Search News

Friday, March 13, 2026

• RISC-V TDS350N IP Core: A55-Class Performance, AI Acceleration processor for AI and ML Scenarios

Thursday, March 12, 2026

• TES Unveils High-Performance 8/40MHz Oscillator and Clock Buffer IPs for Reliable On-Chip Timing Solutions for X-FAB XT018 - 0.18µm BCD-on-SOI technology.
• Soitec Secures Multi- Year Agreement to Supply POI Wafers for Skyworks’ Sky5 Platform
• BOS Semiconductors’ AI Semiconductor Design Technology for Future Mobility Recognized as National Strategic Technology
• Movellus Advanced Clocking IP Selected for QuickLogic’s Strategic Radiation Hardened FPGA Program
• GlobalFoundries Announces Availability of AutoPro150 eMRAM Technology on Enhanced FDX Platform for Advanced Automotive Applications
• CEA-Leti and NcodiN Partner to Industrialize 300 mm Silicon Photonics for Bandwidth-Hungry AI Interconnects
• Hexagon Semi’s HX77 AR Display Processor Achieves Ultra-Low Power Consumption with VeriSilicon’s Nano IP Portfolio
• Allegro DVT Launches DWP300 DeWarp Semiconductor IP
• A CHERI on Top: A Better Way to Build Embedded Secure SoCs
• Keysight Debuts Purpose-Built 1.6T Ethernet AI Workload Emulation Platform to Validate Next-Generation AI Fabrics
• Axelera® AI Adds Kudelski Labs’ Security IP to Europa® Chip to Enable Secure, High-Performance Edge AI
• Synopsys Launches Electronics Digital Twin Platform to Accelerate Physical AI System Development
• Samsung to Make Ubitium’s Universal RISC-V Processor
• Samsung Applies 2nm Process to HBM Memory
• Movellus Partners with Synopsys to Deliver Power Efficiency for Next Generation IC’s
• CAST Debuts TSN-EP-10G IP for High-Performance, Time-Sensitive Networking Ethernet Designs
• Synopsys Launches Electronics Digital Twin Platform to Accelerate Physical AI System Development
• Silvaco Announces Immediate Availability of Production Ready Mixel MIPI PHY IP, Strengthening its Comprehensive Silicon IP Offering

Tuesday, March 10, 2026

• Ceva Launches Next-Generation UWB IP with Extended Range and Higher Throughput
• EnSilica plc - New Contract Wins and Programme Upgrades
• CAST Introduces 400 Gbps UDP/IP Hardware Stack IP Core for High-Performance ASIC Designs
• Microservice Store Launches the IoT Transparency Portal: Transparent view of SBOM, and live vulnerability status.

Monday, March 9, 2026

• CAST Demonstrates IP Cores for Leading-Edge Technologies at Embedded World 2026
• Axelera Raises $250M in Largest EU Semi Round Ever
• Nvidia and Lumentum form $2bn AI optics partnership
• STMicroelectronics enters high-volume production of its industry-leading silicon photonics platform to support AI infrastructure demand
• Nvidia Advances AI-Native Strategy at MWC
• Is Your IoT Strategy Ready for the New Landscape?
• Nordic Semiconductor Expands Cellular IoT Portfolio
• Keysight Demonstrates 5G-Advanced AI-Powered Channel State Information Compression and Paves the Way for 6G
• STMicroelectronics’ new STM32 series redefines entry-level microcontroller performance and value for smart devices everywhere
• The path to RISC-V growth: Why software consistency is becoming crucial
• Linaro, Arm Launch CoreCollective Open Consortium
• Global 2nm Supply Crunch: TSMC Leads as Intel 18A, Samsung, and Rapidus
• Rapidus to Make Chips for Canon, Synopsys on Trial
• Intel CEO embraces its 18A node for external customers as 18A-P gets 'inbound interest' — company cites increasing yields

Thursday, March 5, 2026

• QuickLogic Reports Fiscal Fourth Quarter and Full Year 2025 Financial Results
• Infineon and UMC partner in driving decarbonization across the supply chain
• ST technologies integrated into Qualcomm’s new Snapdragon Wear Elite platform
• Keysight and Qualcomm Advance RF Digital Twins to Scale Massive MIMO and AI-Native 6G Research
• Infineon expands DRIVECORE portfolio with three new software bundles, accelerating customer transition toward future RISC‑V automotive microcontrollers
• Renesas Expands Auto MCU Portfolio with 28nm RH850/U2C for Vehicle Control and Automotive Safety Applications
• Kudelski Labs Addresses Device Lifecycle Security, Edge AI, Post Quantum Cryptography and Regulatory Compliance at Embedded World 2026
• Keysight and Samsung Demonstrate End-to-End AI-RAN Validation Workflow with NVIDIA
• The Rise of RISC-V
• Samsung Ships Industry-First Commercial HBM4 With Ultimate Performance for AI Computing
• Rambus Sets New Benchmark for AI Memory Performance with Industry-Leading HBM4E Controller IP

Wednesday, March 4, 2026

• EU backs €1.1bn French cleantech manufacturing push
• Renesas Advances Its India and China Strategy with Strengthened Leadership
• STMicroelectronics’ new STM32 series redefines entry-level microcontroller performance and value for smart devices everywhere
• Innatera Selects Synopsys Simulation to Scale Brain-Inspired Processors for Edge Devices
• Ceva Launches PentaG-NTN™ 5G Advanced Modem IP, Enabling Satellite-Native Innovators to Rapidly Deploy Differentiated LEO User Terminals

Tuesday, March 3, 2026

• DCD-SEMI to Showcase CAN XL with Functional Safety and RISC-V Subsystems at Embedded World 2026 – Booth 4-481
• RISC-V IP Core, Powering Next-Gen Automotive & AI SoCs
• Faraday Broadens IP Offerings on UMC’s 14nm Process for Edge AI and Consumer Markets

Monday, March 2, 2026

• Jmem Tek Joins the Intel Foundry Accelerator Ecosystem Alliance Program, Enabling JPUF and Post-Quantum Security Designs
• As AI scales, so do CPUs
• Synopsys Posts Financial Results for First Quarter Fiscal Year 2026
• Rapidus Secures 267.6 Billion Yen in Funding from Japan Government and Private Sector Companies
• BrainChip Named Official Technology Sponsor for Raytheon’s "Operation Touchdown" Autonomous Vehicle Competition
• Weebit Nano achieves record half-year revenue; licenses ReRAM to Tier-1 Texas Instruments
• MWC: Ericsson and Intel join for 6G AI-RAN
• Renesas Looks to the Future of Automotive With New Memory and SoC Tech
• Microservice Store Launches Security Support Partnership Program
• Samsung Electronics Announces Strategy To Transition Global Manufacturing Into ‘AI-Driven Factories’ by 2030
• TES offers new High-Speed Comparator IPs for X-FAB XT018 - 0.18µm BCD-on-SOI technology.
• Siemens accelerates integrated circuit design and verification with agentic AI in Questa One
• ASML announces breakthrough in EUV light source to boost chip output
• TES offers new High-Speed Comparator IPs for X-FAB XT018 - 0.18µm BCD-on-SOI technology.