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Internet of Things News

• Tianyihexin Licenses Codasip's L30 for Powering Intelligent Wearable Device Solutions (Tuesday, February 23, 2021)
• Nations' Latest BLE 5 IC Powered By CEVA Bluetooth Low Energy IP (Monday, February 22, 2021)
• New SMUs to optimize battery life in IoT and semiconductors (Monday, February 15, 2021)
• Lattice FPGAs with High I/O Density Bring Low Power Signal Bridging and Interface Management to Edge Devices (Wednesday, February 10, 2021)
• QuickLogic Launches Qomu - an Open Source SoC Dev Kit That Fits in Your USB Port (Tuesday, February 9, 2021)
• Preconfigured platforms connect IoT applications through the cloud (Sunday, February 7, 2021)
• IoT security platform delivers fast, comprehensive connectivity and device management for any root-of-trust (Wednesday, February 3, 2021)
• Palo Alto Networks expands IoT security to healthcare (Tuesday, February 2, 2021)
• Renesas Expands Low-Power Industrial and IoT Applications Reach With New RA4M2 MCU Group in Arm Cortex-Based MCU Family (Tuesday, February 2, 2021)
• NXP Launches Flexible IoT Cloud Platform to Securely Manage and Connect Edge Devices (Tuesday, February 2, 2021)
• IoT Everywhere (Wednesday, January 27, 2021)
• PathPartner Announces PT605 System on Module (SoM) & Smart Camera Reference Design Kit based on Qualcomm® QCS605 SoC (Tuesday, January 26, 2021)
• Dual Mode Bluetooth v5.2 SW Link Layer, Protocol Stack SW, Profiles licensed for ultra-low power 22nm True Wireless (TWS) Earbuds SoC (Monday, January 18, 2021)
• Andes Technology and Rafael Microelectronics Announce a Strategic Partnership to Provide High Power Efficiency Wireless IP Solutions for IoT Devices (Wednesday, January 13, 2021)
• Sequans Introduces Calliope 2: A New Generation of LTE Cat 1 Technology for IoT Applications Requiring Higher Than LTE-M Speed (Tuesday, January 5, 2021)
• SensiML Introduces Free Community Edition of Analytics Toolkit (Monday, December 14, 2020)
• IO and multiprotocol processing in highly demanding embedded architectures (Sunday, November 29, 2020)
• 5G and eSIM technologies will help grow industrial IoT connections to 37b by 2025 (Monday, November 23, 2020)
• CEVA's Bluetooth Low Energy 5.2 Platform is First IP to Receive Bluetooth SIG Qualification (Sunday, November 22, 2020)
• Wi-Fi HaLow Reference Platform Available from Palma Ceia SemiDesign (Thursday, November 19, 2020)
• Dialog launches partner programme for its open industrial IoT edge server (Tuesday, November 17, 2020)
• Dialog Semiconductor Introduces SmartServer™ IoT Partner Ecosystem for Edge Solutions in Smart Buildings and Factories (Monday, November 16, 2020)
• Ultra-low power GNSS Multi-Constellation Digital IP Core licensed to a European Semiconductor company for battery powered IOT & Wearable applications (Monday, November 16, 2020)
• Nestwave Recognized for IoT Innovation in 2020 Mobile Breakthrough Awards Program (Wednesday, November 11, 2020)
• SDR RF IP, 100MHz-2.6GHz, for ultra-low power applications from IoT, M2M to 5G available from T2MIP (Wednesday, October 28, 2020)
• EvoNexus and GLOBALFOUNDRIES Team to Accelerate Growth of Wireless and IoT Startups (Sunday, October 25, 2020)
• GreenWaves Technologies Announces Next Generation GAP9 Hearables Platform Using GLOBALFOUNDRIES 22FDX Solution (Sunday, October 18, 2020)
• CSEM joins forces with GLOBALFOUNDRIES to deliver best-in-class Bluetooth Dual-Mode silicon IP for next generation portable audio (Wednesday, October 14, 2020)
• Industry's first security microcontrollers for a complete IoT lifecycle management solution (Wednesday, October 14, 2020)
• Everactive Adopts Movellus Sub-Microwatt Clocking Solution for its Batteryless IIoT System (Tuesday, October 6, 2020)
• Renesas Launches Arm Cortex-M33-based RA6M4 MCU Group with Superior Performance and Advanced Security for IoT Applications (Monday, October 5, 2020)
• Vidatronic Launches New 22 nm Analog IP For Ultra-Low-Power, System-On-Chip Physical Attack Mitigation In Internet Of Things (IoT) Applications (Wednesday, September 23, 2020)
• Chipus Annouces new power management IP for hearables and wearables (Wednesday, September 23, 2020)
• CEVA Enhances the User Experience and Extends the Use Cases for TWS Earbuds and Hearables with New MotionEngine Hear Sensor Fusion Software (Monday, September 21, 2020)
• Interview with Nestwave CEO: low power geolocation without positioning chipset (Thursday, September 17, 2020)
• Australia Introduces Code of Practice for IoT Devices (Tuesday, September 15, 2020)
• Xilinx Ships Multi-Function Telco Accelerator Card for Growing 5G O-RAN Virtual Baseband Unit Markets (Tuesday, September 15, 2020)
• SIMCom claims NB-IoT Will Accelerate the Expansion of IoT (Sunday, September 13, 2020)
• Synopsys and Nestwave Collaborate to Develop a Low-Power Geolocation IP Solution for IoT Modems (Wednesday, September 2, 2020)
• The biggest IoT mistakes businesses make (Monday, August 31, 2020)
• Dolphin Design Releases its First Development Platform on TSMC 22ULL Process for Smart Home Applications (Sunday, August 23, 2020)
• Proof of concept security platform protects IoT and 5G private networks (Tuesday, August 18, 2020)
• Startup Claims Low-power IoT Geolocation Without a Positioning Chipset (Wednesday, August 12, 2020)
• Dialog Semiconductor's FusionHD™ NOR Flash Memory Compatible and Qualified with its SmartBond™ Bluetooth Low Energy Wireless MCUs (Tuesday, August 11, 2020)
• Gowin Semiconductor Adds Korea Certification For Their Bluetooth Low Energy Enabled MSoC FPGA Modules (Tuesday, August 11, 2020)
• CEVA NB-IoT IP Achieves Monumental Milestone; Awarded Full Certification from Deutsche Telekom (Tuesday, August 11, 2020)
• Aldec's TySOM Embedded Development Kits are Now Qualified for AWS IoT Greengrass (Wednesday, August 5, 2020)
• ON Semiconductor Provides BLE Solution with Veridify (Tuesday, July 28, 2020)
• IoT Growth Demands Rethink of Long-Term Storage Strategies (Tuesday, July 28, 2020)
• Avanci Launches 5G Licensing Platform for the Internet of Things (Tuesday, July 28, 2020)