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Wednesday, September 29, 2021

• Comparison of One and Two Stage RF Rectifiers Designed in FDSOI 28 nm and BiCMOS 55 nm
• A Feasible Alternative to FDSOI and FinFET: Optimization of W/La2O3/Si Planar PMOS with 14 nm Gate-Length
• Moore's Law Could Ride EUV for 10 More Years
• GBT is Developing an EDA Technology For Automatic Generation of Integrated Circuits Layout IPs
• CEVA, Beken and VisiSonics Announce Reference Design for 3D Spatial Audio in Headsets and TWS Earbuds
• FortifyIQ Revolutionizes Hardware Security Analysis with Pre-silicon Security Verification

Tuesday, September 28, 2021

• SoC-e Announces 10G Multiport TSN Switch Release
• Fraunhofer IPMS presents a scalable TSN multiport switch at the TSN/A conference
• Samsung raises foundry chip prices for Qualcomm, Tesla
• Chiplet Strategy is Key to Addressing Compute Density Challenges
• Chip M&A Deals Reach $22 Billion in First Eight Months of 2021
• Arteris IP Announces 4D LiDAR Pioneer Aeva as its 200th Customer
• Lights, Camera, Action: Xilinx Powers Sony's New-Gen Live Production Video Switcher

Monday, September 27, 2021

• CMC Microsystems helps launch 250 Canadian tech start-ups over 25-years
• 6,000 RISC-V Cores on a Xilinx FPGA Break the CoreScore World Record
• Bluespec, Inc. Releases Ultra-Low Footprint RISC-V Processor Family for Xilinx FPGAs, Offers Free Quick-Start Evaluation.
• Siemens introduces mPower power integrity solution for analog, digital and mixed-signal IC designs
• Tiempo Secure in collaboration with CEA makes the Internet of Things more resilient with French Government support
• Intrinsic ID Announces NIST-Certified Software Random Number Generator (Zign RNG) for IoT Devices
• intoPIX extends its range of TICO-RAW IP-cores with smaller architectures supporting a wider range of image sensors and cameras
• Faraday Announces the Success of Its ARM-based SoCs in Wide Ranging Applications

Sunday, September 26, 2021

• Symphonie aims high in EC call for satellite connectivity
• Samsung: Real foundry competitor could be Intel
• SiPearl opens design centre in Grenoble, looks for 50 engineers
• Innatera's Neuromorphic AI Chip to Accelerate Spiking Neural Networks
• Building a foundation for our digital future: Say hello to Xcelerator as a Service
• Mercury Systems to acquire Avalex Technologies Corporation
• Synopsys Achieves AIM Photonics Certification
• Intel Breaks Ground on Two New Leading-Edge Chip Factories in Arizona
• Spin-Orbit-Torque Tackles MRAM Constraints
• Imagination and Tencent WeTest carry out in-depth cooperation to help developers obtain key report on GPU

Friday, September 24, 2021

• Semiconductor Manufacturing International Corp (SMIC) gears up to double its production by 2025

Thursday, September 23, 2021

• Daejin semiconductor, takes over the distribution of Dolphin Design in Korea

Wednesday, September 22, 2021

• Four automotive functional safety mistakes that must be avoided
• Cloud Net Partnership Eyes Military IoT
• Foundry Market Tracking Toward Record-tying 23% Growth in 2021
• NEWRACOM Introduces First Wi-Fi HaLow Sensor Solution
• Allegro DVT and Beamr Announce the World's First Content-Adaptive Silicon IP Video Encoder
• Strategic Investment in proteanTecs from Industry Leaders MediaTek and Advantest Joined by Porsche Automobil Holding SE to Advance Electronics Health Monitoring
• Syntiant Unveils NDP200 Neural Decision Processor for Always-On Vision Edge AI Applications
• Xilinx and NEC Accelerate Next-Generation 5G Radio Units for Global Deployment
• Cadence Accelerates Development of Mobile, Automotive and Hyperscale Systems with the Helium Virtual and Hybrid Studio
• Lattice mVision Solution Stack Enables 4K Video Processing at Low Power for Embedded Vision Applications
• Rambus and Kioxia Renew Patent License Agreement

Tuesday, September 21, 2021

• Xiphera expands its Advanced Encryption Standard portfolio
• Foundry sales set for 23% increase
• Taiwan's TSMC tapped by Intel to produce GPUs
• Samsung Foundry Certifies Synopsys PrimeLib Unified Library Characterization and Validation Solution at 5nm, 4nm and 3nm Process Nodes
• EPI EPAC1.0 RISC-V Test Chip Samples Delivered
• Alphawave IP: Interim results for the 6 months to 30 June 2021

Monday, September 20, 2021

• Renesas looks to accelerate deep learning development for ADAS applications
• RISC-V to Shake Up $8.6B Semiconductor IP Market
• Collaboration validates 12G interconnect for high-speed IP
• Movellus launches global distribution partners to accelerate adoption of its Intelligent Clock Network IP
• Update to Royalty-Free MIPI I3C Basic Utility and Control Bus Specification Boosts Speed and Flexibility
• Codasip Opens UK Design Center led by Simon Bewick
• DCD-SEMI introduces octa SPI IP Core for smart wear, audio and mobile
• 100G MAC and 100G PCS IP Cores for high performance applications are now available
• Enabling Cryogenic Chip Design and the Scaling of Quantum Computers

Sunday, September 19, 2021

• Building a quantum future
• CMC and Edgewater Wireless Accelerate Commercialization of Game-Changing Technology
• RISC-V Launches the Open Hardware Diversity Alliance
• AI Processor Chipmaker Deep Vision Raises $35 Million in Series B Funding
• Global Fab Equipment Spending Projected to Reach New High of Nearly $100 Billion in 2022, SEMI Reports
• SkyWater Technology Joins CHIPS Alliance to Further Efforts to Make Chip Design and Production More Accessible
• Synopsys Advances Processor IP Leadership with New ARC DSP IP Solutions for Low-Power Embedded SoCs
• Revenue of Top 10 IC Design (Fabless) Companies Reaches US$29.8 Billion for 2Q21, Though Growth May Potentially Slow in 2H21, Says TrendForce