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• Siemens and TSMC collaborate to help mutual customers optimize designs using foundry's newest advancements (Tuesday, September 26, 2023)
• GlobalFoundries Unveils Power-Efficient Advancements to 22FDX® Platform at Annual Tech Summit (Tuesday, September 26, 2023)
• Analog Bits to Demonstrate Automotive Grade IP's Including a Novel High Accuracy Sensor at TSMC 2023 North America Open Innovation Platform Ecosystem Forum (Tuesday, September 26, 2023)
• Cadence Digital and Custom/Analog Design Flows Achieve the Latest TSMC N2 Certification (Tuesday, September 26, 2023)
• Intel Develops Glass Substrate for Next Gen Advanced Chip Packaging Needs (Monday, September 25, 2023)
• Synopsys tools tape out 2nm chips at TSMC (Sunday, September 24, 2023)
• Synopsys and TSMC Collaborate to Accelerate 2nm Innovation for Advanced SoC Design with Certified Digital and Analog Design Flows (Sunday, September 24, 2023)
• Synopsys and TSMC Advance Analog Design Migration with Reference Flow Across Advanced TSMC Processes (Sunday, September 24, 2023)
• proteanTecs Joins TSMC 3DFabric™ Alliance, Expanding Its Support of the 3D IC Ecosystem (Sunday, September 24, 2023)
• Analog Bits to Join Intel Foundry Services Chip Design Ecosystem Expanding 3nm IP Offerings (Thursday, September 21, 2023)
• Report: TSMC Could Push 2nm Node Back to 2026 (Wednesday, September 20, 2023)
• Cadence Advances Hyperscale SoC Design with Expanded IP Portfolio for TSMC N3E Process Featuring Next-Generation 224G-LR SerDes IP (Wednesday, September 20, 2023)
• TSMC in talks about chiplet packaging in Arizona (Monday, September 18, 2023)
• Driving EuropeÂ’s Chip Renaissance: TSMCÂ’s Vision with ESMC (Thursday, September 14, 2023)
• X-Fab adds new passive integration technology for RF (Wednesday, September 13, 2023)
• TSMC's semiconductor foundry in the United States will begin trial production in Q1 2024 (Tuesday, September 12, 2023)
• GlobalFoundries Officially Opens US$4 Billion Expansion Facility in Singapore, Creating 1,000 New Jobs (Monday, September 11, 2023)
• Getting to grips with RF design (Sunday, September 10, 2023)
• Samsung Says It Will Beat TSMC's 4nm Production Capacity (Thursday, September 7, 2023)
• Intel and Tower Semiconductor announce new US foundry agreement (Tuesday, September 5, 2023)
• Intel Foundry Services and Tower Semiconductor Announce New US Foundry Agreement (Monday, September 4, 2023)
• GlobalFoundries Announces 9SW RFSOI Technology for Next-Generation Mobile and 5G Applications (Wednesday, August 30, 2023)
• GlobalFoundries Enhances Technology Platforms to Enable Critical Applications for Next Generation Electric and Autonomous Vehicles (Tuesday, August 29, 2023)
• GlobalFoundries Announces 9SW RFSOI Technology for Next-Generation Mobile and 5G Applications (Tuesday, August 29, 2023)
• A New Home For Europe's Semiconductor Metrology (Tuesday, August 22, 2023)
• TSMC Forms Task Force to Accelerate 2nm Chip Production (Thursday, August 17, 2023)
• Samsung Establishes R&D Organization in Silicon Valley (Wednesday, August 16, 2023)
• Imec integrates thin-film pinned photodiode into short-wave-infrared imaging sensors (Monday, August 14, 2023)
• Intel and Synopsys Expand Partnership to Enable Leading IP on Intel Advanced Process Nodes (Monday, August 14, 2023)
• TSMC allocates $6bn for 2nm capacity in Taiwan (Friday, August 11, 2023)
• 3-nm Race to Start in Semiconductor Industry with Chip for Apple iPhone 15 (Tuesday, August 8, 2023)
• TSMC, Bosch, Infineon, and NXP Establish Joint Venture to Bring Advanced Semiconductor Manufacturing to Europe (Monday, August 7, 2023)
• Huawei plans to use SMIC's 'nearly-7nm' process (Sunday, July 30, 2023)
• Huawei planning on using SMIC to fab 7nm ICs this year (Sunday, July 30, 2023)
• TSMC opens global R&D centre for 1nm push (Thursday, July 27, 2023)
• Intel Looks to Regain Semiconductor Chip Leadership from TSMC; Separates Manufacturing and Fabless Units (Wednesday, July 26, 2023)
• Singapore opens US$2bn chiplet factory (Sunday, July 23, 2023)
• M31 Partners with Intel IFS Alliance to Present Latest IP Development Achievements (Thursday, July 13, 2023)
• Cadence Digital, Custom/Analog Design Flows Certified and Design IP Available for Intel 16 FinFET Process (Tuesday, July 11, 2023)
• 'Correct by construction' tool for chip power layout down to 2nm (Monday, July 10, 2023)
• End-to-end design and verification for PCIe 6.0 (Sunday, July 9, 2023)
• Samsung tapes out 2nm backside routing test chip (Monday, July 3, 2023)
• Rapidus CEO Chasing Single-Wafer-Processing Dream (Sunday, July 2, 2023)
• Samsung Electronics Unveils Foundry Vision in the AI Era at Samsung Foundry Forum 2023 (Tuesday, June 27, 2023)
• Synopsys and Samsung Foundry Boost Power, Performance and Area for Modern SoCs on Samsung's SF2 Process (Tuesday, June 27, 2023)
• Intel Provides Update on Internal Foundry Model (Wednesday, June 21, 2023)
• Samsung to apply AI, big data tech to entire chipmaking process (Sunday, June 18, 2023)
• Samsung broadens IP portfolio to narrow gap with TSMC (Tuesday, June 13, 2023)
• Samsung Electronics to hoist foundry IP portfolio to narrow gap with TSMC (Tuesday, June 13, 2023)
• Synopsys and Samsung Collaborate to Deliver Broad IP Portfolio Across All Advanced Samsung Foundry Processes (Tuesday, June 13, 2023)