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Chiplet / Multi-Die News

• Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity (Thursday, December 19, 2024)
• Cadence Rolls Out System Chiplet to Reorganize the SoC (Tuesday, December 17, 2024)
• Fraunhofer IAF expands technology capabilities for chiplet innovations within the APECS pilot line (Monday, December 16, 2024)
• Chiplet Summit Features the Latest Chip Design Technology (Monday, December 16, 2024)
• European chiplet pilot line starts operations (Monday, December 16, 2024)
• Democratizing Chiplets (Tuesday, December 10, 2024)
• YorChip and Digitho developing breakthrough 2D Chiplet Packaging for Mass Markets (Wednesday, December 4, 2024)
• IP players prominent in chiplet's 2024 diary (Sunday, December 1, 2024)
• Advanced Packaging and Chiplets Can Be for Everyone (Friday, November 29, 2024)
• Advanced Packaging and Chiplets Can Be for Everyone (Thursday, November 28, 2024)
• Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology (Tuesday, November 19, 2024)
• Cadence Unveils Arm-Based System Chiplet (Tuesday, November 19, 2024)
• SEMIFIVE Collaborates with Synopsys to Develop Advanced Chiplet Platform for High-Performance Multi-Die Designs (Monday, November 11, 2024)
• Outlook 2025: Embracing the chiplet journey (Thursday, October 17, 2024)
• Rebellions Builds Chiplet Roadmap, Merges with Sapeon (Wednesday, October 16, 2024)
• ADTechnology Partners with Arm, Samsung Foundry, and Rebellions on AI CPU Chiplet Platform (Tuesday, October 15, 2024)
• Why Chiplets Are the Next Big Innovation in Silicon (Wednesday, October 9, 2024)
• Bosch, Tenstorrent to collaborate on standardizing automotive chips (Wednesday, October 9, 2024)
• Revolutionizing High-Performance Silicon: Alphawave Semi and Arm Unite on Next-Gen Chiplets (Tuesday, October 8, 2024)
• Chiplet Summit 2024 Shows How Advanced Packaging Keeps Moore's Law Alive (Tuesday, September 17, 2024)
• Synopsys Powers World's Fastest UCIe-Based Multi-Die Designs with New IP Operating at 40 Gbps (Monday, September 9, 2024)
• Faraday Unveils Advanced Packaging Coordinated Platform for Multi-source Chiplets (Monday, September 9, 2024)
• Blue Cheetah Collaborates with LG to Demonstrate Successful Silicon Bring-Up of Chiplet-Based Design (Monday, September 2, 2024)
• Intel and Cadence Collaborate to Advance the All-Important UCIe Standard (Sunday, September 1, 2024)
• OPENEDGES Unveils UCIe Chiplet Controller IP, Expanding Design Portfolio (Tuesday, August 13, 2024)
• Alphawave Semi Launches Industry's First 3nm UCIe IP with TSMC CoWoS Packaging (Tuesday, July 30, 2024)
• Source Photonics Licenses 800G Transceiver Module Designs from Intel (Monday, July 22, 2024)
• CXL Fulfills AI's Need for Open Industry Standard Interconnect (Thursday, July 18, 2024)
• YorChip predicts 2026 will be the year of the chiplet (Tuesday, July 2, 2024)
• Siemens and Intel Foundry collaborate to deliver new tools certifications and EMIB/3D-IC innovation (Monday, June 24, 2024)
• Synopsys Accelerates Chip Innovation with Production-Ready Multi-Die Reference Flow for Intel Foundry (Monday, June 24, 2024)
• Siemens delivers a major leap toward mainstream 3D-IC adoption with new Calibre 3DThermal (Monday, June 24, 2024)
• EDA vendors put Intel EMIB interconnect in design flows for 3D ICs (Monday, June 24, 2024)
• Baya Systems and Blue Cheetah Partner to Deliver Chiplet Interconnect Solutions (Sunday, June 23, 2024)
• Baya Systems Introduces New Technology to Transform SoCs and Chiplets for Emerging Applications (Thursday, June 20, 2024)
• Alphawave Semi Unlocks 1.2 TBps Connectivity for High-Performance Compute and AI Infrastructure with 9.2 Gbps HBM3E Subsystem (Wednesday, June 19, 2024)
• System-level UCIe IP for early architecture analysis of 3D Chiplet Design and Packaging (Wednesday, June 19, 2024)
• Alphawave Reveals Multiprotocol I/O Chiplet Tapeout, Collabs with Arm, Samsung (Tuesday, June 18, 2024)
• Alphawave Semi Tapes Out Industry-First, Multi-Protocol I/O Connectivity Chiplet for High-Performance Compute and AI Infrastructure (Wednesday, June 12, 2024)
• SEMIFIVE Collaborates with OPENEDGES on Chiplet Development (Tuesday, June 11, 2024)
• Introducing USB 3.0, PCIe 2.0 and SATA 3.0 Combo PHY IP Cores to empower Next Gen Connectivity Chipsets (Sunday, June 9, 2024)
• Alphawave Semi Collaborates with Arm on High-Performance Compute Chiplet (Wednesday, June 5, 2024)
• GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers (Thursday, April 18, 2024)
• Arteris Expands Ncore Cache Coherent Interconnect IP To Accelerate Leading-Edge Electronics Designs (Tuesday, March 12, 2024)
• Alphawave Semi Demonstrates 3nm Silicon-Proven 24Gbps Universal Chiplet Express (UCIe) Subsystem for High-Performance AI Infrastructure (Sunday, March 10, 2024)
• Siemens qualifies industry-leading IC design solutions for Intel Foundry processes (Tuesday, February 20, 2024)
• EdgeQ Deploys Arteris IP for its 5G+AI Base Station-on-a-Chip for Wireless Infrastructure (Monday, February 12, 2024)
• SignatureIP launches its new iNoCulator NoC configuration tool with a free trial offer (Thursday, February 1, 2024)
• Ansys Semiconductor Simulation Solutions Certified for UMC's 3D Chip Technology (Wednesday, October 18, 2023)
• Socionext Announces Collaboration with Arm and TSMC on 2nm Multi-Core Leading CPU Chiplet Development (Tuesday, October 17, 2023)