Search News

Foundry News

• Vidatronic to Exhibit at Samsung Foundry Forum and SAFE™ Forum in San Jose in October (Wednesday, September 21, 2022)
• Siemens collaborates with UMC to develop 3D integrated circuit hybrid-bonding workflow (Wednesday, September 21, 2022)
• SkyWater to Provide Foundry Service for new NIST and Google Partnership to Create Supply of Chips for Researchers and Tech Startups (Thursday, September 15, 2022)
• Apple to use updated TSMC technology (Wednesday, September 14, 2022)
• TSMC says its next-gen 2nm mass production begins in 2025 (Monday, September 12, 2022)
• TSMC to mass produce chips on upgraded version of 3nm process in 2023 (Sunday, September 11, 2022)
• Taiwan's TSMC 2nm chip fab ready for construction, to be operational by 2025 (Sunday, September 11, 2022)
• Archer Materials partners with GlobalFoundries to advance 12CQ chip fabrication - Quantum Computing (Monday, September 5, 2022)
• UMC Reports Sales for August 2022 (Monday, September 5, 2022)
• SiMa.ai Develops the Industry's First Purpose-Built Machine Learning System-on-Chip with TSMC's Power Efficient Technology (Monday, September 5, 2022)
• TSMC plans to mass produce 2nm chips in 2025 and adopts US EDA software: report (Sunday, September 4, 2022)
• Samsung Electronics to Produce Google's 3-nm Mobile Chips (Tuesday, August 30, 2022)
• There is TSMC and there's everybody else, can Samsung or Intel catch up? (Saturday, August 27, 2022)
• Intel unveils semiconductor co-investment program (Tuesday, August 23, 2022)
• A closer look at TSMC's 3-nm node and FinFlex technology (Sunday, August 21, 2022)
• Apple will be first to receive 3nm chips from TSMC, but not for the device you're thinking of (Saturday, August 20, 2022)
• Cadence and GlobalFoundries Collaborate on RF and mmWave Design Flow to Accelerate Mobile and 5G Innovation (Thursday, August 18, 2022)
• Credo Launches Comprehensive Family of 112G PAM4 SerDes IP for TSMC N5 and N4 Process Technologies (Tuesday, August 16, 2022)
• GlobalFoundries CEO: Earnings benefited from balanced supply chain, diverse end markets (Monday, August 8, 2022)
• Intel tGPU Setback Expected to Slow TSMC's 3 nm Ramp (Thursday, August 4, 2022)
• Intel Orders Delayed, TSMC Slows Three-Nanometer Expansion, Says TrendForce (Wednesday, August 3, 2022)
• Intel to manufacture MediaTek Edge chips, instead of TSMC (Monday, July 25, 2022)
• Samsung Foundry Achieves 2X Productivity on Large-Scale Analog and Mixed-Signal IP with the Spectre FX Simulator (Monday, July 25, 2022)
• History is made! Samsung beats out TSMC and starts shipping 3nm GAA chipsets (Sunday, July 24, 2022)
• SMIC shipping 7nm ICs (Sunday, July 24, 2022)
• GlobalFoundries Statement Following Senate Procedural Vote on Legislation To Bolster U.S. Competitiveness (Tuesday, July 19, 2022)
• TSMC 28nm Chips Are Still Profitable After 10 Years (Sunday, July 17, 2022)
• TSMC Trims Expansion Plans as Outlook Dims (Sunday, July 17, 2022)
• Taiwan's TSMC still leads chipmaking sector despite achievements by Samsung (Monday, July 11, 2022)
• Samsung Electronics Places Big Bet on 3-nm Foundry Technology (Sunday, July 10, 2022)
• STMicroelectronics and GlobalFoundries to advance FD-SOI ecosystem with new 300mm manufacturing facility in France (Sunday, July 10, 2022)
• Europe Needs 2-nm Manufacturing Process by 2030, says Soitec's CEO (Monday, July 4, 2022)
• Samsung Leads Chip Industry with Nanochip Production (Thursday, June 30, 2022)
• Intel Foundry Services Forms Alliance to Enable Design in the Cloud (Wednesday, June 29, 2022)
• Samsung Begins Chip Production Using 3nm Process Technology With GAA Architecture (Wednesday, June 29, 2022)
• TSMC: N2 To Start With Just GAAFETs, Add Backside Power Delivery Later (Tuesday, June 28, 2022)
• Intel boosts cloud EDA for its foundry business (Monday, June 27, 2022)
• Ansys Multiphysics Solutions Achieve Certification for TSMC's N3E and N4P Process Technologies (Sunday, June 26, 2022)
• TSMC Japan 3DIC R＆D Center Completes Clean Room Construction in AIST Tsukuba Center (Sunday, June 26, 2022)
• GlobalFoundries Celebrates New Singapore Fab with Arrival of First Tool (Wednesday, June 22, 2022)
• TSMC Creates Design Options for New 3nm Node (Tuesday, June 21, 2022)
• Silicon Topology Joins TSMC Design Center Alliance (DCA) (Sunday, June 19, 2022)
• TSMC FINFLEX™, N2 Process Innovations Debut at 2022 North American Technology Symposium (Thursday, June 16, 2022)
• Siemens extends support of multiple IC design solutions for TSMC's latest processes (Wednesday, June 15, 2022)
• Cadence Design IP portfolio in TSMC's N5 Process Gains Broad Adoption Among Leading Semiconductor and System Companies (Wednesday, June 15, 2022)
• Japan targeting 2025-7 for 2nm process (Tuesday, June 14, 2022)
• Veriest expands Embedded Software team to provide full engineering services (Tuesday, June 14, 2022)
• GaN Systems & TSMC Showcase Latest Power Electronics Advances at 2022 TSMC Technology Symposium (Monday, June 13, 2022)
• Synopsys Drives Chip Innovation for Next-Generation Mobile and HPC Designs on TSMC N3E and N4P Processes (Sunday, June 12, 2022)
• Cadence Digital and Custom/Analog Design Flows Certified by TSMC for Latest N3E and N4P Processes (Sunday, June 12, 2022)