Company
design-reuse.com
D&R China
Blogs
Industry Articles
D&R Events
IP-SoC Days 2025
IP-SoC Days 2024
IP-SoC Days 2023
IP-SoC Days 2022
IP-SoC Days 2021
IP-SoC 2024
IP-SoC 2023
IP-SoC 2022
IP-SoC 2021
Subscribe to D&R SoC News Alert
English
Mandarin
Register
Login
Menu
Home
Search IP Core
News
Blogs
Articles
D&R Events
Subscribe to D&R SoC News Alert
Register
Login
News
Center
Foundation IP
Analog IP
Interface IP
Interconnect IP
Memory Controller
Peripheral Controller
Wireless IP
Wireline IP
Processor IP
RISC-V
AI Core
Automotive IP
Security IP
IoT
Media IP
Avionics / Space IP
Verification IP
Verification Platform
Asic & IP Design Center
IP-SoC Days
IP-SoC Days 2025
IP-SoC Days 2024
IP-SoC Days 2023
IP-SoC Days 2022
IP-SoC Days 2021
IP-SoC 2024
IP-SoC 2023
IP-SoC 2022
IP-SoC 2021
Search News
Keyword
Category
Foundry
Chiplet / Multi-Die
Design IP
RISC-V
Artificial Intelligence
Automotive
Internet of Things
Security
Networking
Audio / Video
Foundry News
TSMC holds 3nm ceremony
(Tuesday, December 27, 2022)
TSMC will start the mass production of its next-gen cutting-edge chips this week
(Sunday, December 25, 2022)
TSMC in talks to build fab in Dresden
(Sunday, December 25, 2022)
Japan collaborates with IBM to produce 2nm chips
(Tuesday, December 20, 2022)
TSMC fab in Japan at center of Sony's image sensor kingdom
(Friday, December 16, 2022)
Japan's New Semiconductor Foundry Rapidus Taps IBM For 2nm Process
(Sunday, December 11, 2022)
Samsung fails to narrow gap with TSMC in foundry market
(Sunday, December 11, 2022)
Japan's Rapidus signs up IMEC to support 2nm push
(Tuesday, December 6, 2022)
TSMC Announces Updates for TSMC Arizona
(Tuesday, December 6, 2022)
STMicroelectronics and Soitec Partner on SiC Substrate Manufacturing Technology
(Monday, December 5, 2022)
Intel says it will squeeze 1 trillion transistors onto a chip package by 2030
(Saturday, December 3, 2022)
Samsung and TSMC Competing to Secure Foundry Customers
(Wednesday, November 30, 2022)
TSMC to Make 3 nm Semiconductors at Arizona Fab, Looking to 1 nm
(Monday, November 28, 2022)
Leti, Intel look to quadruple hybrid bonding speeds
(Thursday, November 24, 2022)
SkyWater CEO Expands "Technology Foundry" Model
(Tuesday, November 22, 2022)
Samsung Has Reportedly Secured 3nm Orders from NVIDIA, Qualcomm & More
(Monday, November 21, 2022)
Tesla becomes TSMC's first EV client for 4nm chips with 3x faster self-driving calculations
(Sunday, November 20, 2022)
TSMC to produce 3-nanometer chips at its Arizona factory
(Sunday, November 20, 2022)
Synopsys Wins Six Partner of the Year Awards at TSMC 2022 OIP Ecosystem Forum
(Thursday, November 17, 2022)
TSMC Expansion in Arizona to Target 3-nm Node
(Monday, November 14, 2022)
Report says Apple, TSMC talk about moving 3nm chip production to U.S.
(Thursday, November 10, 2022)
TSMC Grants a Sweep of EDA Certifications for New Process Nodes
(Saturday, November 5, 2022)
SMIC: The Chinese company at the centre of US-China chip war
(Thursday, November 3, 2022)
Intel: Our Goal Is to Become Second Largest Foundry by 2030
(Thursday, November 3, 2022)
Weebit qualifies ReRAM for production on 130nm process
(Sunday, October 30, 2022)
TSMC says no commitment made on 1nm foundry location
(Sunday, October 30, 2022)
TSMC Launches OIP 3DFabric Alliance to Shape the Future of Semiconductor and System Innovations
(Wednesday, October 26, 2022)
Siemens partners with TSMC for 3nm product certifications and other technology milestones
(Wednesday, October 26, 2022)
Intel Foundry Services roadmap unveiled one deal at a time
(Monday, October 24, 2022)
Alphawave IP Achieves Its First Testchip Tapeout for TSMC N3E Process
(Monday, October 24, 2022)
Analog Bits to Demonstrate Pinless PLL and Sensor IP in TSMC N4 and N5 Processes at TSMC 2022 North America Open Innovation Platform® Ecosystem Forum
(Monday, October 24, 2022)
Samsung Electronics to Beef up Older Foundry Processes
(Sunday, October 23, 2022)
Intel Foundry Services Forms Alliance to Enable National Security, Government Applications
(Sunday, October 23, 2022)
Faraday Unveils Design Implementation Services for FinFET Technology Targeting all Foundries
(Sunday, October 23, 2022)
TSMC suspends production of powerful GPU chip for Chinese tech firm
(Saturday, October 22, 2022)
TSMC heads below 1nm with 2D transistors at IEDM
(Monday, October 17, 2022)
Cadence Expands Collaboration with Samsung Foundry to Advance 3D-IC Design
(Monday, October 17, 2022)
TSMC delays production of 3nm chips as Samsung Foundry takes process leadership
(Saturday, October 15, 2022)
Faraday Delivers SAFE™ IP Portfolio for Samsung Foundry 14LPP Process
(Wednesday, October 12, 2022)
8nm RFIC Flow Supports All Stages of RFIC Design Process
(Monday, October 10, 2022)
Samsung Electronics Unveils Plans for 1.4nm Process Technology and Investment for Production Capacity at Samsung Foundry Forum 2022
(Wednesday, October 5, 2022)
Samsung unveils advanced-chipmaking roadmap, intensifying rivalry with TSMC
(Wednesday, October 5, 2022)
Siemens' Aprisa digital implementation solution certified for Samsung Foundry's advanced 4nm processes
(Monday, October 3, 2022)
Wafer Makers Continue to Aggressively Expand Facilities
(Thursday, September 29, 2022)
Foundry data shows the cracks in the semiconductor market
(Wednesday, September 28, 2022)
Intel Foundry's "No. 1" Customer - U.S. DoD - Targets GAA
(Wednesday, September 28, 2022)
Moving from SoCs to Chiplets Could Help Extend Moore's Law
(Tuesday, September 27, 2022)
Samsung, Intel, TSMC confirm alliance in next-gen "chiplet" technology
(Tuesday, September 27, 2022)
Vidatronic to Exhibit at Samsung Foundry Forum and SAFE™ Forum in San Jose in October
(Wednesday, September 21, 2022)
Siemens collaborates with UMC to develop 3D integrated circuit hybrid-bonding workflow
(Wednesday, September 21, 2022)
|
Previous
|
9
|
10
|
11
|
...
|
Next
|
Did you miss last D&R News Alerts ?
Previous
