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• Research for the future, application transfer for the present (Sunday, November 3, 2024)
• Faraday Unveils HiSpeedKit?-HS Platform for High-speed Interface IP Verification in SoCs (Tuesday, October 29, 2024)
• Siemens and CELUS collaborate to empower SMBs with AI-powered PCB design (Monday, October 28, 2024)
• Keysight collaborates with Siemens EDA enabling next generation of wireless design (Monday, October 21, 2024)
• EnSilica plc - Award of £2 million Controller ASIC Design Services Contract (Sunday, October 20, 2024)
• Successful tape out of Chip Interfaces' JESD204D IP by a tier 1 semiconductor company (Tuesday, October 15, 2024)
• Agile Analog announces MoU to support new Southern Taiwan IC Design Industry (Monday, October 14, 2024)
• Siemens Updates Simcenter Testlab for Advanced Manufacturers (Sunday, October 13, 2024)
• SensiML Expands Platform Support to Include the RISC-V Architecture (Wednesday, October 9, 2024)
• Boosting Efficiency and Reducing Costs: Silvaco's Approach to Semiconductor Fabrication (Monday, October 7, 2024)
• South Korean AI IC Design Companies Shifting to Dual-Foundry Model with Both Samsung and TSMC (Thursday, October 3, 2024)
• Faraday Enhances 3D-IC Design Service with Ansys Multiphysics Analysis (Tuesday, October 1, 2024)
• Siemens brings industry leading Capital electrical and electronic systems design software to the cloud as a service (Sunday, September 29, 2024)
• SIAE Microelettronica Selects Ensilica as Key Partner to Design ASICs for Next-Generation Telecom Equipment (Wednesday, September 25, 2024)
• Boosting Efficiency and Reducing Costs: SilvacoÂ’s Approach to Semiconductor Fabrication (Tuesday, September 24, 2024)
• Silvaco Expands its Victory TCAD and Digital Twin Modeling Platform to Planar CMOS, FinFET and Advanced CMOS Technologies (Tuesday, September 24, 2024)
• SigmaSense Teams Up with Dolphin Design to Deliver Power Efficiency in their Advanced SDC300 Touch Controller (Monday, September 23, 2024)
• RAAAM Memory Technologies and NXP Semiconductors Announce Collaboration to Implement High Density On-Chip Memory (Sunday, September 22, 2024)
• Comcores and Extoll successfully completed the interoperability test of Comcores JESD204C IP core and Extoll SerDes PHY (Sunday, September 22, 2024)
• Analog Bits to Demonstrate Numerous Test Chips Including Portfolio of Power Management and Embedded Clocking and High Accuracy Sensor IP in TSMC N3P Process at TSMC 2024 North America Technology Symposium (Sunday, September 22, 2024)
• Siemens brings industry leading Capital electrical and electronic systems design software to the cloud as a service (Friday, August 30, 2024)
• Technology combinations for complex chip (Friday, August 30, 2024)
• Silvaco's Fab Technology Co-Optimization (FTCO): From Atoms to Systems (Tuesday, August 20, 2024)
• Welcome to Silicon-to-Systems Space (Where No One Can Hear You Scream) (Thursday, August 15, 2024)
• AutoChips integrated multiple VeriSilicon's IPs in its intelligent cockpit domain control SoC (Wednesday, August 14, 2024)
• BAE Systems Partners with Siemens for Industry 4.0 Revolution (Tuesday, July 30, 2024)
• Tessolve partners with SigmaSense to develop their innovative DSP-based sensing ASIC (Monday, July 29, 2024)
• Imec achieves record-low charge noise for Si MOS quantum dots fabricated on a 300mm CMOS platform (Wednesday, July 24, 2024)
• C-DAC partners with MosChip and Socionext for design of HPC Processor AUM based on Arm architecture (Monday, July 1, 2024)
• Creating a Center of Excellence for IC Design (Sunday, June 30, 2024)
• EDA Companies Unite With Samsung for AI and 3D IC Technology (Saturday, June 29, 2024)
• Siemens introduces Innovator3D IC - a comprehensive multiphysics cockpit for 3D IC design, verification and manufacturing (Monday, June 24, 2024)
• Siemens gets certification for Solido SPICE on Intel nodes, and adds EMIB (Monday, June 24, 2024)
• True Circuits Introduces the JSPICE™ Design Environment (JDE™) at the Design Automation Conference (Sunday, June 23, 2024)
• lowRISC and Microsoft Collaborate to Help Bring the Revolutionary CHERIoT-Ibex Core to Production Grade (Wednesday, June 19, 2024)
• Alphawave Semi to Showcase Next-Generation PCIe® 7.0 IP Platform for High-Performance Connectivity and Compute at PCI-SIG® DevCon 2024 (Tuesday, June 11, 2024)
• Sondrel offers leading edge chip design teams (Sunday, June 9, 2024)
• Efabless Welcomes Weebit Nano's ReRAM to Its Custom Chip Design Platform (Thursday, June 6, 2024)
• Mobiveil's PSRAM Controller IP Lets SoC Designers fully Leverage AP Memory's Ultra High Speed (UHS) PSRAM Memory (Thursday, June 6, 2024)
• Sigasi Redefines Chip Design Creation, Integration, Validation Leveraging Shift-Left Principles (Thursday, June 6, 2024)
• Siemens announces breakthroughs in high-level verification of C++ (Wednesday, June 5, 2024)
• Frontgrade Technologies Selected by MDA Space as Part of MDA AURORA™ Supply Chain (Monday, June 3, 2024)
• UK digital twin leader joins Siemens Xcelerator (Monday, June 3, 2024)
• SureCore announces low power cryogenic memory technology that could help dramatically cut data centre power usage (Monday, June 3, 2024)
• New LZ4 & Snappy IP Core from CAST Enables Fast Lossless Data Decompression (Monday, June 3, 2024)
• Silicon-Proven 14-Bit 4.32 GSps Wide Band ADC IP core Time-Interleaved Pipeline Solution Now Available for Whitebox Licensing with No Royalty (Sunday, June 2, 2024)
• Startup offers low-cost neuromorphic quantum computing (Thursday, May 30, 2024)
• OPENEDGES' Memory Subsystem IPs Selected by ASICLAND for Next-gen AI Applications (Thursday, May 30, 2024)
• MerlinTPS Partners with Bluespec to Provide Urgently Needed GPS Augmentation and Backup Without Satellites (Sunday, May 26, 2024)
• Dolphin Design teams up with Raspberry Pi for advanced chip power management (Sunday, May 26, 2024)