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Wednesday, October 27, 2021

• Samsung plans to triple foundry chip production capacity by 2026
• SiPearl: collaboration with Intel to accelerate exascale supercomputing deployment in Europe
• Faraday Reports Third Quarter 2021 Revenues at NT$2,218 Million, Up 31% QoQ
• Semiconductor Sector Shows Signs of Cooling
• S2C Delivers VU19P FPGA-based Logic Matrix LX2 - a New Benchmark in High-performance & High-density Prototyping
• Morris Chang says domestic US chip supply chain is impossible
• Rapid Silicon Announces Seed Funding of $15M
• Samsung to triple foundry capacity
• AccelerComm Announces 5G IP with O-RAN Acceleration Abstraction Layer (AAL) Interface
• Codasip Founder Karel Masarik elected to RISC-V Technical Steering Committee
• Annual Foundry Revenue Expected to Reach Historical High Once Again in 2022 with 13% YoY Increase with Chip Shortage Showing Sign of Easing
• Europe opens extended investigation into ARM-Nvidia deal
• SiFive has briefly pulled back the curtains on its most powerful Risc-V processor yet.
• GlobalFoundries Announces Pricing of Initial Public Offering
• Achronix Demonstrates Speedster7t High-Performance Interfaces
• VESA Publishes Embedded DisplayPort Standard Version 1.5

Tuesday, October 26, 2021

• Synopsys and TSMC Drive Chip Innovation with Development of Broadest IP Portfolio on TSMC N4P Process
• SD 5.1/eMMC 5.1 Host and Device Controllers with Matching PHYs for all kind of Portable Memory Storage Devices, making it easy to integrate a wide range of Applications in your products
• 5GCroCo Project Advances Cross-border Connectivity for Cars
• Renesas and wolfSSL Enable Ready-to-Use IoT Security Solutions Based on Embedded TLS Stack
• Siemens collaborates with TSMC on design tool certifications
• Samsung to finalise US fab investment
• TSMC Details The Benefits of Its N3 Node
• JEDEC Publishes Update to DDR5 SDRAM Standard Used in High-Performance Computing Applications
• TSMC Recognizes Partners of the Year at 2021 OIP Ecosystem Forum
• Xilinx and Leading Broadcast and AV System and IP Integrators Deliver Complete, Production-Ready Multimedia Streaming End-Point Solutions
• Achronix and MoSys Partner to Target 5G Wireless and Broadband Networking Acceleration
• Omni Design Announces Availability of LiDAR Receiver Subsystem
• Arteris IP Announces Pricing of Initial Public Offering
• Cadence Integrity 3D-IC Platform Supports TSMC 3DFabric Technologies for Advanced Multi-Chiplet Designs
• Siemens collaborates with TSMC on design tool certifications for TSMC's advanced technologies and other industry milestones

Monday, October 25, 2021

• GlobalData: China Emerges as Powerhouse for AI Unicorns
• New Allwinner RISC-V Chip Uncovered on Tiny Board
• Codasip boosts custom RISC-V performance in latest tool
• Agile Analog broadens analogue IP portfolio
• Codasip boosts Studio processor design tools with AXI automation
• QuickLogic Announces First eFPGA IP From Australis IP Generator on UMC 22nm Process
• TSMC Expands Advanced Technology Leadership with N4P Process
• Analog Bits to Present Papers, Demo of N5 Working Silicon, and Roadmap on IPs for TSMC N4 and N3 Processes

Sunday, October 24, 2021

• Functional safety tools certified on RISC-V
• IAR Systems extends functional safety offering for RISC-V with leading build tools for Linux
• North American Semiconductor Equipment Industry Posts September 2021 Billings
• Crypto Quantique partners with Macronix to add ArmorFlash support to its IoT security management platform
• videantis processing platform reduces cost, increases flexibility of fail-operational systems
• ISDB-S3 Demodulator IP Core is now available for licensing to STB & TV SoC Manufacturers
• Xiphera expands its AEAD portfolio

Thursday, October 21, 2021

• Vidatronic Joins the Silicon Catalyst Semiconductor Ecosystem as an In-Kind Partner

Wednesday, October 20, 2021

• Cadence Digital and Custom/Analog Flows Achieve the Latest TSMC N3 and N4 Certifications
• Cadence Demonstrates IP Test Silicon for PCI Express 6.0 Specification on TSMC N5 Process
• Alphawave IP Group plc Q3 Trading Statement
• Siemens accelerates IP validation by 1,000X at Arm using ML-powered Solido Variation Designer on AWS Graviton2
• Silex Insight offers low-power embedded video solution for manufacturing and automotive
• Green Hills Software Creates Clear Path for Arm Cortex-A78AE Early Adopters in High-Performance Critical Embedded Systems
• Flex Logix Announces Production Availability Of InferX X1 PCIe Boards for Edge AI Systems
• BrainChip Begins Taking Orders of Akida AI Processor Development Kits

Tuesday, October 19, 2021

• Renesas rolls out a global network of technology partners
• Synopsys Digital and Custom Design Platforms Achieve Certification for TSMC N3 Process
• TSMC's Japan Expansion Puts Profit at Risk
• Synopsys Expands Strategic Technology Collaboration with TSMC to Extend 3D-System Integration Solutions for Next-Generation High-Performance Computing Designs
• Precise-ITC to Exhibit at CEATEC 2021 ONLINE
• Enyx releases nxFramework version 5.4 for subscribers which includes new ULL IP cores and 40G support
• NSCore, Inc. introduces its OTP+ solution to address the IoT market need for an Ultra-Low-Power OTP NVM IP Solution in 40nm
• De-RISC, the H2020 project which will create the first RISC-V fully European platform for aerospace, celebrates its second anniversary

Monday, October 18, 2021

• GlobalFoundries seeks $25 bln valuation in U.S. IPO as chip demand soars
• proteanTecs to Present at the TSMC 2021 Open Innovation Platform® (OIP) Ecosystem Forum
• Imec licenses Covid detection technology
• Synopsys, Dassault Systèmes team for lighting digital twin
• Omni Design Announces Silicon Validated Data Converters on TSMC 16nm Process
• Arteris IP FlexNoC Interconnect Licensed by Eyenix for AI-Enabled Imaging/Digital Camera SoC
• MIPI RFFE (RF Front-End Control Interface) v3.0 Master and Slave Controller IP Cores for ultimate control of your RF Front-end Cellular or Base station SoC's with Low Power Consumption and Reduced Latencies
• GlobalFoundries Announces Launch of Initial Public Offering
• Enabling end-to-end 5G networks on Arm
• eTopus introduces 400G(4x100G) LR IP solution incorporating new FEC & ePHY with combined latency of sub 10ns
• Arm transforms the economics of IoT with Virtual Hardware and a new solutions-led offering
• Alibaba Cloud Unveils New Server Chips to Optimize Cloud Computing Services
• MegaChips Deploys Omni Design's Silicon-Validated Data Converters
• Cadence Introduces Comprehensive Safety Solution for Faster Certification of Automotive and Industrial Designs

Sunday, October 17, 2021

• TSMC Roadmap Update: 3nm in Q1 2023, 3nm Enhanced in 2024, 2nm in 2025
• Global Silicon Wafer Shipments Projected to Log Robust Growth Through 2024, SEMI Reports
• Defacto enables ETRI to Automate IP Integration and Build Complex AI Chips
• Imperas Models for Arm Processors now available in TESSY by Razorcat
• PragmatIC Semiconductor Secures $80 Million Funding