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Tuesday, May 10, 2022
Samsung Launches Industry's First 512GB CXL Memory Module
Silicon Creations and Achronix Semiconductor Partner to Drive More Performance, Flexibility into High-Speed Trading
Alphawave Launches US Presence with New Silicon Valley Office
Arteris Announces Financial Results for the First Quarter 2022 and Estimated Second Quarter and Full Year 2022 Guidance
Tuesday, May 10, 2022
TSMC Board of Directors Meeting Resolutions
Monday, May 9, 2022
Silicon wafer manufacturer Okmetic invests nearly 400 million euros to build a new fab in Finland with aims to more than double the production capacity and business
Capgemini has been selected by Airbus to implement a large-scale cloud transformation program driving innovation and sustainability
TSMC Board of Directors Meeting Resolutions
TSMC to move forward with the 1.4nm process next month to get a lead on its competitors
proteanTecs Secures $45 Million Investment from Addition
Closing the Communication Chasms in the SoC design and manufacturing supply chain
MIPS Pivots to RISC-V with Best-In-Class Performance and Scalability
CEVA, Inc. Announces First Quarter 2022 Financial Results
Codasip appoints SH Lee to deliver RISC-V innovations to Korean OEMs
Creonic GmbH joins NewSpace Initiative
Exegy Acquires Enyx, Expands Global FPGA Leadership
Latest Attopsemi I-fuse OTP Memories Based on Ground-Breaking New Architecture Now Available on X-FAB's 180 nm Technology
Sunday, May 8, 2022
Is 2022 the year of the semiconductor fab industry makeover?
ARM returns to losing IP market share
OMNIVISION and Valens Semiconductor Partner to Offer Automotive OEMs a MIPI A-PHY-Compliant Camera Solution for Advanced Driver-Assistance Systems Applications
BrainChip & MosChip to Demonstrate Capabilities of Neural Processor IP & ASICs for Smart Edge Devices at IESA AI Summit
Tower Semiconductor Expands its Leading-Edge Power Management Platforms Supporting Higher Power and Higher Voltage ICs
intoPIX, Adeas, and Nextera to showcase Reference design on IPMX at ISE 2022 on Xilinx Booth
USB 3.0 PHY IP Cores in 16FFC process technology with High-performance backplane interconnect licensed to a Chinese company for Multimedia SoC application
intoPIX to showcase its lightweight compression IP at Embedded Vision Summit 2022 on Lattice Booth
Thursday, May 5, 2022
Intel may be changing Meteor Lake CPUs to compete with Apple
UMC Reports Sales for April 2022
Industry R&D Spending To Rise 9% After Hitting Record in 2021
Wednesday, May 4, 2022
Steven Laub Joins Rambus Board of Directors
CMC Delivers Over 400 Semiconductor Prototypes in Past Year
GUC Monthly Sales Report - Apr 2022
Using Agile Analog's process-agnostic Analog IPs can help solve current Semiconductor capacity challenges
Tachyum Integrates IP From World's Leading Vendors for Tape-Out In 2022
Rambus to Acquire Hardent, Accelerating Roadmap for Next-Generation Data Center Solutions
Tuesday, May 3, 2022
European Processor Initiative will have ZeroPoint IP in their chip
CoreHW Announces mmWave GF 22FDX PLL IP
Intento Design Appoints Stephane Cordova as New CEO
Safer "Listen Through" earbuds create headaches for developers due to increased processing demands
ARM China staff post open letter pledging loyalty to Allen Wu
Apple sues processor startup for theft of trade secrets
intoPIX introduces the new TicoXS FIP for 4K & 8K AVoIP & WiFi-6 during ISE 2022
Monday, May 2, 2022
Renesas equips vehicle computer with optical broadband interface
Codasip hits out at RISC-V processor verification
AMD Might Have to Wait Behind Intel and Apple for TSMC's 3nm Wafers
"Onshoring" chip production is a red herring: the UK should double down on its competitive advantage in R&D and IP to create a secure semiconductor supply chain
E4 Computer Engineering joins RISC-V International
Codasip adopts Siemens' OneSpin tools for formal verification
Sondrel Deploys Arteris IP for Next-Generation Multi-Channel Automotive SoC
Silex Insight's eSecure Root of Trust is now supporting ZAYA microcontainers for enhanced security
U.S. Department of Defense and GlobalFoundries Partner to Secure Supply of Chips Critical to National Security Systems
Sunday, May 1, 2022
DoD Announces $117 Million Defense Production Act Title III Agreement With GlobalFoundries to Strengthen the Domestic Microelectronics Industrial Base
How eFPGA IP suppliers are all set to raise the SoC design game
Samsung 3nm Process may be put into production before TSMC
India set for fab
Worldwide Silicon Wafer Shipments Edge Higher to New Record in First Quarter 2022, SEMI Reports
Rubio, Colleagues Urge CFIUS Review of Alphawave Acquisition of U.S. Semiconductor IP Company
Global Semiconductor Sales Increase 23% in Q1 2022 Compared to Q1 2021
GbE (10/100/1000Base-T) PHY IP Cores with matching 1G Ethernet MAC, PCS and TSN MAC Controller IP Cores for all your high-speed Ethernet Networking applications is available for immediate licensing
How eFPGA IP suppliers are all set to raise the SoC design game
Tackling the challenges of RISC-V
VESA Launches Industry's First Open Standard and Logo Program for PC Monitor and Laptop Display Variable Refresh Rate Performance for Gaming and Media Playback
Faraday Reports First Quarter 2022 Results
Weebit Nano moves closer to productisation
Arm China majority shareholders announce the company's corporate governance issue has been resolved
Alphawave IP: Full Year 2021 Results and Q1 2022 Trading Update
VLAB Works enables Embedded Applications with VLAB VDMs
ARM China restructures ahead of IPO
Thursday, April 28, 2022
Chip tech company Alphawave says trading was strong in Q1
Agile Analog to establish an engineering team in Scotland
The software-defined vehicle needs hardware that goes the distance
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