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Foundry News

• TSMC (TSM) Spotlight: The Foundry of 21st Century Gold (Sunday, December 29, 2024)
• TSMC Sets Key Milestone in Japan as Kumamoto Fab Begins Mass Production (Thursday, December 26, 2024)
• TSMC, Intel, Samsung Foundry ready to battle over the start of 2nm production next year (Monday, December 23, 2024)
• With an Eye on TSMC, Rapidus Foundry Approaches 2nm Process (Thursday, December 19, 2024)
• Samsung Reportedly Considering Partnership with TSMC to Jointly Produce Exynos 2500 (Tuesday, December 17, 2024)
• NVIDIA and TSMC Unveil Silicon Photonics Innovations at IEDM 2024 (Monday, December 16, 2024)
• Samsung and TSMC locked in intense 2nm chip competition (Monday, December 16, 2024)
• TSMC founder: Intel should have prioritized AI over foundry (Tuesday, December 10, 2024)
• Rapidus Collaborates with Synopsys to Shorten Semiconductor Design Cycles (Monday, December 9, 2024)
• Samsung foundry 'relief pitcher' Han Jin-man vows to improve 2-nm yields (Sunday, December 8, 2024)
• GlobalFoundries Receives Funding to Accelerate GaN Chip Manufacturing (Thursday, December 5, 2024)
• TSMC Achieves New Milestone With Its 2nm Process, As Trial Production Yields Exceed 60 Percent, Which Was Better Than Expected (Thursday, December 5, 2024)
• TSMC to Begin Mass Production of 2nm Chips Next Year (Thursday, December 5, 2024)
• Intel Foundry Fails To Impress Once Again, 18A Process "Yield Rates' Are Reported To Be Only 10% Making Mass-Production Impossible (Wednesday, December 4, 2024)
• Soitec and Globalfoundries Collaborate in the Production of High-Performance Rf-Soi Semiconductors (Tuesday, December 3, 2024)
• SK Hynix to produce HBM4 on 3 nm foundry process in 2025 (Tuesday, December 3, 2024)
• TSMC 2024 Supply Chain Management Forum Presents Awards to Outstanding Suppliers (Sunday, December 1, 2024)
• TSMC's Path to Semiconductor Foundry Leadership: Insights from Morris Chang's Memoir (Sunday, December 1, 2024)
• Siemens' Solido SPICE now certified for multiple leading-edge Samsung Foundry processes (Wednesday, November 27, 2024)
• TSMC May Bring 2nm Manufacturing Node to the U.S. After 2025 (Tuesday, November 26, 2024)
• Integrated silicon photonics: making the quantum future a reality (Monday, November 25, 2024)
• Tower Semiconductor Releases 300mm Silicon Photonics Process as a Standard Foundry Offering (Monday, November 25, 2024)
• GlobalFoundries and IDEMIA Secure Transactions to Enable Next-Generation Smart Card IC on GF 28ESF3 Platform (Sunday, November 24, 2024)
• TSMC drives A16, 3D process technology (Wednesday, November 20, 2024)
• Japan proposes $1.3bn investment in Rapidus (Tuesday, November 19, 2024)
• GlobalFoundries and U.S. Department of Commerce Announce Award Agreement on CHIPS Act Funding for Essential Chip Manufacturing (Tuesday, November 19, 2024)
• Samsung Reportedly Joins TSMC in Halting 7nm and Below AI Chip Supplies to China (Monday, November 11, 2024)
• Where the Future Begins: Samsung Showcases Pioneering Innovations for AI and Automotive Technologies at electronica 2024 in Munich (Sunday, November 10, 2024)
• U.S. restricts TSMC's export of advanced chips to China (Sunday, November 10, 2024)
• TSMC and GlobalFoundries finalize CHIPS Act funding agreements (Wednesday, November 6, 2024)
• M31 Launches USB4 IP for TSMC 5nm Process (Tuesday, November 5, 2024)
• Intel's Foundry Struggles Deepen As TSMC Rules Out Fab Acquisition (Monday, October 28, 2024)
• Rapidus Plans Second Plant for 1.4nm Process if 2nm Mass Production Proceeds Smoothly (Sunday, October 27, 2024)
• Alchip Announces Successful 2nm Test Chip Tapeout (Sunday, October 27, 2024)
• Google Reportedly Switching To TSMC 3nm 'N3E' Process For Its Tensor G5, Tensor G6 To Be Mass Produced On The More Advanced 'N3P' Technology (Tuesday, October 22, 2024)
• GlobalFoundries and NXP to Deliver Next-Generation 22FDX Solutions for Automotive, IoT and Smart Mobile (Tuesday, October 22, 2024)
• Intel Explores Foundry Alliance with Samsung in High-Level Talks (Monday, October 21, 2024)
• Improved materials for microchip interconnections (Monday, October 21, 2024)
• China's first 3nm SoC by Xiaomi marks a seven-year gap since its last launch, likely manufactured by TSMC (Monday, October 21, 2024)
• Samsung Foundry Pushes Up The Race Against TSMC In "Process Superiority", Starts Prepping 2nm & 1.4nm Production Lines (Tuesday, October 15, 2024)
• TSMC "already planning" for more European fabs (Sunday, October 13, 2024)
• Samsung's Next Move? Early HBM4 Mass-production and 2nm Foundry Solutions Could Be the Cure (Sunday, October 13, 2024)
• Credo Announces PCI Express 6 /7, Compute Express Link CXL 3.x Retimers, and AEC PCI Express Product Line at OCP Summit 2024 (Sunday, October 13, 2024)
• IEDM: CFETs make progress at 5nm and 7angstrom (Thursday, October 10, 2024)
• Intel, TSMC to detail 2nm processes at IEDM (Tuesday, October 8, 2024)
• Faraday and Kiwimoore Succeed in 2.5D Packaging Project for Mass Production (Tuesday, October 8, 2024)
• Siemens collaborates with GlobalFoundries to certify Analog FastSPICE for the foundry's high-performance processes (Tuesday, October 1, 2024)
• QuickLogic Delivers eFPGA IP Targeting TSMC N12e Process in Record Time (Monday, September 30, 2024)
• Unveiling the Availability of Industry's First Silicon-Proven 3nm, 24Gbps UCIe™ IP Subsystem with TSMC CoWoS® Technology (Sunday, September 29, 2024)
• Alphawave Semi Wins Fifth Consecutive TSMC OIP Ecosystem Forum Partner of the Year Award (Wednesday, September 25, 2024)