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Friday, November 7, 2025

• Aion Silicon Expands Barcelona Design Center to Meet Surging Demand for ASIC and SoC Solutions

Thursday, November 6, 2025

• CoreHW’s Locator and Tag Series Achieve Bluetooth Certification
• BOS Semiconductors Driving Innovation in Automotive AI Chips
• Canadian semiconductor leaders see opportunity, and risk, in US takeovers
• SEMI Reports Worldwide Silicon Wafer Shipments Increase 3% Year-on-Year in Q3 2025
• European sales of semiconductors up 7.2% QoQ in the last quarter
• SEALSQ and IC’Alps Unify Expertise to Deliver Integrated Post-Quantum Cybersecurity and Functional Safety for Autonomous Vehicles
• Keysight and MediaTek Collaborate to Advance Pre-6G Integrated Sensing and Communication Technology
• RISC-V Summit spurs new round of automotive support
• Thalia Design Automation announces AMALIA Platform release 25.3 qualified for advanced process nodes down to 4nm
• Europe Must Play to Its Strengths
• Samsung’s Taylor Plant In Texas About To Commence Operations, New Report Says ASML Will Form A Team Soon To Set Up EUV Machinery And Ease Production Transition
• Perceptia Updates Design Kit for pPLL03 on GlobalFoundries 22FDX Platform
• Logic Fruit Technologies Appoints Sunil Kar as President & CEO to Accelerate Global Growth

Wednesday, November 5, 2025

• Ceva Partners with Microchip Technology to Enable AI Acceleration Across Edge Devices and Data Center Infrastructure
• CAST Expands Security IP Line with New Family of Post-Quantum Cryptography Cores

Tuesday, November 4, 2025

• Arteris Selected by Altera to Advance Intelligent Computing Across Cloud-to-Edge Applications

Monday, November 3, 2025

• Siemens and Capgemini deepen partnership to empower industries for the next era of manufacturing
• ASIL Qualified MIPI C-PHY/D-PHY IP Core Delivering Industry-Leading Performance for Automotive SoCs in advanced process nodes
• QuickLogic to Exhibit at Embedded World North America 2025
• Recycling Rare Earths: Europe’s Push for Independence
• Samsung Teams With NVIDIA To Lead the Transformation of Global Intelligent Manufacturing Through New AI Megafactory
• TSMC A14 fab construction approved, set to start soon: Science park
• Cadence Completes Acquisition of Secure-IC
• The next RISC-V processor frontier: AI
• Arm Opens Access to Chiplet Architectures and AI Platforms
• Chiplet-Based Solutions Accelerate the Development of Embedded NVM
• BOS Semiconductors and Tenstorrent Partner to Build an Open Chiplet Ecosystem
• Keysight Advances Quantum Engineering with New System-Level Simulation Solution
• GlobalFoundries and Silicon Labs Expand Partnership to Accelerate Wireless Connectivity Solutions and Strengthen U.S. Chip Manufacturing
• Introducing Microservice Store - A New Era for Embedded Systems Begins
• Qualitas Semiconductor Expands Global Presence with 4nm UCIe and PCIe Gen 6.0 IP Licensing Agreement in the U.S. AI Market

Friday, October 31, 2025

• Northern Poland: Building Europe’s Next Semiconductor and Mobility Hub
• PUFsecurity’s PUFrt Anchors the Security of Silicon Labs’ SoC to Achieve the Industry’s First PSA Certified Level 4

Thursday, October 30, 2025

• Synopsys Spotlights Agentic AI, Accelerated Computing, and AI Physics at NVIDIA GTC Washington, D.C.
• Faraday Reports Third Quarter 2025 Results
• Cadence Reports Third Quarter 2025 Financial Results
• Socionext Unveils "Flexlets™", a Configurable Chiplet Ecosystem to Accelerate Multi-die Silicon Innovation
• GlobalFoundries Plans Billion-Euro Investment to Expand Chip Manufacturing in Germany

Wednesday, October 29, 2025

• Rambus Shines in Earnings Call with Record Growth
• MosChip to Launch ProductXcelerate™ Blueprints at Embedded World North America
• Ceva and embedUR systems Partner to Launch ModelNova for NeuPro NPU Family, Expanding Edge AI Model Ecosystem

Tuesday, October 28, 2025

• European chips also for defense: Merz visits Globalfoundries
• Nordic Semiconductor first to bring Bluetooth Channel Sounding to open-source Android app
• Keysight to Showcase Quantum-AI Collaboration at GTC 2025 with NVIDIA NVQLink

Monday, October 27, 2025

• Cadence forecasts fourth-quarter profit below estimates as US-China trade tensions weigh
• Key ASIC Berhad Secures Repeat AI ASIC Order Worth RM2.088 Million
• Intel Stock Hits 18-Month High as AI Hype and $15 B Deals Fuel Stunning Rally
• CAST looks to simplify RISC-V IP adoption with new program
• Advanced Deposition Chemistry for Sub-2nm Chips
• Bosch, Volkswagen, Nokia and Europe’s Tech Giants Unite to Secure Photonics Future in FP10
• Cambridge GaN Devices partners with GlobalFoundries for advanced power devices
• FortifyIQ Secures the Quantum Era with Over-the-Air Updatable Cryptography
• Arm VP highlights Korea as rising hub for AI semiconductor innovation
• Europe Urged to Mobilize Private Capital for Quantum Competitiveness
• Intellectual Property Office survey: AI boom drives patent applications, placing Taiwan top 10
• The AI Chip Wars Intensify: Patent Battles Threaten to Reshape Semiconductor Innovation
• Nordic Semiconductor’s nRF Cloud powered by Memfault wins Cloud Computing Innovation of the Year Award at Mobile Breakthrough Awards
• Tesla splits AI5 chip production between Samsung and TSMC in strategic dual-foundry move
• Arm AI Chiplets Drive Open Standard for AI Infrastructure
• VSORA Launches Europe’s Most Powerful AI Inference Chip
• RISC-V Takes First Step Toward International Standardization as ISO/IEC JTC1 Grants PAS Submitter Status
• SmartDV Announces Multiple Customer Licenses for MIPI® SoundWire® I3S℠ 1.0 IP Portfolio
• UMC Introduces 55nm BCD Platform to Elevate Power Efficiency for Smartphones, Consumer Electronics, and Automotive Applications
• Intel's 18A Process Challenges TSMC, Samsung Foundry