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Wednesday, July 21, 2021
U.K. Government to Co-invest £375m in Breakthrough Tech Firms
Fraunhofer IIS successfully tests terrestrial IoT technology mioty® via GEO satellite
Winbond's Successful Interoperability of OctalNAND Flash with Synopsys DesignWare AMBA IP Delivers Complete High-Density NAND Flash Memory Solution
DVB-S2X Wideband Demodulator IP Core from Creonic Now Available with Time-Slicing Support (Annex M)
Moschip Continues to Soar Consecutively for the 6th Quarter
Kameleon Security Adds Investment from Xilinx to Deliver Hardware Cybersecurity for Servers
Achronix Announces Record Second Quarter 2021 Financial Results and Business Highlights
CEVA Continues to Lead the Way in Wireless Connectivity with Bluetooth 5.3 IP
NovaSparks Unveil the First FPGA Market Data Aggregator
Is TSMC-Sony A Sign Of Things To Come?
Agile Analog brings analog IP to RISC-V International
Tuesday, July 20, 2021
After 3D printing now comes 4D printing
A natively flexible 32-bit Arm microprocessor
Adding Intelligence to the Grid
Mercury teams up with CoreAVI to provide safety-certified solutions
ARM shows first plastic M0+ microcontroller
Intel's foundry ambitions could be slowed by lack of deal targets
Attopsemi's I-fuse OTP IP Now Qualified on a Japanese Wafer Fab's 130nm BCD and Embedded into ABLIC's IC Product
Monday, July 19, 2021
Where Will TSMC Be in 5 Years?
Agile Analog joins RISC-V International as a strategic member
A surprising new job for RERAM technology
European Commission forms processor, semiconductor alliance
CrossBar Announces ReRAM Based PUF Keys
GOWIN Semiconductor Announces their ISP (Image Signal Processor) IP Core and Solution
CAES Receives Contract from Vinnova to Advance High Performance RISC-V Space Computing
GlobalFoundries Plans to Build New Fab in Upstate New York in Private-Public Partnership to Support U.S. Semiconductor Manufacturing
Sunday, July 18, 2021
$10m for French quantum carbon nanotube startup
TSMC in 'Due Diligence' on Possible Japan Fab
Chip Shortages May Persist Until 2023, Analysts Say
CXL Product Pipeline Gets Flowing
Precise-ITC 1.6T/800G/400G IP Product Series for Datacentre Application
Secure-IC establishes new references to secure the Internet of Things
Imperas updates Free reference model riscvOVPsimPlus with new RISC-V P (SIMD/DSP) extension and Architectural Validation Test Suites
Samsung Foundry and Synopsys Collaborate to Accelerate Time to ISO 26262 Compliance for Automotive SoCs
TSMC in "Due Diligence" on Possible Japan Fab
Intel in talks to buy Globalfoundries
Dolphin Design and CEA-List join forces for a new embedded AI computing platform
Wednesday, July 14, 2021
Electronic System Design Industry Logs Record First-Quarter Revenue Growth, ESD Alliance Reports
TSMC Reports Second Quarter EPS of NT$5.18
Is analog IC fab renaissance in the works?
Accellera Board Approves Security Annotation for Electronic Design Integration Standard 1.0 for Release
Xenergic Raises 40 MSEK In New Share Issue
Taiwan Maintains Edge as Largest Base for IC Wafer Capacity
Quantware Launches the World's First Commercially Available Superconducting Quantum Processors, Accelerating the Advent of the Quantum Computer.
Xilinx Versal HBM Series with Integrated High Bandwidth Memory Tackles Big Data Compute Challenges in the Network and Cloud
Weebit completes design and tape-out of embedded ReRAM module
Realtek selects Imagination GPU for use in DTV
Tuesday, July 13, 2021
Neuromorphic processor leader Innatera appoints Prof. Alberto Sangiovanni-Vincentelli Chairman of Board
Taiwan Maintains Lead in IC Wafer Capacity
Rethinking Automotive Electronics Networks
Innatera Unveils Neuromorphic AI Chip to Accelerate Spiking Networks
Russia To Build RISC-V Processors for Laptops: 8-core, 2 GHz, 12nm, 2025
Samsung Electronics May Apply 3-nm Process to Its Own Chips First
Monday, July 12, 2021
IEEE Adopts MIPI A-PHY, First Industry-Standard, Long-Reach SerDes Physical Layer Interface for Automotive Applications
RISC-V based XiangShan processor poses another threat to Intel
European startup ships first commercial quantum processor
China set to achieve 14 nm breakthrough in 2022
TSMC looks to 12nm Dresden fab
TTTech Aerospace releases the world's first 1 Gbit/s A664 End System IP certified to the highest civil aviation standards
IQ-Analog Adopts Diakopto's ParagonX Platform for Next-Generation 5G Wireless Communications ICs
Cadence and UMC Collaborate on 22ULP/ULL Reference Flow Certification for Advanced Consumer, 5G and Automotive Designs
Achronix and ACE Convergence Acquisition Corp Mutually Agree to Terminate Merger Agreement
Sunday, July 11, 2021
"Insolvent" Tsinghua Unigroup Aims to Restructure
Algolux Closes $18.4 Million Series B Round for Robust Computer Vision
Andes certifies Imperas RISC-V Reference Models for the new RISC-V P (SIMD/DSP) extension
Flexible fab could slash chip shortage
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