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Thursday, February 6, 2025

• Samsung Foundry 2 nm initial yields highly promising after last year's 3 nm struggles
• High-Performance 16-Bit ADC and DAC IP Cores Now Available for Licensing

Wednesday, February 5, 2025

• Intel partners with Japanese research institution for next-generation quantum computer
• Post-Quantum Cryptography–Securing Semiconductors in a Post-Quantum World
• Arm Holdings plc Reports Results for the Third Quarter of the Fiscal Year Ended 2025
• Why UCIe is Key to Connectivity for Next-Gen AI Chiplets
• Axiomise Launches footprint, Area Analyzer for Silicon Design

Tuesday, February 4, 2025

• Arm Reports Record Revenue in Q3
• Global semiconductor revenue to hit $705 billion in 2025 on rising AI demand
• Cadence Virtuoso Studio advanced optimization enhances MediaTek's efficiency by 30%
• Ceva-Waves Wi-Fi 6 IP Powers WUQI Microelectronics Wi-Fi/Bluetooth Combo Chip
• Accellera Board Approves Universal Verification Methodology for Mixed-Signal (UVM-MS) 1.0 Standard for Release
• GlobalFoundries Announces Leadership Transition to Drive Next Phase of Growth
• Mirabilis Design Adds System-Level Modelling Support for Industry-Standard Arteris FlexNoC and Ncore Network-on-Chip IPs

Monday, February 3, 2025

• Predictions for Multi-Die System Designs in 2025
• The First Step to a Quantum-Safe Future With Samsung Knox
• OpenAI, SoftBank tap Samsung for Stargate AI initiative
• CHERI Protects Memory at the Hardware Level
• TSMC plans for 1nm-capable gigafab in Tainan, says report
• CoMira Solutions unveils its new 1.6T Ethernet UMAC IP
• Rambus Reports Fourth Quarter and Fiscal Year 2024 Financial Results
• intoPIX Unveils Cutting-Edge AV Innovations at ISE 2025
• RISC-V in Space Workshop 2025 in Gothenburg
• Dolphin Semiconductor strengthens its governance with two key Board appointments

Sunday, February 2, 2025

• Cadence aims to strengthen its presence in India's growing data center sector
• AI chips in 2025: Smaller, faster, smarter
• TSMC Accelerates Efforts To Achieve 1nm Production, Plans To Set Up "Giga Fabs" In Taiwan
• UK Space Agency Awards EnSilica £10.38m for Satellite Broadband Terminal Chips
• Intel Halts Products, Slows Roadmap in Years-Long Turnaround
• UK Space Agency Awards EnSilica £10.38m for Satellite Broadband Terminal Chips

Friday, January 31, 2025

• European Commission Funds €3 Million ($3.1 Million USD) Quantum Chip Project to Address Scalability Challenges
• Forget CPUs! RaiderChip Has a Hardware-Based Generative AI Accelerator

Thursday, January 30, 2025

• Barcelona will host a new quantum computer at the BSC-CNS
• Europe approves €48m for Envision AESC French battery gigafactory
• Cadence: Leveraging Sustainability for a Competitive Edge
• Rapidus aims to deploy 10 EUV machines for 2nm chip production in Japan

Wednesday, January 29, 2025

• More than €1 billion from the European Defence Fund to develop next generation defence technologies and innovation
• Poland Advances Development of Military Quantum Computer Prototype, Source Says
• Synopsys makes a bold prediction
• Intel 18A Process Technology Simply Explained
• EXTOLL collaborates with BeammWave and GlobalFoundries as a Key SerDes IP Partner for Lowest Power High-Speed ASIC
• Celestial AI Announces Appointment of Semiconductor Industry Icon Lip-Bu Tan to Board of Directors
• Baya Systems Welcomes Manish Muthal and Siva Yerramilli to Board of Directors
• intoPIX and EvertzAV Strengthen IPMX AV-over-IP Interoperability with Groundbreaking JPEG XS TDC Compression Capabilities at ISE 2025
• Codasip and RED Semiconductor Sign Memorandum of Understanding to Develop AI Acceleration Technologies
• Quadric Opens Subsidiary in Japan with Industry Veteran Jan Goodsell as President
• Ceva, Inc. Appoints Amir Faintuch to its Board of Directors
• Keysight and KD Partner to Advance Multigigabit Optical Automotive Ethernet Testing with New Signal Analysis Capability

Tuesday, January 28, 2025

• Mixel Announces the Opening of New Branch in Da Nang, Vietnam
• intoPIX and Nextera-Adeas Announce Latest IPMX Demo Design with JPEG XS on Compact FPGAs at ISE 2025
• Certus releases radiation-hardened I/O Library in GlobalFoundries 12nm LP/LP+

Monday, January 27, 2025

• Automotive Chiplet Ecosystem Heralds Agility and Flexibility
• SoftBank and Quantinuum Target Practical Applications for Quantum Computing and AI
• Codasip, RED Semiconductor team for RISC-V AI acceleration
• Alphawave Semi to Showcase Innovations and Lead Expert Panels on 224G, 128G PCIe 7.0, 32G UCIe, HBM 4, and Advanced Packaging Techniques at DesignCon 2025
• Plexus and intoPIX Expand IPMX Solutions Offering

Sunday, January 26, 2025

• TeraSignal Demonstrates Interoperability with Synopsys 112G Ethernet PHY IP for High-Speed Linear Optics Connectivity
• RaiderChip unveils its fully Hardware-Based Generative AI Accelerator: The GenAI NPU