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Wednesday, December 22, 2021

• Despite Withdrawals, CES Organizers Push on With 2022 Show

Tuesday, December 21, 2021

• A Novel Machine-Learning based SoC Performance Monitoring Methodology under Wide-Range PVT Variations with Unknown Critical Paths
• CAES developing 16-core RISC-V based microprocessor for space
• Synopsys Chosen by Juniper Networks to Accelerate Development of Photonic ICs for Next-Gen Data Centers
• Successful conclusion of European Processor Initiative Phase One
• First Open Wi-Fi 'HaLow' development platform
• Weebit Nano receives first silicon demonstration wafers integrating its embedded ReRAM module
• The European Space Agency (ESA) has awarded a contract to CAES, in the frame of the ARTES Competitiveness & Growth programme, to develop System-on-Chip for space applications
• Kneron Announces $25 Million Funding To Advance Smart City Technology For Auto

Monday, December 20, 2021

• 17 Semiconductor Companies Forecast to Have >$10B Sales in 2021
• Interview with the CEO at Silex Insight - Michel Van Maercke
• Renesas Completes Acquisition of Celeno
• 17 Semiconductor Companies Forecast to Have >$10.0 Billion in Sales This Year
• Real Intent Joins DARPA Toolbox Initiative to Provide Mil/Aero/Defense Grade Static Sign-Off
• North American Semiconductor Equipment Industry Posts November 2021 Billings

Sunday, December 19, 2021

• SiPearl awarded a €17.5M funding from the EIC Accelerator program
• Intel CEO Says Chip Shortage To Last Until 2023
• UK doubles venture capital investment in tech
• Taiwan approves TSMC fab investment plan in Japan
• Teledatics Introduces World's First Open Wi-Fi "HaLow" Development Platform
• Imagination's Series3NX neural network accelerator helps UNISOC to create 5G smartphone platform
• Teledatics Introduces World's First Open Wi-Fi
• Creonic GmbH is Heavily Invested in the Expansion and Research of 6G Technologies
• SiPearl awarded a ?17.5M funding from the EIC Accelerator program
• Imagination appoints Carol Chesney to board as non-executive director
• Hardent VESA DSC IP Cores Licensed by Teledyne LeCroy for DisplayPort Test Solution
• PCIe 5.0 & PCIe 4.0 PHYs and Controller IP Cores are available for immediate licensing to maximize your Interface speed for complex SoCs

Thursday, December 16, 2021

• Kandou Closes $75 Million in Series D Funding
• Gowin Automotive-grade FPGAs Pass SAIC's 2500h Heat Resistance Tests
• TSMC Introduces N4X Process

Wednesday, December 15, 2021

• Samsung and IBM reveal plans to make next-generation CPU with 5 nm process
• StarFive Released Open-Sourced Dubhe Linux SDK in RVspace Community
• Kandou Delivers USB-C Multiprotocol Retimer Product Family for USB4 Support
• TSMC Presents 2021 Excellent Performance Award to Outstanding Suppliers
• Synopsys Initiates $200 Million Accelerated Share Repurchase Agreement
• Synopsys SiliconSmart Library Characterization Solution Achieves Certification for TSMC N5, N4 and N3 Advanced Processes
• 3Q21 Revenue of Global Top 10 IC Design (Fabless) Companies Reach US$33.7 billion, Four Taiwanese Companies Make List, Says TrendForce
• Lattice Expands Automate Solution Stack and Propel Design Tool Capabilities to Accelerate Industrial Application Development
• Atomic Rules introduces the world's highest performance PCIe host interface for Intel Agilex F-Series FPGAs
• Cliosoft Selected for Rapid Assured Microelectronics Prototypes (RAMP) Program
• Secure Thingz and Intrinsic ID Partner to Ensure Supply Chains of Trust for the Embedded Industry
• MediaTek Dimensity 9000 uses Armv9 technology for unparalleled performance
• Industry's fastest TLS accelerator ready to boost Xilinx Versal platform
• TSMC Newest N4X Process Targets HPC Products

Tuesday, December 14, 2021

• Intel CEO trip to Taiwan seeks to secure TSMC 3nm supply: analyst
• Benchmarking Neuromorphic Computing: Devil Is in the Details
• Phase-change memory comes to 18nm FDSOI
• Maven Silicon - ARM Approved Training Partner
• IBM, Samsung Unveil VTFET to Extend Moore's Law
• FPGA Development Opens Up
• Ultra-Low power GNSS Multi-Constellation Digital IP core available for Battery powered IoT devices and Smart Wearables SoC application

Monday, December 13, 2021

• Security Standards Are a Must for Consumer IoT
• The Status of AI at the Edge? It's Complicated
• New RISC-V verification product changes the fabric of processor DV
• MIPI M-PHY Update Doubles Peak Data Rate for Next-Generation Flash Memory Storage Applications
• SEMIFIVE Acquires Hanatec
• Semi Capex on Pace for 34% Growth in 2021 to Record $152.0 Billion
• IC Manage Launches Holodeck on AWS Marketplace for Instant Cloud Bursting

Sunday, December 12, 2021

• Imec demonstrates successful monolithic integration of Schottky diodes and depletion-mode HEMTs with 200 V GaN-IC
• Silex Insight to divest their video business to Audinate
• Hisense Enters Into MPEG LA's AVC Patent Portfolio License
• Siemens' new mPower solution gains certification for TSMC's N7 and N5 technologies
• CXL Put Through Its Paces
• CEVA and Mimi Hearing Technologies Partner to Democratize Assistive Hearing for the True Wireless Earbuds Market
• 10/100/1000M Ethernet PHY IP Core in ST 28FDSOI technology licensed to a leading Chinese Semiconductor company for Broadband Access Networks Application
• MoSys Partners with Silicom to Provide Stellar Packet Classification IP Optimized for Intel FPGA-Based SmartNICs and Infrastructure Processing Units
• Arasan announces the immediate availability of its ultra-low power MIPI D-PHY IP for the GlobalFoundries 12nm FinFET process node