Other News
-
MIPI Alliance Opens Access to its MIPI I3C Sensor Interface Specification
(Monday, December 11, 2017)
-
Performance-IP, CEVA Collaborate to Accelerate DSP System Performance
(Monday, December 11, 2017)
-
Open-Silicon to Demonstrate its High Bandwidth Memory (HBM2) IP Subsystem Solution for High Performance Computing Applications and Showcase its Comprehensive IP Subsystem Solution for High-End Networking Applications
(Monday, December 11, 2017)
-
Starblaze Uses Synopsys DesignWare IP to Launch SSD Controller SoC
(Monday, December 11, 2017)
-
Independent Research Firm Names Synopsys a Leader in Static Application Security Testing
(Monday, December 11, 2017)
-
Euresys Acquires Sensor to Image
(Sunday, December 10, 2017)
-
SOI wafers optimized for NIR, 3D imaging
(Sunday, December 10, 2017)
-
Synopsys White Paper on IoT Security - Introduces DesignWare Root-of-Trust Module
(Sunday, December 10, 2017)
-
UltraSoC and Percepio hook up
(Wednesday, December 6, 2017)
-
IPrium offers the ModemKit for immediate wireless IP Cores evaluation
(Monday, December 4, 2017)
-
For the 3rd Time, ArterisIP Appears on the Inc. 5000 list
(Monday, December 4, 2017)
-
Think Silicon Joins SiFive's Growing DesignShare Ecosystem
(Monday, December 4, 2017)
-
Digital Core Design introduces I3C IP Core
(Monday, December 4, 2017)
-
Soitec hosts its first Capital Market Day
(Sunday, December 3, 2017)
-
Synopsys Posts Financial Results for Fourth Quarter and Fiscal Year 2017
(Wednesday, November 29, 2017)
-
Soitec, the FD-SOI wafer manufacturer, has announced half year revenues to the end of September.
(Wednesday, November 29, 2017)
-
Transphorm raises $15m from major customer for GaN develeopment
(Tuesday, November 28, 2017)
-
Toshiba Memory America Unveils UFS Devices Utilizing 64-Layer, 3D Flash Memory
(Tuesday, November 28, 2017)
-
CEA-Leti Moves Fast on New CEO
(Monday, November 27, 2017)
-
Siemens set to buy EDA firm Solido
(Monday, November 27, 2017)
-
SkyWater acquires specialty foundry business
(Sunday, November 26, 2017)
-
Xilinx Single-Chip Solution with On-Chip Redundancy for Functional Safety Speeds Up IEC 61508 Certification and Reduces Systems Development Cost
(Tuesday, November 21, 2017)
-
Soitec Tunes Wafers for RF, Imagers, Photonics
(Tuesday, November 21, 2017)
-
2017全球半导体排名洗牌：三星取代英特尔成龙头
(Monday, November 20, 2017)
-
Marvell宣布以60亿美元收购竞争对手Cavium
(Monday, November 20, 2017)
-
ICCAD 2017 向建军： IoT浪潮下的机遇和挑战|锐成芯微现场
(Monday, November 20, 2017)
-
2017年全球60家潜力新创公司榜单出炉：谁能成为下一个Intel或Arm？
(Monday, November 20, 2017)
-
Microsemi Announces IEEE 1588 Timing Synchronization Module Providing High Performance Network Clock Synchronization
(Monday, November 20, 2017)
-
Samsung Forecast to Top Intel as the #1 Semiconductor Supplier in 2017
(Sunday, November 19, 2017)
-
GLOBALFOUNDRIES, Fudan Team to Deliver Next Generation Dual Interface Smart Card
(Sunday, November 19, 2017)
-
Sankalp Semiconductor receives STPI Highest Exporter award
(Sunday, November 19, 2017)
-
被对手举报 台积电证实正遭欧盟反垄断调查
(Sunday, November 19, 2017)
-
Synopsys宣布在中国设立战略投资基金
(Sunday, November 19, 2017)
-
Global Unichip Successfully Tapes Out 16nm TCAM Compiler
(Wednesday, November 15, 2017)
-
GLOBALFOUNDRIES Demonstrates Industry-Leading 112G Technology for Next-Generation Connectivity Solutions
(Tuesday, November 14, 2017)
-
Samsung's Capex Seen Crushing Memory Startups
(Tuesday, November 14, 2017)
-
Cypress Achieves Aerospace-Grade QML Certification for its 65nm and 40nm SRAM Devices at UMC
(Tuesday, November 14, 2017)
-
Qualcomm officially rejected the acquisition, Broadcom said it would not give up
(Monday, November 13, 2017)
-
Cray building Arm-based supercomputer
(Monday, November 13, 2017)
-
Kilopass Achieves 1000-Hour Qualification on Mie Fujitsu Semiconductor Highly Demanded 40nm Low Power Process
(Monday, November 13, 2017)
-
Announcing the Opening of the Global Unichip Corporation Tainan Office
(Sunday, November 12, 2017)
-
Samsung Shows EUV Design at ISSCC
(Sunday, November 12, 2017)
-
China Passes U.S. in Supercomputers
(Sunday, November 12, 2017)
-
Cadence and Synopsys localized their company in Nanjing, China. Nanjing will be the next Chip Center of China?
(Sunday, November 12, 2017)
-
Rambus Announces Proposed $150 Million Convertible Senior Notes Offering
(Sunday, November 12, 2017)
-
台積公司2017年10月營收報告
(Thursday, November 9, 2017)
-
Barco Silex Partners with Intrinsic ID for North American Representation
(Wednesday, November 8, 2017)
-
UMC Reports Sales for October 2017
(Wednesday, November 8, 2017)
-
Moortec to exhibit their embedded In-Chip Monitoring Subsystem IP at the 2017 ICCAD in Beijing
(Tuesday, November 7, 2017)
-
Invensas DBI Technology Now Available at SMIC
(Tuesday, November 7, 2017)
Previous
