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Wednesday, August 4, 2021
Intel Outlines Roadmap to Recapture Process Technology Crown by 2025
TSMC 5nm and 3nm chip production reportedly all booked up
UK communications IP provider in US DARPA deal
IBM and the University of Tokyo unveil quantum computer
CAST IP Helps Socionext Develop Advanced Autonomous Driving Systems
GUC Monthly Sales Report - July 2021
AccelerComm joins DARPA Toolbox initiative for advanced communications research projects
Robust Growth Rates Expected For Nearly All IC Products in 2021
SMIC Reports 2021 Second Quarter Results
UMC Reports Sales for July 2021
Chips&Media Expects a Supercycle in Semiconductors This Year
Global Cloud Market Hits $42B in Q2
Tuesday, August 3, 2021
UK government considering blocking Nvidia's $40bn Arm takeover
Arasan Announces the Industry's First ONFI v5.0 Compliant NAND Flash IP
StarFive to release open source single board platform Q3 2021
Samsung, TSMC in heated race for industry's smallest 3 nm process node
Monday, August 2, 2021
IoE: A New Era in Hyperconnectivity, Opportunities, and Development Challenges
New Device Helps Reduce Frequent Charging of Wireless Electronics
SiFive speeds up RISC-V U74 cores as Canaan unveils a 3-TOPS Kendryte K510
IMEC hyperspectral spin-off raises $16 million
QuickLogic and Zifisense launch TinyML development kit
Omni Design Announces Silicon Validated Gigasample+ Low Power ADC and DAC on TSMC 28nm Technology
Rambus Reports Second Quarter 2021 Financial Results
Intrinsic ID Partners with DARPA to Provide Streamlined Access to Industry-Leading PUF Technology
CEO interview: Globalfoundries' Tom Caulfield on the European project
DVB-S2X/S2/S Demodulator IP Core licensed to a Major Chinese Semiconductor company for integration into an 8K TV SOC
Global Semiconductor Sales Increase 29.2% Year-to-Year in June; Q2 Sales Up 8.3% Over Q1
Marvell to acquire Innovium for $1.1 Billion
Printed Electronics to Enhance both Exteriors and Interiors in EVs
Sunday, August 1, 2021
Akida spiking neural processor could head to FDSOI
Apple may adopt IPD (Integrated Passive Device), a disruptive miniaturization technology, in 3nm 2022 iDevices
AI blockchain platform makes smart contracts intelligent
NSITEXE achieves world's first RISC-V processor with vector extension certified for ISO 26262 ASIL D ready product
Imagination opens Cambridge office
Efabless & OpenROAD Advance Commercial Open Source Chip Design
IAR Systems collaborates with NSITEXE to accelerate functional safety development for RISC-V
NSITEXE Announces a RISC-V 32bit CPU supporting ISO26262 ASIL D
Collaboration looks to accelerate functional safety development for RISC-V
Breakthrough in AI Cloud systems
Thursday, July 29, 2021
EU starts quantum network rollout as Ireland signs deal
Samsung Electronics in Dilemma between TSMC and Intel
The Nanosheet Transistor Is The Next (And Maybe Last) Step In Moore's Law
Wednesday, July 28, 2021
Tensilica Xtensa processors address stringent automotive safety requirements
IC Insights Forecasts a 21% Surge in IC Unit Shipments This Year
SmartDV Leads Industry with Greatest Number of Design and Verification MIPI Protocol Standards Solutions for Mobile Applications
Optima Design Automation Announces TUV Certification of its Entire Safety Platform for ISO 26262 ASIL-D Functional Safety Verification
Ampere to Acquire OnSpecta to Accelerate AI Inference on Cloud-Native Applications
Silicon Wafer Shipments Reach New High in Second Quarter 2021, SEMI Reports
Tuesday, July 27, 2021
Taiwan gives TSMC green light for most advanced chip plant
The 2021 RISC-V Summit to Co-Locate with the 58th Design Automation Conference (DAC) in San Francisco
Semiconductor Industry: Foundry Competition Intensifies
Mercury introduces industry-first heterogeneous processing module with integrated artificial intelligence functionality
PUFsecurity's PUFiot Helps IoT Devices Meet FIDO Device Onboard Specification
DDR Combo PHY & Controller IP Core Silicon Proven in 12nm & 28nm available for immediate licensing
JEDEC Publishes New and Updated Standards for Low Power Memory Devices Used in 5G and AI Applications
Cadence Tensilica Xtensa Processors Address Most Stringent Automotive Functional Safety Requirements with Full ISO 26262 Compliance to ASIL-D
Arm's Startup Day Shows its Support for Future Hardware Startups
What matters most in Samsung's foundry business?
Monday, July 26, 2021
Soitec Aims to Triple Revenues by 2026, Joins EU Chip Alliance
Manchester, Dresden, Globalfoundries produce SpiNNaker2 chip
Intel charts path to 1nm - video
Is RISC-V the Future?
Blaize, leading AI Solution for Edge Computing, Announces $71M Series D Financing to Further Accelerate Growth
TU Dresden, University of Manchester and GlobalFoundries Announce SpiNNaker2, a Breakthrough in AI Cloud Systems, Bringing Real-Time AI with below Millisecond Latency and high Energy Efficiency to Cloud Scale
CAST And Avery Design Systems Expand IP Partnership to Support Next Generation High-Bandwidth Automotive Networking And Control Systems
Cadence Announces Anirudh Devgan to Become CEO in December 2021; Lip-Bu Tan to Transition to Role of Executive Chairman at That Time
IoT Pioneer Wiliot Secures $200 Million Investment Round Led by SoftBank Vision Fund 2
Sunday, July 25, 2021
BrainChip Discusses AI's Positive Impact on the Human Condition with Public Interest Technology Advocate Katina Michael
DDR Combo PHY & Controller IP Core Silicon Proven in 12nm & 28nm available for immediate licencing
Bankrupt Tsinghua Unigroup advertises for investors
TSMC considers German fab
TSMC Shareholders Elect Board of Directors; Board of Directors Unanimously Re-elects Dr. Mark Liu as Chairman and Dr. C.C. Wei as CEO and Vice Chairman
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