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• Arasan Announces Industries First MIPI I3C Master IP Core compliant to the I3C HCI Specifications v1.0 (Tuesday, May 8, 2018)
• UMC Reports Sales for April 2018 (Tuesday, May 8, 2018)
• Chinese chip manufacturers to tap TSMC's 7nm process for next-gen AI chips (Monday, May 7, 2018)
• TSMC Details 5 nm Process Tech: Aggressive Scaling, But Thin Power and Performance Gains (Monday, May 7, 2018)
• SiFive Announces Investment from Intel Capital (Monday, May 7, 2018)
• Comcores Announce Availability of flexible eCPRI IP solution (Monday, May 7, 2018)
• DFI Group Releases Initial Version of the DFI 5.0 Specification for High-Speed Memory Controller and PHY Interface (Tuesday, May 1, 2018)
• TSMC's Roadmap Full, But Thin (Tuesday, May 1, 2018)
• New MIPI I3C Host Controller Interface Speeds Sensor Integration (Tuesday, May 1, 2018)
• Credo Demonstrates 112G PAM4 and 56G PAM4 SerDes IP Solutions at TSMC 2018 Technology Symposium (Tuesday, May 1, 2018)
• Mentor enhances tool portfolio for TSMC 5nm FinFET and 7nm FinFET Plus processes and Wafer-on-Wafer stacking technology (Tuesday, May 1, 2018)
• Cadence Collaborates with TSMC to Advance 5nm and 7nm+ Mobile and HPC Design Innovation (Monday, April 30, 2018)
• Cadence Supports New TSMC WoW Advanced Packaging Technology (Monday, April 30, 2018)
• Xilinx Reports Record Annual And Quarterly Revenues (Wednesday, April 25, 2018)
• Silicon Creations Showcases Latest IP Portfolio at TSMC Technology Symposium (Wednesday, April 25, 2018)
• Achronix's Increased Revenue, Expanding Workforce Drives Move to Larger Corporate Headquarters (Wednesday, April 25, 2018)
• Sankalp Semiconductor to Participate in Panel Discussion at The Annual SOI Silicon Valley Symposium (Wednesday, April 25, 2018)
• Samsung's Chip Sales Leadership May be Fleeting (Tuesday, April 24, 2018)
• North American Semiconductor Equipment Industry Posts March 2018 Billings (Tuesday, April 24, 2018)
• Partner in Imagination's owner convicted of insider trading (Tuesday, April 24, 2018)
• TSMC Continues to Dominate the Worldwide Foundry Market (Tuesday, April 24, 2018)
• China's upstart chip companies aim to topple Samsung, Intel and TSMC (Tuesday, April 24, 2018)
• M31 Technology Deploys the Full Range of IP for TSMC 22nm ULP/ULL Process (Tuesday, April 24, 2018)
• Cadence Reports First Quarter 2018 Financial Results (Monday, April 23, 2018)
• 3 Things That TSMC Wants You to Know About Its 7-Nano Tech (Sunday, April 22, 2018)
• Chipmakers' Rout Widens After TSMC Ignites Smartphone Fears (Friday, April 20, 2018)
• Mobile Semiconductor's 22nm ULL Memory Compiler Joins The GLOBALFOUNDRIES FDXcelerator™ Partner Program (Wednesday, April 18, 2018)
• "Quasi-Non-Volatile" Memory Looks to Fill Gap Between Volatile and Non-Volatile Memory (Wednesday, April 18, 2018)
• Qualcomm Begins Layoffs (Wednesday, April 18, 2018)
• TSMC's new chips hint at life after Apple (Wednesday, April 18, 2018)
• Europe rises as chip market stays strong in February (Tuesday, April 17, 2018)
• Soitec to hire 300 people in 2018 (Tuesday, April 17, 2018)
• US export ban on ZTE will hurt Qualcomm, others (Monday, April 16, 2018)
• Samsung is bringing crypto and blockchain tech closer to its core business (Sunday, April 15, 2018)
• TSMC likely to see flat 2Q18 revenues, say reports (Sunday, April 15, 2018)
• China shows it takes Imagination opportunity seriously (Tuesday, April 10, 2018)
• Qualcomm Unveils the Vision Intelligence Platform Purpose-built for IoT Devices Powered by Latest Advances in Camera, AI and Computer Vision (Tuesday, April 10, 2018)
• Cryptocurrency mining IC startup now a TSMC top-ten customer? (Tuesday, April 10, 2018)
• Aldec's HES UltraScale+ Reconfigurable Accelerator and Northwest Logic's PCI Express Cores Provide Proven PCI Express Solution (Tuesday, April 10, 2018)
• TSMC set to beat Intel to become the world's most advanced chipmaker (Monday, April 9, 2018)
• UMC Reports Sales for March 2018 (Monday, April 9, 2018)
• TSMC March 2018 Revenue Report (Monday, April 9, 2018)
• Faraday Monthly Consolidated Sales Report - March 2018 (Monday, April 9, 2018)
• GLOBALFOUNDRIES and Toppan Photomasks extend advanced photomask joint venture in Germany (Sunday, April 8, 2018)
• Silvaco and Silicon Catalyst to provide free IC IP to start-ups (Wednesday, April 4, 2018)
• China, Europe gain share in fabless chip market (Tuesday, April 3, 2018)
• China No.1 in IC package and test (Monday, April 2, 2018)
• Intel sells Wind River to TPG (Monday, April 2, 2018)
• Apple and TSMC starting Apple Watch MicroLED display mass production later this year (Monday, April 2, 2018)
• TSMC advanced packaging seen crucial for HPC chips (Monday, April 2, 2018)