Search News

Wednesday, July 7, 2021

• Secure-IC receives the Cybersecurity Made in Europe label
• Liverpool 5G Create and Blu Wireless develop industry-boosting IP
• Another Industry first: Extreme Networking- 1K TCP & UDP Session on intel/Xilinx FPGAs, high availability application performance - 2U Accelerator box with Linux iWARP/RoCE
• Faraday Succeeds in 5G NR mmWave ASIC
• PUFsecurity Provides Free Access to its Root of Trust and Security Co-Processor Solutions

Tuesday, July 6, 2021

• Winbond, Renesas accelerate building of embedded AI
• 14nm FinFET production USB3.0/PCIe3.0/SATA3.0/SGMII Combo PHY IP Core, available for immediate licencing.
• Tech's Effects Are Not Always Clear. Here Are 10 Examples That Provides Clarity
• Aldec launches its first RISC-V PolarFire FPGA emulation board
• Renesas releases modular IoT development platform
• Solid-State LiDAR Empowers ADAS, Autonomous Driving
• Another Industry first: Extreme Networking- 1K TCP & UDP Session on intel/Xilinx FPGAs, high availability application performance – 2U Accelerator box with Linux iWARP/RoCE
• Corigine Delivers a Next-Generation Prototyping System for ASIC and Pre-Silicon Software Development

Monday, July 5, 2021

• Imec tackles interconnect heating at 1nm
• Rambus Completes Acquisition of AnalogX
• WiLAN Subsidiaries Sign License Agreement with PSMC
• Global Semiconductor Sales in May Up 26.2% Year-to-Year, 4.1% Month-to-Month
• Think Silicon and the Aristotle University of Thessaloniki Create a Research Team to Solve Engineering Challenges of Next-Generation Graphics and AI Processors

Sunday, July 4, 2021

• Open source XiangShan RISC-V processor could eventually challenge ARM Cotex-A76
• Apple and Intel to get first 3nm chips from TSMC
• UMC Reports Sales for June 2021
• Sondrel's SFA 100 IP platform for intelligence gathering chips at the Edge
• GUC Monthly Sales Report - June 2021
• Apple and Intel first to use TSMC 3nm
• Andes Technology Announces Over 2 Billion Shipments Of Andes-Embedded SoCs In 2020

Thursday, July 1, 2021

• CEA-Leti Appoints New CEO
• Globalfoundries looks to Dresden fab expansion

Wednesday, June 30, 2021

• NVMe Gets Refactored
• Access Advance Launches VVC/H.266 Video Patent Pool
• Plans start for TSMC 2nm fab
• PathPartner Collaborates with Intel to Deliver AI-based Weld Defect Detection to the Manufacturing Industry
• IPrium releases 32-channel J.83B Modulator
• Allegro DVT Launches the World's First Hardware-Based VVC/H.266 Decoder Silicon IP
• BSC, Codeplay and SiFive help accelerate applications on RISC-V thanks to V-extension support in LLVM
• Wi-Fi Alliance furthers Automated Frequency Coordination specification and compliance development to accelerate Wi-Fi 6E

Tuesday, June 29, 2021

• Simulation of FDSOI-ISFET with Tunable Sensitivity by Temperature and Dual-Gate Structure
• SiFive Deepens RISC-V Core Lineup
• Enabling the dynamic 5G infrastructure with Arm-based solutions
• Imperas Expands Partnership with Valtrix to Address Growing RISC-V Verification Market
• The wars at the leading edge have begun
• AnalogX Accelerates Time-to-Market with Diakopto's ParagonX Debugging Platform and Methodology
• Silicon Creations Selects Diakopto's ParagonX IC Debugging Platform
• Worldwide IC Market Forecast to Top $500 Billion in 2021
• System Level Solutions's USB 2.0 Device Controller IP core is now available for Lattice Semiconductor FPGA platform
• Arteris IP FlexNoC Interconnect Again Licensed by AutoChips for Automotive SoC Product Line

Monday, June 28, 2021

• Driverless Car Group Eyes AV Safety Standard
• Automobile In-Vehicle Networks–Ethernet, SERDES, or Both?
• Dialog Semiconductor Expands AC/DC Portfolio, Targeting High Power Density PSUs with Zero Voltage Switching Technology
• Arm-powered Fugaku supercomputer claims #1 spot on Top500 third time in a row
• SiFive Collaborates with Imperas on Models of SiFive's RISC-V Core IP Portfolio
• Quantum-tunnelling semiconductor IP verified as secure against all known IoT attacks
• Marvell Extends OCTEON Leadership with Industry's First 5nm DPUs
• QuEST Global acquires Synapse Design to Enhance Expertise in Semiconductor and Connected Engineering
• Faraday Announces LPDDR4/4X in Samsung 14LPC Process
• GOWIN Semiconductor Announces Their GoBridge ASSP Product Line with USB Peripheral Bridges

Sunday, June 27, 2021

• EU launches its €13bn integrated space programme
• Nvidia's takeover of Arm gets support from Broadcom and other chip heavyweights
• Siemens looks to digital twin, IoT to drive growth
• Samsung Foundry tapes out 3nm GAA chip
• NVIDIA Aerial 5G Platform Extends Support for Arm
• Neurala Raises $12 Million to Scale Artificial Intelligence for Industrial Manufacturing
• AMIQ EDA Updates UVM Rule Checks for Latest Release of the Universal Verification Methodology Standard
• New Semiconductor Fabs to Spur Surge in Equipment Spending, SEMI Reports
• Intel Shuffles Networking Groups, Product Mix
• BrainChip Taps Former ARM Executive Antonio J. Viana as Non-Executive Director
• Synopsys Strategic Partnership with Samsung Foundry Accelerates Access to Transformative 3nm GAA Technology
• Gowin Removed From CCMC List, Withdrawing Lawsuit