Tuesday, November 17, 2020)
• SiMa.ai Adopts Arm Technology to Deliver a Purpose-built Heterogeneous Machine Learning Compute Platform for the Embedded Edge (Tuesday, November 17, 2020)
• Introducing new Arm Roadmap Guarantee and other Arm IoT initiatives for accelerating Endpoint AI (Tuesday, November 17, 2020)
• How AI Impacts Memory & Interconnect Technology (Tuesday, November 3, 2020)
• NeuLinker Licenses Codasip Bk5 and Studio for Powering Innovative AI and Blockchain Solutions (Monday, November 2, 2020)
• Inaccel announces record-breaking speed on facial detection test using an FPGA cluster (Monday, November 2, 2020)
• Samsung and VeriSilicon Enable Blaize to Meet Aggressive Time-to-Market Goals for New AI Edge Processor (Tuesday, October 27, 2020)
• Flex Logix Announces Availability and Roadmap of InferX X1 Boards and Software Tools (Tuesday, October 27, 2020)
• Synopsys Helps Advance IBM's Vision of 1,000 Times Improvement in AI Compute Performance during the Coming Decade (Wednesday, October 21, 2020)
• Tenstorrent achieves best-in-class PPA and First-Pass Silicon Success for Datacenter AI Processor SoC with INVECAS advanced ASIC engineering capabilities (Tuesday, October 20, 2020)
• Sequitur Labs Joins NVIDIA Partner Network to Protect Critical IP at the Edge (Monday, October 19, 2020)
• Flex Logix Announces Working Silicon Of Fastest And Most Efficient AI Edge Inference Chip (Monday, October 19, 2020)
• Xilinx and Spline.AI Develop X-Ray Classification Deep-Learning Model and Reference Design on AWS (Wednesday, October 14, 2020)
• Synopsys and SiMa.ai Collaborate to Bring Machine Learning Inference at Scale to the Embedded Edge (Tuesday, October 13, 2020)
• South Korea pushes for AI semiconductors as global demand grows (Monday, October 12, 2020)
• OPENEDGES AI Accelerator (NPU) & Memory Subsystem IP licensed for Eyenix AI-powered surveillance camera chipset (Monday, October 12, 2020)
• AI Requires Tailored DRAM Solutions: Part 3 (Monday, October 5, 2020)