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• Synopsys Advances Silicon Lifecycle Management to Accelerate Data Transport and Significantly Reduce Test Time (Monday, September 26, 2022)
• Siemens automates 2.5D and 3D IC design-for-test with new Tessent Multi die solution (Sunday, September 25, 2022)
• CXL Spec Grows, Absorbs Others to Collate Ecosystem (Sunday, September 25, 2022)
• Split manufacturing for trustworthy electronics (Wednesday, September 21, 2022)
• Agile Analog launches new Digital Standard Cell Library (Tuesday, September 20, 2022)
• Synopsys Unveils Industry's First Unified Emulation and Prototyping System Addressing Verification Requirements Across the Chip Development Cycle (Monday, September 19, 2022)
• QuantWare awarded subsidy from Quantum Delta NL for €1.1M project to develop the use of novel materials in superconducting quantum processors (Thursday, September 15, 2022)
• Tachyum Enters QA Testing for Prodigy Universal Processor with New EDA Supplier (Wednesday, September 14, 2022)
• NIST and Google to Create New Supply of Chips for Researchers and Tech Startups (Wednesday, September 14, 2022)
• VeriSilicon Announces the One-Stop VeriHealth Chip Design Platform for Smart Healthcare Applications (Tuesday, September 13, 2022)
• Spreading the Quantum Knowledge (Monday, September 12, 2022)
• Brite Semiconductor Provides USB IP Total Solution (Thursday, September 8, 2022)
• Making chip design easy (Monday, September 5, 2022)
• Alphawave Adopts Diakopto's PrimeX™ as Top-Level EM/IR Signoff Methodology for 5nm and 3nm Technologies (Monday, September 5, 2022)
• Sondrel complements its Architecting the Future IP platforms with pre-packaged supply chains for reduced risk (Monday, September 5, 2022)
• Sonical partners with Dolphin Design to build the future of hearables (Sunday, September 4, 2022)
• USB Promoter Group Announces USB4® Version 2.0 (Thursday, September 1, 2022)
• Siemens introduces Questa Verification IP solution support for the new CXL 3.0 protocol (Monday, August 29, 2022)
• SiMa.ai Achieves First Silicon Success with Synopsys Solutions, Launching the Industry's Most Power-Efficient MLSoC Platform for the Embedded Edge (Monday, August 29, 2022)
• Semico Research Concludes proteanTecs Deep Data Analytics Gives SoC Manufacturers a Six-Month Time-to-Market Advantage with Significant Savings (Sunday, August 28, 2022)
• CXL™ Consortium and JEDEC® Sign MOU Agreement to Advance DRAM and Persistent Memory Technology (Wednesday, August 24, 2022)
• Augment your Peripheral slot's performance with the Low Power and High Throughput PCIe 4.0 PHY IP Cores in 12FFC with matching PCIe 4.0 Controller IP Cores (Sunday, August 21, 2022)
• Diakopto Unveils PrimeX™ - Revolutionary EDA Solution for Top-Hierarchy Power Grid and Signal Net EM/IR (Sunday, August 21, 2022)
• JEDEC Updates Universal Flash Storage (UFS) and Supporting Memory Interface Standard (Wednesday, August 17, 2022)
• Efinix Low Power, Small Footprint FPGA Selected for SPRESENSE Development Platform (Tuesday, August 16, 2022)
• Truechip Announces First Customer Shipment of CXL 3 Verification IP and CXL Switch Model (Thursday, August 11, 2022)
• Arasan refreshes its Total USB IP Solution with its next generation of USB 2.0 PHY IP (Wednesday, August 10, 2022)
• Siemens selected by Microsoft for Rapid Assured Microelectronics Prototypes (RAMP) Program (Tuesday, August 9, 2022)
• Space Codesign Systems joins Siemens Digital Industries Software Solution Partner Program as a Software and Technology Partner (Sunday, August 7, 2022)
• Enhance your SD Card experience by integrating SD 4.1 UHS-II PHY IP Core to achieve Ultra High Speeds (Sunday, August 7, 2022)
• Cadence Accelerates Hyperscale SoC Design with Industry's First Verification IP and System VIP for CXL 3.0 (Thursday, August 4, 2022)
• Cadence Library Characterization Solution Accelerates Delivery and Enhances Quality of Arm Memory Products (Wednesday, August 3, 2022)
• UCIe™ (Universal Chiplet Interconnect Express™) Consortium Announces Incorporation and New Board Members; Open for Membership (Tuesday, August 2, 2022)
• CXL Consortium Releases Compute Express Link 3.0 Specification to Expand Fabric Capabilities and Management (Tuesday, August 2, 2022)
• Accellera Announces Proposed Working Group to Explore Clock Domain Crossing Standard (Tuesday, August 2, 2022)
• Mobiveil and Avery Design Systems Extend Partnership to Accelerate Design and Verification of NVMe 2.0-Enabled SSD Development (Monday, August 1, 2022)
• CXL Consortium and OpenCAPI Consortium Sign Letter of Intent to Transfer OpenCAPI Specifications to CXL (Monday, August 1, 2022)
• Avery Design Announces CXL 3.0 VIP (Monday, August 1, 2022)
• Avery Design Systems Verification IP Helps Solid State Storage Controller Startup Validate its Designs and Get to Market Faster (Sunday, July 31, 2022)
• Faraday Unveiled FPGA-Go-ASIC Prototyping Platform to Accelerate FPGA-to-ASIC Conversion (Wednesday, July 27, 2022)
• MIPI UniPro v2.0 Doubles Peak Data Rate and Delivers Greater Throughput and Reduced Latency for Flash Memory Storage Applications (Tuesday, July 26, 2022)
• CFX announces commercial availability of anti-fuse OTP technology on 55nm CIS process (Sunday, July 24, 2022)
• Vidatronic Expands FinFET Portfolio with 7 nm to 4 nm FlexGUARD™ and Power Quencher® Intellectual Properties (IPs) Available for Licensing (Monday, July 18, 2022)
• In-house software team provides Sondrel with a key advantage for its turnkey ASIC service of turning concept into silicon (Monday, July 18, 2022)
• MIPI RFFE Master & Slave Controller IP Cores to control your complex RF-Front End Interfaces (Sunday, July 17, 2022)
• 10Gbps！The fastest LPDDR5/5X IP deliver production ! (Sunday, July 17, 2022)
• Siemens' Calibre platform expands early design verification solutions (Tuesday, July 12, 2022)
• Dutch Startup on the Way to Make Quantum Photonic Processors Real (Monday, July 11, 2022)
• Truechip Introduces Automation Products - NoC Verification and NoC Performance - for Revolutionizing the Verification Spectrum (Monday, July 11, 2022)
• Siemens' state-of-the-art Symphony Pro platform expands mixed signal IC verification capabilities (Sunday, July 10, 2022)