Search News

Wednesday, July 21, 2021

• U.K. Government to Co-invest £375m in Breakthrough Tech Firms
• Fraunhofer IIS successfully tests terrestrial IoT technology mioty® via GEO satellite
• Winbond's Successful Interoperability of OctalNAND Flash with Synopsys DesignWare AMBA IP Delivers Complete High-Density NAND Flash Memory Solution
• DVB-S2X Wideband Demodulator IP Core from Creonic Now Available with Time-Slicing Support (Annex M)
• Moschip Continues to Soar Consecutively for the 6th Quarter
• Kameleon Security Adds Investment from Xilinx to Deliver Hardware Cybersecurity for Servers
• Achronix Announces Record Second Quarter 2021 Financial Results and Business Highlights
• CEVA Continues to Lead the Way in Wireless Connectivity with Bluetooth 5.3 IP
• NovaSparks Unveil the First FPGA Market Data Aggregator
• Is TSMC-Sony A Sign Of Things To Come?
• Agile Analog brings analog IP to RISC-V International

Tuesday, July 20, 2021

• After 3D printing now comes 4D printing
• A natively flexible 32-bit Arm microprocessor
• Adding Intelligence to the Grid
• Mercury teams up with CoreAVI to provide safety-certified solutions
• ARM shows first plastic M0+ microcontroller
• Intel's foundry ambitions could be slowed by lack of deal targets
• Attopsemi's I-fuse OTP IP Now Qualified on a Japanese Wafer Fab's 130nm BCD and Embedded into ABLIC's IC Product

Monday, July 19, 2021

• Where Will TSMC Be in 5 Years?
• Agile Analog joins RISC-V International as a strategic member
• A surprising new job for RERAM technology
• European Commission forms processor, semiconductor alliance
• CrossBar Announces ReRAM Based PUF Keys
• GOWIN Semiconductor Announces their ISP (Image Signal Processor) IP Core and Solution
• CAES Receives Contract from Vinnova to Advance High Performance RISC-V Space Computing
• GlobalFoundries Plans to Build New Fab in Upstate New York in Private-Public Partnership to Support U.S. Semiconductor Manufacturing

Sunday, July 18, 2021

• $10m for French quantum carbon nanotube startup
• TSMC in 'Due Diligence' on Possible Japan Fab
• Chip Shortages May Persist Until 2023, Analysts Say
• CXL Product Pipeline Gets Flowing
• Precise-ITC 1.6T/800G/400G IP Product Series for Datacentre Application
• Secure-IC establishes new references to secure the Internet of Things
• Imperas updates Free reference model riscvOVPsimPlus with new RISC-V P (SIMD/DSP) extension and Architectural Validation Test Suites
• Samsung Foundry and Synopsys Collaborate to Accelerate Time to ISO 26262 Compliance for Automotive SoCs
• TSMC in "Due Diligence" on Possible Japan Fab
• Intel in talks to buy Globalfoundries
• Dolphin Design and CEA-List join forces for a new embedded AI computing platform

Wednesday, July 14, 2021

• Electronic System Design Industry Logs Record First-Quarter Revenue Growth, ESD Alliance Reports
• TSMC Reports Second Quarter EPS of NT$5.18
• Is analog IC fab renaissance in the works?
• Accellera Board Approves Security Annotation for Electronic Design Integration Standard 1.0 for Release
• Xenergic Raises 40 MSEK In New Share Issue
• Taiwan Maintains Edge as Largest Base for IC Wafer Capacity
• Quantware Launches the World's First Commercially Available Superconducting Quantum Processors, Accelerating the Advent of the Quantum Computer.
• Xilinx Versal HBM Series with Integrated High Bandwidth Memory Tackles Big Data Compute Challenges in the Network and Cloud
• Weebit completes design and tape-out of embedded ReRAM module
• Realtek selects Imagination GPU for use in DTV

Tuesday, July 13, 2021

• Neuromorphic processor leader Innatera appoints Prof. Alberto Sangiovanni-Vincentelli Chairman of Board
• Taiwan Maintains Lead in IC Wafer Capacity
• Rethinking Automotive Electronics Networks
• Innatera Unveils Neuromorphic AI Chip to Accelerate Spiking Networks
• Russia To Build RISC-V Processors for Laptops: 8-core, 2 GHz, 12nm, 2025
• Samsung Electronics May Apply 3-nm Process to Its Own Chips First

Monday, July 12, 2021

• IEEE Adopts MIPI A-PHY, First Industry-Standard, Long-Reach SerDes Physical Layer Interface for Automotive Applications
• RISC-V based XiangShan processor poses another threat to Intel
• European startup ships first commercial quantum processor
• China set to achieve 14 nm breakthrough in 2022
• TSMC looks to 12nm Dresden fab
• TTTech Aerospace releases the world's first 1 Gbit/s A664 End System IP certified to the highest civil aviation standards
• IQ-Analog Adopts Diakopto's ParagonX Platform for Next-Generation 5G Wireless Communications ICs
• Cadence and UMC Collaborate on 22ULP/ULL Reference Flow Certification for Advanced Consumer, 5G and Automotive Designs
• Achronix and ACE Convergence Acquisition Corp Mutually Agree to Terminate Merger Agreement

Sunday, July 11, 2021

• "Insolvent" Tsinghua Unigroup Aims to Restructure
• Algolux Closes $18.4 Million Series B Round for Robust Computer Vision
• Andes certifies Imperas RISC-V Reference Models for the new RISC-V P (SIMD/DSP) extension
• Flexible fab could slash chip shortage