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Tuesday, March 1, 2022

• How to Mitigate IoT Security Threats in 2022
• CEA and Spectronite develop software radio for spectrally efficient backhaul solutions
• RISC-V AI Chips Are Joining GPU Race for AI Processing
• Small Prime Divisors Attack and Countermeasure against the RSA-OTP Algorithm
• Pankaj Mayor Joins Arteris IP as Executive Vice President of Global Sales
• Khronos Releases Vulkan SC 1.0 Open Standard for Safety-Critical Accelerated Graphics and Compute
• Sondrel explains the 10 steps to model and design a complex SoC
• Semi Industry Capex Forecast to Jump 24% and Reach Over $190 Billion This Year
• Cadence Recognized with TSMC OIP Ecosystem Forum Customers' Choice Award for 3D-IC Design
• Imperas unifies new RISC-V verification ecosystem with RVVI

Monday, February 28, 2022

• AP Memory Partners with Synopsys on Scalable IoT RAM Memory Solutions
• Silex Insight launches DDR encrypter for High-Performing Systems (ASIC/FPGA)
• CEVA Announces Milestone of 100 Million CEVA-powered Cellular IoT Chips Shipped
• CAST and Achronix Expand Partnership to Deliver Secure FPGA Solutions
• Computing-in-Memory Innovator Solves Speech Processing Challenges at the Edge Using Microchip's Analog Embedded SuperFlash Technology
• Renesas Pioneers RISC-V Technology With RZ/Five General-Purpose MPUs Based on 64-Bit RISC-V CPU Core
• Expedera Announces First Production Shipments of Its Deep Learning Accelerator IP in a Consumer Device
• VESA Readies DisplayPort UHBR (Ultra-High Bit Rate) Device Certification and Begins Certification of UHBR Cables
• Arm clears out top management
• Axiomise Celebrates Fourth Anniversary with Executive Appointments, Move to New Office
• intoPIX and Fraunhofer IIS team with Vectis to offer JPEG XS patent pool license

Monday, February 28, 2022

• Synopsys Initiates $200 Million Accelerated Share Repurchase Agreement

Sunday, February 27, 2022

• eFPGA LUTs Will Outship FPGA LUTs Later This Decade
• Samsung Joins Forces with Industry Leaders to Advance 5G vRAN Ecosystem
• Breker Verification Systems Unleashes the SystemUVM Initiative to Empower UVM Engineering
• U.S. Chops Russia's Access to Integrated Circuits
• Imperas announces RISC-V Physical Memory Protection (PMP) Architectural Validation test suite for high quality security applications
• Taking a RISC: Expanding Chip Options
• USB 3.1 Device & Host Controller IP Cores with highly configurable design for Superspeed data transfers in all kinds of advanced SoCs is available for immediate licensing
• CEVA Extends Wi-Fi Portfolio with Wi-Fi 6/6E IP for the Access Point Market
• OIF Members Demonstrate How Interoperability Accelerates Solutions for Today's and Future Global Networks at OFC 2022
• PCI Express VIP from Avery Design Systems Selected by Fungible for Ensuring Compliance, Connectivity in Hyperscale Data Centers
• ZeroPoint Technologies signs Memory Booster contract

Thursday, February 24, 2022

• TSMC R&D Chief: There's Light at the End of the Chip Shortage
• The age of end-to-end 5G networks built on Arm is now

Wednesday, February 23, 2022

• RISC-V AI Chips Will Be Everywhere
• Weebit delivers significant technical and commercial progress in H1 FY22
• Renesas Develops Bluetooth Low Energy RF Transceiver Technologies that Simplify Board Design, Reduce Circuit Size and Increase Power Efficiency
• Codasip's latest RISC-V embedded cores enable AI/ML edge customization
• Cadence Reports Fourth Quarter and Fiscal Year 2021 Financial Results
• Microprocessor Growth Will Slow in 2022 after Cellphone MPU Surge
• UMC announces new 22nm wafer fab in Singapore
• Codasip's latest RISC-V embedded cores enable AI/ML edge customization
• CEVA Streamlines 5G New Radio Modem Design with PentaG2, the Industry's Most Comprehensive 5G Baseband Platform IP for Mobile Broadband and IoT
• Raising the Bar on Autonomous Vehicle Safety
• Cadence and Dassault Systemes Partner to Transform Electronic Systems Development
• Secure-IC Launches a Unique Cybersecurity Lifecycle Management Platform for Connected Objects

Tuesday, February 22, 2022

• Qualcomm to give all its 3nm AP foundry work to TSMC instead of Samsung

Monday, February 21, 2022

• Audi is bringing 5G connectivity to its vehicles in 2024
• imec details flexible 6502 plastic processor
• Imec, KU Leuven and PragmatIC Semiconductor demonstrate fastest 8-bit flexible microprocessor for low-power applications
• LeapMind announces license agreement for AI accelerator "Efficiera" with Maxell Frontier
• Intel open to joining consortium to buy Arm
• Faraday Reports 2021 Revenue at NT$8,085 Million, the Second-Best Record
• Synopsys Joins IFS Ecosystem Alliance

Sunday, February 20, 2022

• Arm Advances Adoption of ADAS, Automation Technologies
• Rapid Silicon Chooses Verific's Industry-Standard Parser Platform
• Openedges touts mixed-precision NPU for double growth outlook
• With Tower acquisition, Intel will take over industry's ninth largest foundry
• MIPI D-PHY Tx IP Core in 22nm along with MIPI DSI-2 Tx Controller IP Core for your High-End Camera and Display needs is available for immediate licensing
• We are now AS 9100D certified! - Logic Fruit Technologies
• CHIPS Alliance Forms F4PGA Workgroup to Accelerate Adoption of Open Source FPGA Tooling
• Intel Will Rely on TSMC for its Rebound
• China's share of global wafer capacity continues to climb

Friday, February 18, 2022

• China's StarFive Technology to invest RM250m to set up design centre in Penang

Thursday, February 17, 2022

• Intel Will Rely on TSMC for its Rebound
• Siemens Joins Intel Foundry Services' EDA Alliance Program
• Arm introduces new automotive image signal processor to advance adoption of driver assistance and automation technologies
• Fujikura and IntoPIX Jointly Exhibit at MWC Barcelona 2022