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Design Platform and Service News

• PrimisAI Unveils Premium Version of RapidGPT, Redefining Hardware Engineering (Wednesday, March 13, 2024)
• HBM3 Initially Exclusively Supplied by SK Hynix, Samsung Rallies Fast After AMD Validation, Says TrendForce (Tuesday, March 12, 2024)
• Arasan proudly releases its Radiation Hardened NAND Flash IP (Tuesday, March 12, 2024)
• Pasqal aims for 10,000 qbit quantum computer in 2026 (Monday, March 11, 2024)
• Cold Spin-Electronics for Quantum Technologies (Monday, March 11, 2024)
• Agile Analog delivers first full always-on IP subsystem (Monday, March 11, 2024)
• Omni Design Technologies Offers Swift™ Data Converters for Advanced Software Defined Radio (SDR) Solutions (Sunday, March 10, 2024)
• OPENEDGES and SEMIFIVE Partnership Reinforce the SoC Platform (Sunday, March 10, 2024)
• CAST Adds I3C Secondary Controller Core to MIPI IP Product Line (Thursday, March 7, 2024)
• nepes corporation expands IC packaging capabilities for the 3D-IC era with advanced design flows from Siemens (Wednesday, March 6, 2024)
• Marvell Announces Industry's First 2nm Platform for Accelerated Infrastructure Silicon (Wednesday, March 6, 2024)
• SignatureIP announces PCIe Gen 6 Controller IP (Wednesday, March 6, 2024)
• JEDEC Publishes GDDR7 Graphics Memory Standard (Tuesday, March 5, 2024)
• The promise of OTS-only memories for next-gen compute (Monday, March 4, 2024)
• Accellera Approves Verilog-AMS 2023 Standard for Release (Sunday, March 3, 2024)
• Agnisys to Showcase Expertise at DVCon US with Exclusive Short Workshop and Tutorial Sessions (Sunday, March 3, 2024)
• Unleash Next-Gen Speeds with Silicon-Proven USB 3.0 PHY IP Cores with Type-C Support in Multiple Process Nodes (Sunday, March 3, 2024)
• Interview: Mahesh Tirupattur, executive VP of Analog Bits - "Be Passionate, Fail Fast and Recover Quick" (Sunday, March 3, 2024)
• Agile Analog's Christelle Faucon: "Diversity and Equality Are Critical" (Sunday, March 3, 2024)
• ADTechnology and CoSignOn/CoreLink Sign MOU to Further Collaborate on High-Bandwidth Memory for Next-Generation HPC (Thursday, February 29, 2024)
• Sondrel announces two new design contract wins plus two existing Design Consultancy contracts extended (Thursday, February 29, 2024)
• Synopsys Launches Industry's First Complete 1.6T Ethernet IP Solution to Meet High Bandwidth Needs of AI and Hyperscale Data Center Chips (Wednesday, February 28, 2024)
• Bright minds wanted for chip design in Europe (Monday, February 26, 2024)
• LX Semicon Enters Mass Production with OPENEDGES' 22nm LPDDR4 PHY IP (Monday, February 26, 2024)
• Quantum Computing Insights: Exploring the Latest Breakthroughs (Sunday, February 25, 2024)
• Renesas Develops Embedded MRAM Macro that Achieves over 200MHz Fast Random-Read Access and a 10.4 MB/s Fast Write Throughput for High Performance MCUs (Sunday, February 25, 2024)
• M31 Powers Intel's IFS Alliance to Promote Advanced SoC Development and Innovation (Sunday, February 25, 2024)
• Arm Updates CSS Designs for Hyperscalers' Custom Chips (Wednesday, February 21, 2024)
• M31 Promotes Advanced SoC Development and Innovation at Intel Foundry's Direct Connect Event (Wednesday, February 21, 2024)
• Weebit Nano demonstrates performance of its ReRAM under extended automotive conditions (Wednesday, February 21, 2024)
• Vervesemi launches Made-in-India semiconductor ASIC (Tuesday, February 20, 2024)
• Taiwan's 5-Bit Superconducting Quantum Computer Goes Online (Tuesday, February 20, 2024)
• Siemens' breakthrough Veloce CS transforms emulation and prototyping with three novel products (Tuesday, February 20, 2024)
• Analog Bits Expands Engineering Presence by Opening a Design Center in Europe (Tuesday, February 20, 2024)
• T2M-IP Unveils the 12-bit 4Gsps ADC Silicon-Proven IP Core with Cutting-Edge Features, Silicon Proven and Ready to License (Monday, February 19, 2024)
• M31 Launches PCI-SIG Certified PCIe 5.0 PHY IP, Partnering with SSD Storage Chipmaker InnoGrit to Advance the Next-Generation PCIe 5.0 (Monday, February 19, 2024)
• IAR unveils Functional Safety version of IAR Embedded Workbench for Arm equipped with certified static analysis capabilities (Monday, February 19, 2024)
• Imec launches the first design pathfinding process design kit for N2 node (Sunday, February 18, 2024)
• Quantum Experts discuss next Digital Revolution (Thursday, February 15, 2024)
• Arm CSA and AMBA release provide boost for chiplet ecosystem (Thursday, February 15, 2024)
• Thalia releases AMALIA 24.1 with support for 12nm FinFET, porting simulation comparisons and streamlined technology analysis reporting (Wednesday, February 14, 2024)
• AccelerComm® Joins Open Compute Project Foundation Focusing on Evenstar Modular Open RAN Radio Unit Reference Design (Wednesday, February 14, 2024)
• ARM bids for chiplet dominance (Tuesday, February 13, 2024)
• zeroRISC, Nuvoton and Winbond Join Forces to Deliver the First Commercial Product Based on the OpenTitan® Open-Source Secure Silicon Platform (Tuesday, February 13, 2024)
• OpenTitan® Partnership Makes History as First Open-Source Silicon Project to Reach Commercial Availability (Tuesday, February 13, 2024)
• What Role Will Open-Source Development Play in Quantum Computing? (Monday, February 12, 2024)
• Cadence and Dassault Systemes Unveil the First Cloud-Enabled, Collaborative Experience to Transform the Development of Electromechanical Systems (Sunday, February 11, 2024)
• The next frontier in semiconductor innovation: Chiplets and the rise of 3D-ICs (Sunday, February 11, 2024)
• T2M is excited to announce the successful licensing of our partner's Silicon-Proven 1G Ethernet PHY IP Cores on a Tier-1 Foundry in Korea, using the advanced 14LPP process, in collaboration with a leading Tier-1 Korean customer (Sunday, February 11, 2024)
• Siemens brings the power of multi-discipline simulation to axial flux motor development for next-generation EVs (Monday, February 5, 2024)