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Friday, October 10, 2025

• TSMC Stock Soars on AI Boom – Record Highs, Key News, Risks & 2025 Outlook
• Synopsys Receives Final Regulatory Approval to Close Planned Divestitures of Synopsys Optical Solutions Group and Ansys PowerArtist
• Andes Technology Hosts First-Ever RISC-V CON in Munich, Powering Next-Gen AI and Automotive Solutions

Thursday, October 9, 2025

• Semiconductor Tech Leaks Heat Up: Latest on Samsung, SK hynix, and TSMC Trade Secret Cases
• Intel's Confidence Shows As It Readies New Processors on 18A
• 6G migration challenges
• RISC-V set to announce 25% market penetration - open-standard ISA is ahead of schedule, securing fast-growing silicon footprint
• Europe Achieves a Key Milestone with the Europe's First Out-of-Order RISC-V Processor chip, with the eProcessor Project
• Everything Is Quantum
• EU Member States back Chips Act 2.0
• Samsung May Make 2nm AI Chips for Another Client
• The Things Conference 2025: IoT Depends on an Intelligent and Secure Edge
• Keysight Enables 6G Digital Twin Research at the University of Texas at Austin
• EU funds 83 Digital Hubs with €342M to boost AI innovation
• What Meta's Purchase of Rivos Says About RISC-V
• Sumitomo Riko Leverages Ansys AI Technology to Accelerate Simulation Over 10x for Automotive Component Design and Manufacturing
• IntoPIX Accelerates Automotive Innovation With TicoRAW & JPEG XS On Lattice Low Power FPGAs
• Perceptia's pPLL08W Deployed in Production Tapeout of 5G Radio Chip for Smartphones

Wednesday, October 8, 2025

• Korea, U.S. DRAM Giants Reportedly Halt Pricing for a Week, Memory Module Makers Follow
• VeriSilicon Soars with AI Surge: Quarterly Revenue Doubles as Demand for Specialized Silicon Skyrockets

Tuesday, October 7, 2025

• AI's Silicon Revolution: How Intelligent Machines are Redrawing the Semiconductor Landscape
• Omni Design Technologies Tapes Out Ultra-High-Speed 64GSPS ADC on TSMC N3 process
• DCD-SEMI Brings Full ASIL-D Functional Safety to Entire Automotive IP Cores Portfolio

Monday, October 6, 2025

• Arm Announces Earnings Release Date for Second Quarter Fiscal Year Ended 2026
• Micron Brings the Next Evolution of AI PC Memory
• Andes Technology Expands Comprehensive AndeSentry™ Security Suite with Complete Trusted Execution Environment Support for Embedded Systems
• Weebit Nano tapes out embedded ReRAM test chips at onsemi production fab
• Creonic Updates Doppler Channel IP Core with Extended Frequency Band and Sampling Range
• QuickLogic Announces $1M eFPGA Hard IP Contract for Data Center ASIC
• India ready to rev up chipmaking, industry pioneer says
• NLM Photonics validates silicon-organic hybrid performance at over 200G
• STARLight Ignites Europe's Silicon Photonics Ambitions: From Lab to Fab at 300mm
• GlobalFoundries, Corning collaborate on co-packaged optics
• Toward a secure Europe: The Netherlands to build a pan-European quantum network
• From Foundry to Fridge: Europe’s Role in the Global Quantum Supply Chain
• Keysight Expands End-of-Line Test Portfolio to Power the Future of Electric Mobility
• AI Drives PCIe Aspirations
• Samsung and OpenAI Announce Strategic Partnership to Accelerate Advancements in Global AI Infrastructure
• Project SpikeHERO Researches AI Chip for Fiber Optic Networks
• Tenstorrent Considers Multiple Chipmakers for Production Amid AI Growth
• SiPearl: launch of Athena1, the sovereign processor dedicated to dual-use
• Siemens and ASE collaborate on Innovator3D IC driven 3Dblox workflows for ASE's VIPack platform
• Siemens Unveils "Groundbreaking" Software for Automated Analog IC Tests
• Analog Bits Awarded TSMC's 2025 OIP Partner of the Year Award
• Keller says Intel needs to fix its foundry game
• Intel Allegedly in Talks with AMD for Potential Foundry Manufacturing Deal
• Rapidus Reportedly Flags U.S. Firms as Potential Customers, IBM and Tenstorrent Lead the Pack
• ASIC North Enters Strategic Channel Partnership with GlobalFoundries

Thursday, October 2, 2025

• Imec debuts a beyond-110GHz C-band GeSi electro-absorption modulator (EAM) on its 300mm silicon photonics platform
• Dnotitia Releases "Dnotitia NIAH," an Open-Source Benchmark for Long-Context LLM Performance

Wednesday, October 1, 2025

• Northern Poland Emerging as Europe's Next Semiconductor Hub
• Photonics leaders call for a €2 bn EU program to 'keep Europe competitive'
• Taiwan will not agree to 50-50 chip production deal with US, negotiator says
• Soitec initiates succession process for chief executive officer Pierre Barnabé
• Synopsys Gives Its Major EDA Offerings a Gen-AI Facelift
• TSMC Price Hikes End the Era of Cheap Transistors
• Alphawave Semi Delivers Cutting-Edge UCIe Chiplet IP on TSMC 3DFabric Platform
• Codasip RISC-V processors certified up to ASIL-D
• Key ASIC Berhad Signs RM1.11 Million Contract to Jointly Develop AI-Driven, Ultra-Low Power RF Navigation Chip with Middle East Partner
• Analogue Insight IP Group Launches Analogue Insight SAFE in Portland, Oregon to Deliver Certification-Grade Security IP for Next-Gen SoCs and Chiplets.

Tuesday, September 30, 2025

• Keysight Unveils 3GPP AI Simulation Platform to Accelerate AI-enabled 6G Communications
• CAST Expands Security IP Portfolio with High‑Performance SM4 Cipher Core
• Chip Interfaces and Prodigy Technovations validate I3C Target at MIPI Plugfest in Poland
• Silicon Creations Receives 9th Consecutive TSMC OIP Partner of the Year Award for Mixed Signal IP
• Advanced 112G SerDes PAM4 IP core for Low-Power, Multi-Reach Connectivity Across Silicon-Proven 12/7/6/5nm Nodes

Monday, September 29, 2025

• Semiconductor coalition demands revamped EU Chips Act
• Synopsys Introduces Digital Twin Racetrack and NVIDIA Omniverse to STEM Racing
• Quantum eMotion and Jmem Technology Join Forces to Deliver the First-Ever Full-Stack Quantum-Resilient Security Chip
• GlobalFoundries and Corning Collaborate To Deliver Detachable Fiber Connector Solutions to Scale Next-Generation Optical Connectivity