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Foundry News

• Foundry Freedom: AMD Loosens Wafer Agreement With GlobalFoundries (Thursday, May 13, 2021)
• Dissecting the New Fab Plans (Tuesday, May 11, 2021)
• UMC to Expand 300mm Fab Capacity in Tainan (Monday, May 10, 2021)
• TSMC April sales down over 13% from March (Sunday, May 9, 2021)
• GlobalFoundries Sharpens Photonics Edge for Quantum Manufacturing (Thursday, May 6, 2021)
• TSMC prioritizes automotive chip supply to ease shortage (Tuesday, May 4, 2021)
• PsiQuantum and GLOBALFOUNDRIES to Build the World's First Full-scale Quantum Computer (Tuesday, May 4, 2021)
• Cadence Wins Four 2020 Samsung Foundry SAFE EDA Awards (Tuesday, May 4, 2021)
• Intel to put $3.5bn into packaging (Monday, May 3, 2021)
• UMC taps customers for $3.5bn fab expansion (Sunday, May 2, 2021)
• Intel CEO Pat Gelsinger Seeks Support for EU Foundries (Thursday, April 29, 2021)
• China on way to self reliance in 28-nm chips; to attain maturity in 14-mm category as well (Thursday, April 29, 2021)
• TSMC Update: 2nm in Development, 3nm and 4nm on Track for 2022 (Sunday, April 25, 2021)
• Rambus Expands High-Performance Memory Subsystem Offerings with HBM2E Solution on Samsung 14/11nm (Wednesday, April 21, 2021)
• proteanTecs Joins TSMC IP Alliance Program (Monday, April 19, 2021)
• TSMC certifies Aprisa place-and-route solution from Siemens on TSMC's N6 process (Monday, April 19, 2021)
• Optimizing Package System Integration Maximizes System Performance (Wednesday, March 31, 2021)
• SMIC Profit Up 43.3% In 2020 But Growth Uncertainty Lingers (Wednesday, March 31, 2021)
• TSMC head says drive to onshore chip supply chain is 'unrealistic' (Monday, March 29, 2021)
• Insights on Intel's Standalone Foundry Business (Sunday, March 28, 2021)
• Intel Investing $20B in Building Foundry Business (Wednesday, March 24, 2021)
• Europe Aiming for Manufacturing Capacities for 2nm (Monday, March 22, 2021)
• Will Fan-Out Wafer-Level Packaging Keep Moore's Law Valid? (Sunday, March 21, 2021)
• Samsung, TSMC Spending to Dominate Advanced IC Technology Nodes (Thursday, March 18, 2021)
• SMIC and Shenzhen government to invest $2.35 billion to build new foundry in China (Wednesday, March 17, 2021)
• Advanced Nodes Boosting Foundry Revenues (Wednesday, March 17, 2021)
• US$150 billion needed in 5 years to catch up with TSMC: IC Insights (Tuesday, March 16, 2021)
• Samsung and TSMC Seeking to Spend Their Way to Worldwide Domination of Advanced IC Technology (Tuesday, March 16, 2021)
• Hsinchu Baoshan R&D center to work on 3nm process: TSMC (Monday, March 8, 2021)
• TSMC together with Apple are developing 2nm process technology (Monday, March 8, 2021)
• GLOBALFOUNDRIES 22FDX RF Solution Provides the Basis for Next-Gen mmWave Automotive Radar (Monday, March 8, 2021)
• TSMC Ranks in Top-10 For Capacity in Three Wafer Size Categories (Tuesday, March 2, 2021)
• GlobalFoundries to invest $1.4 bn to increase output at three units (Tuesday, March 2, 2021)
• proteanTecs Joins the TSMC IP Alliance Program (Tuesday, March 2, 2021)
• TSMC Ramping Up Production of 5-nm Chips (Tuesday, March 2, 2021)
• Samsung Invests in Quantum Computing (Monday, March 1, 2021)
• China's most important chipmaker SMIC could be a big winner from the global semiconductor shortage (Sunday, February 28, 2021)
• Top 10 foundries expected to increase revenues by 20% (Tuesday, February 23, 2021)
• TSMC's 3nm Process On Track For 2 Year, 2X Performance Improvement – Chairman (Monday, February 22, 2021)
• TSMC Will Raise to Expand Capacity Amid Chip Shortages (Wednesday, February 17, 2021)
• Tech: Why TSMC is the world's most underestimated tech giant (Tuesday, February 16, 2021)
• SMIC unable to keep up with demand amid shortage and sanctions (Monday, February 15, 2021)
• Globalfoundries to manufacture secure chips for US DoD (Monday, February 15, 2021)
• Top Five Wafer Capacity Leaders Raise Share of Global Capacity to 54% (Tuesday, February 9, 2021)
• TSMC to set up 3DIC material R&D center in Japan (Monday, February 8, 2021)
• UK government helps NWF develop GaN foundry process (Monday, February 8, 2021)
• Samsung to expand MRAM applications (Wednesday, February 3, 2021)
• Italian startup for 3D chiplet package co-design (Tuesday, February 2, 2021)
• Sondrel supports 5nm Samsung and TSMC nodes (Tuesday, February 2, 2021)
• This is How Intel Gets Out of Manufacturing (Monday, February 1, 2021)