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Thursday, March 26, 2026

• TES unveils a next-generation Elliptic Curve Digital Signature Algorithm (ECDSA) IP Core for Secure IoT, Blockchain, and Industrial Systems
• Imec names NVIDIA’s Jensen Huang as recipient of the 2026 imec Lifetime of Innovation Award
• STMicroelectronics China-manufactured STM32 microcontrollers begin volume production
• Cadence Recognized as a Platinum Employer on the Where You Work Matters List
• Pioneering Silicon Valley Innovator Joins Aion Silicon as Engineering VP
• Cadence and NVIDIA Unveil Accelerated Engineering Solutions Purpose-Built for Agentic AI Chip and System Design​
• Alibaba delivers RISC-V server chip optimized to run China’s top AI models
• Reliable performance with RISC-V: Why architecture, microarchitecture and compilers must work together
• Synopsys Supports New Arm AGI CPU with Full-Stack Design Solutions
• Memory Is the New Bottleneck in AI Semiconductors
• Faraday Highlights 40nm SONOS eNVM as NOR Flash Alternative for MCU Designs
• Siemens launches Teamcenter Digital Reality Viewer and Digital Twin Composer in India
• Verification Engineers Are Poised to Become Verification Scientists
• Scoping out the chiplet-based design flow
• Chiplets: 8 best practices for engineering multi-die designs
• CEA-Leti and Fraunhofer IPMS Validate Wafer Exchange for Ferroelectric Memory Materials Within the FAMES Pilot Line

Wednesday, March 25, 2026

• Arteris Named to Fast Company’s Annual List of the World’s Most Innovative Companies of 2026

Tuesday, March 24, 2026

• Arteris Network-on-Chip IP Deployed in Renesas’ Next-Gen R-Car Automotive Technology
• CAST Introduces PDM-to-PCM IP Core for Easy Interfacing of Digital Microphones with SoCs
• TDE000S – Secure, Compact RISC-V IP Core Processing

Monday, March 23, 2026

• Jmem Tek Joins GlobalFoundries Ecosystem to Expand Post-Quantum Security Solutions
• Synopsys' vision for engineering the future
• India Making Significant Progress Toward Semiconductor Workforce Development Under C2S
• Samsung and AMD Expand Strategic Collaboration on Next-Generation AI Memory Solutions
• Siemens Invests More Than $165 Million to Expand Manufacturing Across the Carolinas, Supporting U.S. Data Center Growth
• IntoPIX Titanium Apps Achieve IPMX Certification
• Keysight Launches SBOM Manager to Help Organizations Prepare for Emerging Global Cybersecurity Regulations
• AimFuture and ITM Semiconductor to Develop AI-Integrated Technology for Robotics and Mobility
• ForwardEdge ASIC Selects BrainChip’s Neuromorphic Computing for Future ASICs
• Synopsys expands AI chip design stack with hardware-assisted verification, tightening development timelines
• NVIDIA and Global Industrial Software Giants Bring Design, Engineering and Manufacturing Into the AI Era

Friday, March 20, 2026

• ASIC North achieves AS 9100D and ISO 9001:2015 certifications

Thursday, March 19, 2026

• Infineon executive urges Europe to build larger, automated fabs
• Taiwan’s Emerging Power Electronics Strategy in the AI Era
• STMicroelectronics accelerates global adoption and market growth of Physical AI with NVIDIA
• Nordic Semiconductor launches flat-rate FOTA solution, readying customers for Cyber Resilience Act
• STMicroelectronics expands 800 VDC AI datacenter power conversion portfolio with new 12V and 6V architectures in collaboration with NVIDIA
• Synopsys Showcases NVIDIA Partnership Impact and Ecosystem Innovation at GTC 2026
• Mythic® Selects memBrain™ Technology from Silicon Storage Technology® for its Next Generation of Ultra-Low-Power Analog Processing Units
• Cadence and NVIDIA Unveil Accelerated Engineering Solutions Purpose-Built for Agentic AI Chip and System Design​
• MIPS and Green Hills Software Accelerate Safety Certified Product Development for MIPS RISC-V Microcontrollers
• Tenstorrent QuietBox 2 Brings RISC‑V AI Inference to the Desktop
• Memory Moves: Upgrades to HBM4, eMMC, LPDDR5X, & MRAM Across Industries
• Keysight Launches AI Inference Emulation Platform to Validate and Optimize AI Infrastructure
• Synopsys Outlines Vision for Engineering the Future

Wednesday, March 18, 2026

• The Future of Semiconductors: A Deep Dive with Tomi-Pekka Takalo

Tuesday, March 17, 2026

• Siemens launches Fuse EDA AI Agent for automation across semiconductor, 3D IC and PCB system workflows

Monday, March 16, 2026

• Chip Foundry TSMC Says Its Sales Rose 22% In February
• Soitec and NSIG to agree extension of licensing framework
• Reshaping the technology landscape in Europe
• SEMIFIVE Signs Turnkey Design Contract Worth KRW 18,000 Million With AI Semiconductor Fabless Company
• GlobalFoundries Announces Pricing of Public Secondary Offering and Concurrent Share Repurchase
• Silvaco Reports Fourth Quarter and Full-Year 2025 Financial Results
• Credo Acquires CoMira Solutions
• Keysight Introduces New 224G Test Solutions to Enable 1.6T Optical Network Validation
• Ceva’s NeuPro-Nano NPU Wins Artificial Intelligence Award at embedded world 2026
• BrainChip Enables the Next Generation of Always-On Wearables with the AkidaTag© Reference Platform
• Klepsydra Technologies and BrainChip Announce Strategic Partnership to Deliver Heterogeneous AI Runtime for Akida™ Neuromorphic Processors
• Faster and more energy-efficient electronics with 3D chip design
• AI Chip Design From Heilbronn
• IBM, Lam Research Focus High-NA EUV on Sub-1-nm Nodes