Search News

Tuesday, June 7, 2022

• €140m 3D chip research centre opens in Dresden
• CEVA Bluetooth® 5.3 Platform IP Supports New Auracastâ„¢ Broadcast Audio, Transforming the Shared Audio Experience
• CEVA Bluetooth® 5.3 Platform IP Supports New Auracast™ Broadcast Audio, Transforming the Shared Audio Experience
• QuantWare awarded €7.5M from the European Innovation Council to rapidly scale superconducting quantum processors
• QuantWare awarded €7.5M from the European Innovation Council to rapidly scale superconducting quantum processors
• Agile Analog signs first Chinese licensee for its analog IP
• Arm introduces new image signal processor to advance vision systems for IoT and embedded markets
• Intrinsic ID Announces Embedded SRAM PUF Security IP for Military-Grade IP protection in Intel FPGAs
• Spectronite introduces a high-performance 5G wireless solution for mobile operators
• The Automotive Industry is driving down acceptable chip defect levels
• Agile Analog signs first Chinese licensee for its analog IP
• 14-bit, 4.32Gsps Ultra high speed Wideband, Time-Interleaved Pipeline ADC IP Cores available for license to customers for wide range of applications

Monday, June 6, 2022

• proteanTecs Raises $45M to Enable Deep Data Analytics for Electronics Monitoring
• IntoPIX teams up with Nextera and Adeas to participate in live IPMX interoperability demonstrations at InfoComm 2022
• Imagination expands with new UK office in Manchester
• Real Intent Extends Meridian RDC's Low Noise Reporting & Debug Technology Leadership
• Global Semiconductor Sales Increase 21.1% Year-to-Year, 0.7% Month-to-Month in April
• TSMC Commits to Nanosheet Technology at 2 nm Node
• UMC Reports Sales for May 2022

Sunday, June 5, 2022

• Taiwan talks show EU urgency on chips
• Cyient to Acquire Portugal-Based Celfinet to Strengthen its Wireless Communications Offerings
• Flex Logix Launches EasyVision - Turnkey AI/ML Solution with Ready-to-Use Models and AI Acceleration Hardware
• GBT is Researching the Development of a Unified, Machine Learning-driven, Automated IC Design Environment
• GUC Monthly Sales Report - May 2022
• AP Memory launches brand-new product series of 512Mb Ultra-High-Speed (UHS) and 32Mb Ultra-Low-Swing (ULS) PSRAM
• Silicon qualified, Ultra-low power Analog Data-Convertors IP Cores (ADCs) available for license to the customers for wide range of IoT applications

Wednesday, June 1, 2022

• u-blox releases full-featured platform to test and validate IoT solutions
• Cadence Accelerates Industrial, Automotive, Hyperscale Data Center, and Mobile SoC Verification with Expanded VIP and System VIP Portfolio
• CAES and Ashling announce Ashling's RiscFree C/C++ Toolchain for CAES' NOEL-V Processors
• Semiconductor Growth Still Seen at 11% Despite 2022 Headwinds
• Credo Introduces Industry Leading 40Gbps PAM3 SerDes Technology To Address New Markets Requiring High-speed, Low-Power Connectivity
• CEA-Leti & Intel Report Die-to-Wafer Self-Assembly Breakthrough Targeting High Alignment Accuracy and Throughput
• Global Semiconductor Equipment Billings Grow 5% Year-Over-Year in Q1 2022, SEMI Reports
• Riviera-PRO Supports OpenCPI for Heterogeneous Embedded Computing of Mission-Critical Applications
• Trusted Objects adds Crypto Quantique's QuarkLink Platform to its Software Root-of-Trust for End-to-End IoT Device Security
• Intrinsic ID to Attend Multiple Industry Events in June Addressing Increasing Need for Device-Level Security
• NEUCHIPS' Purpose-Built Accelerator Designed to Be Industry's Most Efficient Recommendation Inference Engine
• aiMotive ships first aiWare4 NPU production RTL

Tuesday, May 31, 2022

• Synopsys Launches the Era of Smarter SoC Design with ML-Driven Big Data Analytics Technology
• QuickLogic Awarded New $3.0 Million eFPGA Contract
• VeriSilicon Image Signal Processor IP Achieved IEC 61508 Industrial Functional Safety Certification
• Jose Cano Joins Alphawave IP as Global Head of Investor Relations

Monday, May 30, 2022

• Samsung's huge investment plan seen unlikely to unseat TSMC
• Heads of Samsung and Intel Discuss Korea-U.S. Semiconductor Alliance
• Socionext starts to ship HD-PLC LSI compliant with IEEE 1901-2020
• Renesas Unveils Industry's First I3C Intelligent Switch Family for Next Generation Server, Storage and Communications Systems
• imec Leads Semiconductor Value Chain in Joint Effort Toward Net-zero Emissions for Chip Manufacturing
• PNG Image Decoder IP Core Available from CAST and IObundle
• Faraday Launches Soteria! Security IP Subsystem for IoT ASIC
• Imagination launches Open Access program, providing scale-ups with a low-cost path to differentiated silicon
• Barry Paterson is the new Agile Analog CEO

Sunday, May 29, 2022

• Capgemini opens new centers specialized in Cybersecurity and Cloud services in Malaga, Spain
• ADTechnology to launch its 5nm A53-based Platform, ADP500 based on Samsung Foundry
• Will Broadcom milk VMware dry or become a full stack company?
• ARM battles RISC-V at Renesas
• Elevate your Video and Display applications with the Multi-Stream Transport of DisplayPort/eDisplayPort v1.4 Rx PHY IP Cores in 22nm, 28nm and 40nm with Matching Controllers
• SiPearl Collaborates with NVIDIA on Enabling Accelerated Computing Solutions with European Microprocessor
• Hewlett Packard Enterprise and SiPearl Partner to Develop HPC Solutions with European Processors and Accelerate Europe's Adoption of Exascale Supercomputers
• GBT Filed a Continuation Patent Application for its Long-Range Radio System

Friday, May 27, 2022

• Synopsys Initiates $200 Million Accelerated Share Repurchase Agreement

Thursday, May 26, 2022

• Semiconductor superpower: Will Samsung beat TSMC with the world's first 3nm chip?
• Broadcom to Acquire VMware for Approximately $61 Billion in Cash and Stock