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• Siemens collaborates with Intel Foundry to contribute 3D-IC technology leadership for Intel's EMIB reference flow (Tuesday, February 20, 2024)
• Synopsys and Intel Foundry Accelerate Advanced Chip Designs with Synopsys IP and Certified EDA Flows for Intel 18A Process (Tuesday, February 20, 2024)
• Intrinsic ID Joins Intel Foundry Accelerator IP Alliance to Secure Leading-Edge Semiconductors (Tuesday, February 20, 2024)
• Samsung Electronics Collaborates With Arm on Optimized Next Gen Cortex-X CPU Using Samsung Foundry's Latest GAA Process Technology (Monday, February 19, 2024)
• Intel and Cadence Expand Partnership to Enable Best-in-Class SoC Design on Intel's Advanced Processes (Monday, February 19, 2024)
• Qualcomm asks Samsung Foundry and TSMC to each build 2nm Snapdragon 8 prototypes (Sunday, February 11, 2024)
• Flex Logix Joins Intel Foundry Services Accelerator IP Alliance to Enable Fast, Low Power, Reconfigurable SoC's (Sunday, February 11, 2024)
• SK hynix, TSMC Form AI Semiconductor Alliance: Challenge to Samsung Electronics? (Wednesday, February 7, 2024)
• Samsung Announces 2nm AI Chip Deal With HBM3 Memory (Wednesday, February 7, 2024)
• Dolphin Design announces the successful launch of its first silicon tape out in 12nm FinFet (Wednesday, February 7, 2024)
• Intel Foundry Announces 18A Design Win for 64-Core Arm SoC (Monday, February 5, 2024)
• Eliyan Sets New Standard for Chiplet Interconnect Performance with Latest PHY Delivering Data Rate of 64Gbps on 3nm Process Using Standard Packaging (Sunday, February 4, 2024)
• Faraday Announces Plans to Develop Arm-based 64-core SoC on Intel 18A Technology (Sunday, February 4, 2024)
• Both Samsung and TSMC will be keeping 2nm chip manufacturing in their home countries (Friday, February 2, 2024)
• Intel and UMC Announce New Foundry Collaboration (Wednesday, January 24, 2024)
• eMemory's Security-Enhanced OTP Qualifies on TSMC N4P Process, Pushing Forward in High-Performance Leading Technology (Wednesday, January 24, 2024)
• Report: Apple will be first to receive TSMC's 2nm chips starting in 2025 (Tuesday, January 23, 2024)
• Samsung's 2nd-Gen 3nm Process, SF3, Has Begun Trial Production (Saturday, January 20, 2024)
• ITRI and TSMC Collaborate on Advancing High-Speed Computing with SOT-MRAM (Wednesday, January 17, 2024)
• Samsung and TSMC competing to dominate 2nd-gen 3nm at global foundry industry (Wednesday, January 17, 2024)
• Intel, Samsung, TSMC 'Getting Serious' About CFET (Tuesday, January 9, 2024)
• TSMC reaffirms path to 1-nm node by 2030 on track (Sunday, December 31, 2023)
• Samsung Seen Stumbling at Silicon's Leading Edge (Thursday, December 28, 2023)
• Samsung, Intel Gear Up for Intense Competition in 2-NM Semiconductor Process, Chasing TSMC (Monday, December 25, 2023)
• Samsung Seen Stumbling at Silicon's Leading Edge (Tuesday, December 19, 2023)
• China's 'Big Fund' is investing $1 billion in another domestic foundry, to advance sub-10nm chip manufacturing (Tuesday, December 5, 2023)
• Samsung Electronics Tense Over TSMC-Apple-Amkor 'Arizona Alliance' (Tuesday, December 5, 2023)
• Samsung Foundry aims to improve production of AI, high performance computing chips (Monday, November 20, 2023)
• Rapidus and Tenstorrent Partner to Accelerate Development of AI Edge Device Domain Based on 2nm Logic (Thursday, November 16, 2023)
• Samsung to unveil 3D AI chip packaging tech SAINT to rival TSMC (Saturday, November 11, 2023)
• Cadence EMX 3D Planar Solver Certified for Samsung Foundry 8nm LPP Process Technology (Wednesday, November 8, 2023)
• Cadence open-source PDK and reference design now available for SkyWater's 130nm process (Tuesday, November 7, 2023)
• Will 1.4-nm help Samsung catch up with TSMC, IFS? (Sunday, November 5, 2023)
• Are We Ready for the 2nm Process Node? (Wednesday, November 1, 2023)
• Details about Samsung Foundry's 1.4nm process node surface (Monday, October 30, 2023)
• Synopsys Honored at TSMC 2023 OIP Ecosystem Forum with Multiple Partner of the Year Awards (Wednesday, October 25, 2023)
• Sofics releases its ESD technology on TSMC 3nm process (Monday, October 23, 2023)
• Cadence Wins Four 2023 TSMC OIP Partner of the Year Awards (Thursday, October 19, 2023)
• Samsung Electronics Unveils Automotive Process Strategy at Samsung Foundry Forum 2023 EU (Wednesday, October 18, 2023)
• CEVA Joins Intel Foundry Services Accelerator IP Alliance Program to Empower Cutting-Edge SoCs (Monday, October 16, 2023)
• eMemory Won TSMC OIP Partner of the Year Award for the 14th Consecutive Year (Sunday, October 15, 2023)
• ADTechnology to start 3nm 2.5D ASIC design project for HPC application (Tuesday, October 10, 2023)
• Samsung Electronics and TSMC Grapple with 3-Nano Yield Challenges (Thursday, October 5, 2023)
• TSMC selects IC'Alps for its Design Center Alliance (DCA) (Tuesday, October 3, 2023)
• Intel Announces Intent to Operate Programmable Solutions Group (PSG) as Standalone Business (Tuesday, October 3, 2023)
• Soitec Opens New Plant, Positioning SmartSiC™ as a Future EV Standard (Monday, October 2, 2023)
• Keysight, Synopsys, and Ansys Accelerate RFIC Semiconductor Design with New Reference Flow for TSMC's Advanced 4nm RF FinFET Process (Wednesday, September 27, 2023)
• M31 Announces Low-Power IP Solutions for TSMC's N12e Process (Wednesday, September 27, 2023)
• TSMC Announces Breakthrough Set to Redefine the Future of 3D IC (Wednesday, September 27, 2023)
• Cadence Expands Support for 3Dblox 2.0 Standard with New System Prototyping Flows (Tuesday, September 26, 2023)