Other News
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eSilicon announces 7nm FinFET ASIC design win
(Monday, January 8, 2018)
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videantis introduces new processor and tools for deep learning
(Monday, January 8, 2018)
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China, Samsung Rise in U.S. Patents
(Monday, January 8, 2018)
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Solar wafer production to see over-capacity by year-end 2018
(Monday, January 8, 2018)
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IFI CLAIMS Announces 2017 Top U.S. Patent Recipients
(Monday, January 8, 2018)
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Chip Sales Grew 22% in 2017, Gartner Says
(Thursday, January 4, 2018)
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TSMC to outpace Samsung in 7nm volume production in 2018
(Wednesday, January 3, 2018)
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Smartphone Production Projected to Increase 5%
(Wednesday, January 3, 2018)
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Samsung Optimizes Premium Exynos 9 Series 9810 for AI Applications and Richer Multimedia Content
(Wednesday, January 3, 2018)
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MIPI Alliance Enhances its MIPI NIDnT Debug and Test Specification to Enable Debugging over the Latest USB Type-C Connectors
(Wednesday, January 3, 2018)
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Global Semiconductor Sales Increase 21.5 Percent Year-to-Year in November
(Tuesday, January 2, 2018)
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CEVA's Bluetooth 5 Low Energy IP certified with Ellisys Bluetooth Compliance Tester
(Tuesday, January 2, 2018)
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OmniVision's First 0.9 Micron Pixel Image Sensor Family Enables Best-in-Class Performance and Features for High-End Smartphones
(Tuesday, January 2, 2018)
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Qualcomm's New Spectra ISP and Camera Modules Enable Nextgen AR
(Tuesday, January 2, 2018)
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Hardent IP Portfolio Supports New Features of HDMI 2.1 Specification
(Tuesday, January 2, 2018)
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Himax Technologies, Inc. to Attend CES on January 8th - 10th , 2018
(Tuesday, January 2, 2018)
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China major AI chipmakers maintain partnerships with TSMC
(Monday, January 1, 2018)
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Baidu Selects ON Semiconductor Image Sensors for its Apollo Autonomous Driving Platform
(Monday, January 1, 2018)
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Samsung, Micron, and NVIDIA Are 2017's Biggest Winners
(Monday, January 1, 2018)
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Silicon Valley AI Chip Startup Gyrfalcon Technology Competes with Intel with its Newly Launched USB Stick
(Sunday, December 31, 2017)
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Globalfoundries gearing up to tap lucrative automotive chip market
(Wednesday, December 27, 2017)
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Intel fails to match TI's 25 year record as No.1
(Tuesday, December 26, 2017)
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Chipus Microelectronics receives ISO 9001 certification
(Thursday, December 21, 2017)
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Qualcomm's Snapdragon 855 Will Be Manufactured Using TSMC's 7nm Node; Chip Giant Will Return To Samsung In 2019
(Thursday, December 21, 2017)
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UMC Announces Availability of 40nm SST Embedded Flash Process
(Wednesday, December 20, 2017)
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2017 Top Ten Foundries: TSMC, GLOBALFOUNDARIES, UMC, SAMSUNG and SMIC are ranked the top 5
(Wednesday, December 20, 2017)
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Moortec: The Implementation of Embedded PVT Monitoring Subsystems in Today's Cutting Edge Technologies.
(Wednesday, December 20, 2017)
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Microchip releases COTS-based rad-tolerant solution
(Wednesday, December 20, 2017)
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M31 Technology launches the world's first 28nm certified USB 3.1 Gen 2 IP solution with Corigine
(Wednesday, December 20, 2017)
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Engineer Spotlight: Shafy Eltoukhy, Head of SiFive's DesignShare Program
(Wednesday, December 20, 2017)
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Samsung in Production of Second-gen 10nm DRAM
(Tuesday, December 19, 2017)
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Samsung to Unveil Wall-Mountable Lifestyle Soundbar at CES 2018
(Tuesday, December 19, 2017)
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Semiconductor Equipment Sales Back on the Rise
(Tuesday, December 19, 2017)
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Aggressive Push into New Growth Markets the "New Normal" at Intel
(Tuesday, December 19, 2017)
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Broadcom Ships Tomahawk 3, Industry's Highest Bandwidth Ethernet Switch Chip at 12.8 Terabits per Second
(Monday, December 18, 2017)
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Implementation of an Architectural Formal Verification Methodology by ArterisIP
(Monday, December 18, 2017)
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STMicro Buys IDE Supplier Atollic
(Monday, December 18, 2017)
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Germany Leads Europe in AVs, Robotics
(Monday, December 18, 2017)
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North American Semiconductor Equipment Industry Posts November 2017 Billings
(Sunday, December 17, 2017)
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Top ten Chinese chip companies ranked
(Sunday, December 17, 2017)
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STMicroelectronics'Single-Chip Balun for sub-1GHz Radio Practically Makes Antenna-Matching/Filtering Circuitry Disappear
(Sunday, December 17, 2017)
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IEDM 2017 - Intel Versus GLOBALFOUNDRIES at the Leading Edge
(Saturday, December 16, 2017)
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ICE-P3 EPU UPGRADE SIMPLIFIES CONTROL OF ON-CHIP AND EXTERNAL RESOURCES TO SAVE MORE POWER IN SoC AND MCU DESIGNS
(Wednesday, December 13, 2017)
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Catena selects Thalia-DA to facilitate analog IP re-use
(Tuesday, December 12, 2017)
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SMIC and Efinix Quickly Deliver the First Quantum-Accelerated Silicon Product
(Tuesday, December 12, 2017)
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Innovative Logic USB 3.1 Gen 2 IP got Certification from USB-IF
(Tuesday, December 12, 2017)
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iC-Haus Selects Synopsys' IC Validator and StarRC for Signoff
(Tuesday, December 12, 2017)
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Synopsys Completes Acquisition of Black Duck Software
(Monday, December 11, 2017)
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VESA Defines New Standard to Help Speed PC Industry Adoption of High Dynamic Range Technology in Laptop and Desktop Monitor Displays
(Monday, December 11, 2017)
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Averant's Solidify 6.5 Significantly Improves Combinational and Sequential Equivalency Checking and Clock Domain Crossing Checks
(Monday, December 11, 2017)
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