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Artificial Intelligence News

• GlobalData: China Emerges as Powerhouse for AI Unicorns (Monday, October 25, 2021)
• videantis processing platform reduces cost, increases flexibility of fail-operational systems (Sunday, October 24, 2021)
• Flex Logix Announces Production Availability Of InferX X1 PCIe Boards for Edge AI Systems (Wednesday, October 20, 2021)
• BrainChip Begins Taking Orders of Akida AI Processor Development Kits (Wednesday, October 20, 2021)
• Defacto enables ETRI to Automate IP Integration and Build Complex AI Chips (Sunday, October 17, 2021)
• EdgeCortix Acquires Multiple Patents for Dynamic Neural Accelerator AI Processor Technology (Monday, October 4, 2021)
• LeapMind Announces the Beta Release of their Ultra-low Power Consumption AI Inference Accelerator IP (Monday, October 4, 2021)
• Innatera's Neuromorphic AI Chip to Accelerate Spiking Neural Networks (Sunday, September 26, 2021)
• NXP teams for Tensilica's latest AI cores (Monday, September 13, 2021)
• Cadence Accelerates Intelligent SoC Development with Comprehensive On-Device Tensilica AI Platform (Sunday, September 12, 2021)
• S.Korea kicks off AI strategy talks with Naver, Kakao, Samsung, telcos (Tuesday, September 7, 2021)
• Flex Logix to speak at the 2021 AI Hardware Summit on Optimizing AI Inference Performance (Tuesday, September 7, 2021)
• BSC executes, for the first time, big encrypted neural networks using Intel Optane Persistent Memory and Intel Xeon Scalable Processors (Wednesday, September 1, 2021)
• Viewpoint: How AI is changing the way we think about memory (Tuesday, August 31, 2021)
• Can AI Design a Better Chip Than a Human? (Thursday, August 26, 2021)
• Can AI Design a Better Chip Than a Human? (Wednesday, August 25, 2021)
• Flex Logix Appoints Lee Leibig As Vice President Of Sales For AI Inference (Tuesday, August 24, 2021)
• Brainchip looks at transfer and incremental learning - which is more efficient? (Tuesday, August 24, 2021)
• Rambus Preps for HBM3 (Monday, August 23, 2021)
• Samsung HBM-PIM AI accelerator converges logic and memory (Monday, August 23, 2021)
• Rambus Preps for HBM3 (Monday, August 23, 2021)
• Rambus HBM3-Ready Memory Subsystem Advances AI/ML Performance (Sunday, August 22, 2021)
• Tech Investors Remain Bullish on AI Startups (Monday, August 16, 2021)
• Rambus Advances AI/ML Performance with 8.4 Gbps HBM3-Ready Memory Subsystem (Monday, August 16, 2021)
• BrainChip Receives Akida Chips from Socionext America (Monday, August 16, 2021)
• Akida spiking neural processor could head to FDSOI (Sunday, August 1, 2021)
• AI blockchain platform makes smart contracts intelligent (Sunday, August 1, 2021)
• Breakthrough in AI Cloud systems (Sunday, August 1, 2021)
• Mercury introduces industry-first heterogeneous processing module with integrated artificial intelligence functionality (Tuesday, July 27, 2021)
• JEDEC Publishes New and Updated Standards for Low Power Memory Devices Used in 5G and AI Applications (Tuesday, July 27, 2021)
• BrainChip Discusses AI's Positive Impact on the Human Condition with Public Interest Technology Advocate Katina Michael (Sunday, July 25, 2021)
• Adding Intelligence to the Grid (Tuesday, July 20, 2021)
• Innatera Unveils Neuromorphic AI Chip to Accelerate Spiking Networks (Tuesday, July 13, 2021)
• Winbond, Renesas accelerate building of embedded AI (Tuesday, July 6, 2021)
• LeapMind Acquires Patents for Extremely Low Bit Quantization Technology (Tuesday, June 22, 2021)
• Pre- to Post-AI Transition to Be "Bigger Than the Internet" (Tuesday, June 15, 2021)
• Xilinx Extends Edge Compute Leadership with World's Highest AI Performance-per-Watt (Wednesday, June 9, 2021)
• GUC Tapes Out AI/HPC/Networking Platform on TSMC CoWoS Technology Validating 7.2 Gbps HBM3 Controller and PHY, GLink-2.5D and 112G-LR SerDes IPs (Monday, June 7, 2021)
• Mythic Expands Product Lineup with New Scalable, Power-Efficient Analog Matrix Processor for Edge AI Applications (Monday, June 7, 2021)
• Edge AI Inferencing Opens Up New World of Opportunities (Thursday, May 27, 2021)
• Mirabilis Design and E-Elements Technology team up to provide concept-to-implementation design flow for AI applications (Wednesday, May 26, 2021)
• proteanTecs' UCT to be Exhibited at the TSMC 2021 Online Technology Symposiums for North America, Europe and Taiwan (Tuesday, May 25, 2021)
• Siemens expands Simcenter with AI-driven generative engineering for systems architectures (Tuesday, May 25, 2021)
• Lattice sensAI Solution Stack Simplifies Deployment of AI/ML Models on Smart Edge Devices (Tuesday, May 25, 2021)
• BrainChip highlights its Akida Neural Processor at AI Field Day 2 (Monday, May 24, 2021)
• AI Driving Renewed Interest in Processing-in-Memory (Monday, May 24, 2021)
• Gyrfalcon Showcases AI-X at 2021 Embedded Vision Summit (Wednesday, May 19, 2021)
• Chips&Media Making its Presence at the 2021 Embedded Vision Summit as an Exhibitor (Wednesday, May 19, 2021)
• 48-V Power Architecture for Next-Gen AI Processors (Monday, May 17, 2021)
• Dialog Semiconductor Adds AI, Data Analytics Partners to SmartServer Ecosystem (Tuesday, May 11, 2021)