Search News

Foundry News

• OPENEDGES Announces Silicon-Proven Success of its LPDDR5X Combo PHY IP on Samsung Foundry's SF5A Technology (Sunday, June 9, 2024)
• Samsung Foundry Expands 'Packaging Coalition' with Ten Additional Members (Wednesday, June 5, 2024)
• Qualcomm is considering a "dual-sourcing" strategy with Samsung and TSMC for Snapdragon 8 Gen 5 (Tuesday, June 4, 2024)
• ElevATE Semiconductor and GlobalFoundries Partner on High-Voltage Chips for Commercial and National Security Applications (Tuesday, June 4, 2024)
• Rapidus and IBM Expand Collaboration to Chiplet Packaging Technology for 2nm-Generation Semiconductors (Sunday, June 2, 2024)
• Samsung Expected to Unveil its 1nm Plan in June, Advancing it to 2026 (Tuesday, May 28, 2024)
• Samsung Electronics Opens Path to Chase TSMC with 3nm Foundry Collaboration with AMD (Tuesday, May 28, 2024)
• TSMC's 3nm Production Capacity Will Triple This Year! Nanjing Plant Receives "Indefinite Exemption"! (Thursday, May 23, 2024)
• China's largest chipmaker SMIC is now the No. 3 foundry in the world, Counterpoint says (Thursday, May 23, 2024)
• IMEC Spearheads the Construction of Sub-2nm Pilot Line Project with a Fund of EUR 2.5 Billion (Wednesday, May 22, 2024)
• X-FAB and Soitec team up on SiC wafers (Wednesday, May 22, 2024)
• Soitec and Tokai Carbon enter into SiC partnership (Tuesday, May 21, 2024)
• Fraunhofer IPMS supports the 300 mm process development of smart power technologies for the semiconductor manufacturer Infineon at the Dresden site (Monday, May 20, 2024)
• TSMC Reportedly Prepares Next-generation HBM4 Manufacturing, Utilizing 12nm and 5nm Process Nodes (Thursday, May 16, 2024)
• Rapidus and Fraunhofer IZM join Forces for High-End Performance Packaging (Tuesday, May 7, 2024)
• Samsung tapes out 3nm mobile processor, closing gap with TSMC (Tuesday, May 7, 2024)
• Apple M4 moves to TSMC N3E (Monday, May 6, 2024)
• Synopsys collaborates with TSMC on 2nm IP portfolio and photonics ICs (Monday, May 6, 2024)
• A Conversation with GlobalFoundries Europe's Manfred Horstmann (Sunday, May 5, 2024)
• Synopsys and Samsung Electronics Collaborate to Achieve First Production Tapeout of Flagship Mobile CPU with Leading Performance on Samsung Foundry's GAA Process (Thursday, May 2, 2024)
• TSMC Certifies Ansys Multiphysics Platforms, Enabling Next-Gen AI and HPC Chips (Monday, April 29, 2024)
• Siemens' tools certified for TSMC N2 (Sunday, April 28, 2024)
• TSMC's A16 Process Moves Goalposts in Tech-Leadership Game (Sunday, April 28, 2024)
• TSMC plans 1.6nm process for 2026 (Thursday, April 25, 2024)
• TSMC unveils 1.6nm process technology with backside power delivery, rivals Intel's competing design (Wednesday, April 24, 2024)
• M31 has successfully launched MIPI C/D PHY Combo IP on the advanced TSMC 5nm process (Wednesday, April 24, 2024)
• Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design (Wednesday, April 24, 2024)
• Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes (Wednesday, April 24, 2024)
• Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones (Tuesday, April 23, 2024)
• Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process (Monday, April 22, 2024)
• Analog Bits to Demonstrate Numerous Test Chips Including Portfolio of Power Management and Embedded Clocking and High Accuracy Sensor IP in TSMC N3P Process at TSMC 2024 North America Technology Symposium (Monday, April 22, 2024)
• Silicon Creations Reaches Milestone of 10 Million Wafers in Production with TSMC (Sunday, April 21, 2024)
• Omni Design Technologies Joins Intel Foundry Accelerator IP Alliance (Thursday, April 18, 2024)
• STMicroelectronics opens up the FD-SOI era for MCU (Tuesday, April 16, 2024)
• Industry Leading PPA EFPGA And DSP/AI In Development For TSMC N5/4/3 (Sunday, April 7, 2024)
• It Is Time To Take Intel Seriously As A Chip Foundry (Thursday, April 4, 2024)
• SmartSoC Solutions Joins TSMC Design Center Alliance to Boost Semiconductor Innovation in India (Tuesday, March 26, 2024)
• StarIC and GlobalFoundries announce strategic partnership, release high-Speed TIA and drivers to advance silicon photonics ecosystem (Sunday, March 24, 2024)
• STMicroelectronics breaks the 20nm barrier for cost-competitive next-generation microcontrollers (Monday, March 18, 2024)
• TSMC and Synopsys Bring Breakthrough NVIDIA Computational Lithography Platform to Production (Monday, March 18, 2024)
• After TSMC fab in Japan, advanced packaging facility is next (Sunday, March 17, 2024)
• Intel will bring a performance-improving feature to its chips one year ahead of TSMC (Friday, March 15, 2024)
• We'll Need Many More Fabs to Meet $1 Trillion by 2030 Goal (Tuesday, March 12, 2024)
• The Imminent Arrival of 2-Nanometer Advanced Process (Monday, March 11, 2024)
• Credo Launches 112G PAM4 SerDes IP for TSMC N3 Process Technology (Thursday, March 7, 2024)
• Flex Logix Joins Intel Foundry USMAG Alliance (Tuesday, March 5, 2024)
• QuickLogic Announces eFPGA IP Contract for TSMC N12e™ Process Technology (Monday, March 4, 2024)
• Intel Launches Altera, Its New Standalone FPGA Company (Sunday, March 3, 2024)
• Intel puts 1nm process (10A) on the roadmap for 2027 - also plans for fully AI-automated factories with 'Cobots' (Tuesday, February 27, 2024)
• Intel Foundry Services Head Sees Advanced Packaging as "On Ramp" to Growth (Wednesday, February 21, 2024)