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Wednesday, January 5, 2022

• Nestwave and Samea Unveil Ultra-Low-Power Super-Thin, Re-Usable GPS Tracker
• Analog Compute is Key to The Next Era of AI Innovation
• Lattice FPGAs Power Next Generation Lenovo Edge/AI Experiences
• SK hynix completes the First Phase of Intel NAND and SSD Business Acquisition
• CEVA Redefines High Performance AI/ML Processing for Edge AI and Edge Compute Devices with its NeuPro-M Heterogeneous and Secure Processor Architecture
• UMC Reports Sales for December 2021
• Wi-Fi CERTIFIED 6 Release 2 adds new features for advanced Wi-Fi applications
• Convey 4K & 8K over Gigabit Network, Cat5E cables and Wifi-6 Using intoPIX TicoXS FIP Codec, the smart path is here
• Arteris IP Added to Russell 2000 Index

Tuesday, January 4, 2022

• Cadence boss takes on Credo chair
• Wi-Fi CERTIFIED 6™ Release 2 adds new features for advanced Wi-Fi® applications
• GUC Monthly Sales Report - December 2021
• Winner Micro Licenses CEVA's Bluetooth and Wi-Fi IP Platforms for IoT Connectivity SoC
• Dolphin Design, a leader in Edge Computing and AI platforms for the Internet of Things (IoT), is expanding into Asia and opens a processing center in Singapore

Monday, January 3, 2022

• Samsung Overtakes Intel for Lead Spot in 2021 Semiconductor Sales
• French and Italian startups pitch at CES 2022
• Ceva boosts Bluetooth wireless audio IP
• RISC-V CTO: We won't dictate chip design like Arm and x86
• Credo Appoints Lip-Bu Tan as Chairman and Bolsters Board with the Addition of Industry Veterans Sylvia Acevedo and Manpreet Khaira
• CEVA Bluebud Platform Takes Center Stage for a Differentiated, Premium Wireless Audio Experience in TWS Earbuds, Gaming Headsets, Hearables, Wearables and More
• Synapse Design, a QuEST Global Company, joins TSMC Design Center Alliance (DCA)
• Global Semiconductor Sales Increase 23.5% Year-to-Year in November; Industry Establishes Annual Record for Number of Semiconductors Sold

Sunday, January 2, 2022

• CES 2022: IoT and AI Set to Take Center Stage
• Intel's technology trends
• Axiomise Unveils Intelligent Debug Solution for Formal Verification of RISC-V Cores
• USB 4.0, MIPI DSI/CSI 2.0, Display Port 1.4, HDMI 2.1, DDR5, PCIe5.0, 1G Ethernet IP Cores and many more Wired Interface IP Cores available for immediate licensing
• ASPEED and CEVA Collaborate to Enable Superior Voice Experience on 2nd Generation Cupola360 SoC for Smart Cameras and Video Conferencing Systems
• WiLAN Subsidiary Polaris Signs License Agreement with Marvell
• Samsung and SK to Make Massive Investments in System Semiconductors

Thursday, December 30, 2021

• Securing the IoT: Technical Approaches to Defend and Protect IoT Nodes
• AMD and Xilinx Provide Update Regarding Expected Timing of Acquisition Close

Wednesday, December 29, 2021

• 2022 tech themes: A look ahead

Tuesday, December 28, 2021

• 3Q21 Revenue of Global Top 10 Fabless Companies Hits $33.7B
• Siemens mPower Solution Now Certified for TSMC's N7 and N5 Nodes
• TSMC reportedly getting everything lined up for 2nm production in 2025

Monday, December 27, 2021

• Edge Computing, AI, and the Cloud
• Leti proposes FD-SOI spin qubit platform for quantum computing

Sunday, December 26, 2021

• Arm CPUs Make Gains in Data Centers
• Access Advance Welcomes Microsoft as a Licensor and Licensee of the HEVC Advance Patent Pool
• GlobalFoundries Announces Extension of AMD Wafer Supply Agreement to Guarantee Supply