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• TSMC and Cadence Collaborate to Deliver AI-Driven Advanced-Node Design Flows, Silicon-Proven IP and 3D-IC Solutions (Wednesday, September 25, 2024)
• Synopsys and TSMC Pave the Path for Trillion-Transistor AI and Multi-Die Chip Design (Wednesday, September 25, 2024)
• Siemens extends collaboration with TSMC to advance integrated circuit and systems design (Wednesday, September 25, 2024)
• EnSilica joins TSMC Design Center Alliance (Wednesday, September 25, 2024)
• Intel's entire turnaround plan hinges on this one new chip family - Clearwater Forest pictured, Intel's first 18A chip slated for high-volume manufacturing (Monday, September 23, 2024)
• TSMC's Strategic Win: Full-Scale Semiconductor Production Starts Ahead of Schedule (Thursday, September 19, 2024)
• Samsung Secures US AI Chip Firm "Ambarella" Orders For Its 2nm Process, Signaling A Breakthrough (Saturday, September 14, 2024)
• Samsung's 2nm Yield Rate at Most 20%, Withdraws Personnel from Texas Taylor Plant (Wednesday, September 11, 2024)
• Samsung Partners with TSMC, Its Foundry Rival, on HBM4 Development (Thursday, September 5, 2024)
• Adani Group partners Israel's Tower Semiconductor to build $10 billion chip plant in India: All details (Thursday, September 5, 2024)
• Samsung and TSMC Unlikely to Be Buyers for Intel's Rumored Foundry Business Sale (Monday, September 2, 2024)
• Urgent Orders Boost Wafer Foundry Utilization in Q2; Global Top 10 Foundry Revenue Grows 9.6% while VIS Climbs Two Spots, Says TrendForce (Sunday, September 1, 2024)
• Intel considers foundry split, fab cancellations (Sunday, September 1, 2024)
• OpenAI joins Apple in securing TSMC's A16 Angstrom process for in-house AI chip (Sunday, September 1, 2024)
• Efficient Computer signs an agreement with GlobalFoundries to build MRAM chips on the GF 22FDX process (Saturday, August 31, 2024)
• Finwave Semiconductor and GlobalFoundries Partner on RF GaN-on-Si Technology for Cellular Handset Applications (Thursday, August 29, 2024)
• Samsung and TSMC competing to dominate 2nd-gen 3nm at global foundry industry (Thursday, August 29, 2024)
• Accelerating AI with Essential Chips at GlobalFoundries Technology Summit 2024 (Wednesday, August 28, 2024)
• Samsung's Foundry Strategy Focuses on AI/HPC Growth and Enhanced 2nm Process Amid TSMC's Dominance (Tuesday, August 27, 2024)
• Intel pursues successes in the 18A manufacturing process (Tuesday, August 27, 2024)
• Samsung's new 2 nm foundry process to cut chip size by 17% (Thursday, August 22, 2024)
• ESMC Breaks Ground on Dresden Fab (Wednesday, August 21, 2024)
• Global Foundry Industry's Revenue Rises on AI Demand (Tuesday, August 20, 2024)
• Intel 18A Advanced Packaging is Key to Tech Leadership (Tuesday, August 13, 2024)
• Rapidus to Fully Automate 2nm Fab, Claiming Chip Delivery Times at One-Third of Its Competitors (Monday, August 12, 2024)
• TSMC's Expansion beyond 2nm Taking Shape? Angstrom-Class Fabs Possibly in Southern Taiwan (Monday, August 12, 2024)
• Intel Foundry Achieves Major Milestones (Tuesday, August 6, 2024)
• Intel once again confirms future Intel 10A node, Intel 14A process progresses smoothly (Friday, August 2, 2024)
• It is reported that TSMC's A14 process will be put into risk trial production in the first half of 2026 (Monday, July 29, 2024)
• Samsung Slows Opening of Texas Fab Despite CHIPS Stimulus (Monday, July 22, 2024)
• Samsung Electronics To Provide Turnkey Semiconductor Solutions With 2nm GAA process and 2.5D Package to Preferred Networks (Wednesday, July 10, 2024)
• Tiny titans: Unveiling the power of 2nm and 1nm chips (Monday, July 8, 2024)
• Siemens advances integrated circuit test and analysis at 5nm and below (Monday, July 8, 2024)
• Samsung Electronics To Provide Turnkey Semiconductor Solutions With 2nm GAA Process and 2.5D Package to Preferred Networks (Monday, July 8, 2024)
• TSMC Reportedly Secures 3nm Order After Tapeout for Google's Tensor G5 (Wednesday, July 3, 2024)
• eMemory's Security-Enhanced OTP Qualifies on TSMC N5A Process Specializing in High-Performance Automotive Chips (Tuesday, July 2, 2024)
• Building Intel's Foundry Ecosystem for the AI Era (Sunday, June 30, 2024)
• Faraday Joins Intel Foundry Accelerator Design Services Alliance to Target Advanced Applications (Wednesday, June 26, 2024)
• Europe invests 830 million euros to build FAMES FD-SOI pilot line to achieve 7nm with planar CMOS (Tuesday, June 25, 2024)
• Intel's Latest FinFET Is Key to Its Foundry Plans (Tuesday, June 25, 2024)
• Intel 3 '3nm-class' process technology is in high-volume production (Tuesday, June 18, 2024)
• Samsung Foundry Struggles with Yield and Power Efficiency Issues (Monday, June 17, 2024)
• Intel 3 Represents an Intel Foundry Milestone (Monday, June 17, 2024)
• QuickLogic Joins Intel Foundry Accelerator IP and USMAG Alliance Programs (Monday, June 17, 2024)
• Samsung Showcases AI-Era Vision and Latest Foundry Technologies at SFF 2024 (Wednesday, June 12, 2024)
• Rapidus and IBM Expand Collaboration to Chiplet Packaging Technology (Wednesday, June 12, 2024)
• Siemens collaborates with Samsung Foundry to expand 3D-IC enablement tools, optimize other EDA solutions for foundry's newest processes (Wednesday, June 12, 2024)
• ADTechnology announces next-generation platform "ADP600" at Samsung Foundry Forum 2024 (Wednesday, June 12, 2024)
• Synopsys Achieves Certification of its AI-driven Digital and Analog Flows and IP on Samsung Advanced SF2 GAA Process (Wednesday, June 12, 2024)
• Alphawave Semi Expands Partnership with Samsung Foundry to Further Drive Innovation at Advanced Semiconductor Nodes (Monday, June 10, 2024)