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Thursday, June 10, 2021
Sequans Communications Adopts Cadence RF Solution to Develop Next-Generation 5G IoT Platform
Truechip Announces Customer Shipment of PCIe Gen 6 Verification IP
Intel said to have offered $2bn for SiFive
Lattice and Infineon Technologies Collaborate to Deliver New Pictor Reference Design Kit
sureCore & Intrinsic Announce Collaboration to Bring Novel RRAM Technology to Market
Wednesday, June 9, 2021
SOI-Based Multi-Channel AWG with Fiber Bragg Grating Sensing Interrogation System
Soitec unveils its strategy for 2026 and its target to triple its revenue
Xilinx Extends Edge Compute Leadership with World's Highest AI Performance-per-Watt
TSMC May 2021 Revenue Report
Xilinx Acquires Silexica to Broaden its Developer Base
Bosch opens wafer fab of the future in Dresden
Hardent VESA DSC and FEC IP Cores Licensed by Kinetic Technologies
Samsung Successfully Completes 8nm RF Solution Development to Strengthen 5G Communications Chip Solutions
Global Semiconductor Sales Increase 1.9% Month-to-Month in April; Annual Sales Projected to Increase 19.7% in 2021, 8.8% in 2022
Creonic to Offer End-to-end IP-over-Satellite Solutions
Silex Insight launches the all-new VIPER (4K60 4:4:4 AV over IP transmitter/receiver board), ideal for collaboration featuring seamless switching between multiple inputs (2xHDMI/1xUSB-C)
TSMC approves expansion budget of more than US$9 billion
Siemens Enhances Nucleus ReadyStart for Arm Platforms
Tuesday, June 8, 2021
OPENEDGES and The Six Semi Announce Silicon Proven GDDR6 PHY in 12nm Process Technology
TSMC's Chip Scaling Efforts Reach Crossroads at 2nm
Automotive IC Marketshare Slips in 2020 After Steady Gains Since 1998
IBM, GlobalFoundries in Breach-of-Contract Spat
New Cadence Allegro X Design Platform Revolutionizes System Design
AndesBoardFarm Enables SoC Designers to Explore RISC-V Processors in Online FPGA Board Collection
Monday, June 7, 2021
Nvidia asks Chinese regulators to approve US$40b Arm deal: FT
RISC-V FPGA SoM module starts production
TSMC's 3DFabric Technology is the next big wave in Chip Design that Apple will take advantage of in the not-too-distant Future
Siemens acquires proFPGA product family from PRO DESIGN to expand industry-leading IC verification portfolio
GUC Tapes Out AI/HPC/Networking Platform on TSMC CoWoS Technology Validating 7.2 Gbps HBM3 Controller and PHY, GLink-2.5D and 112G-LR SerDes IPs
Synopsys Acquires Code Dx to Extend Application Security Portfolio
Xylon Releases a Complete Multi-Channel HDR ISP IP Suite
eMemory and PUFsecurity Join DARPA Toolbox Initiative
GLOBALFOUNDRIES and GlobalWafers Partnering to Expand Semiconductor Wafer Supply
Arteris IP FlexNoC Interconnect & Resilience Package Again Licensed by Black Sesame for ISO 26262-Compliant Automotive ADAS Chips
Mythic Expands Product Lineup with New Scalable, Power-Efficient Analog Matrix Processor for Edge AI Applications
Sunday, June 6, 2021
Automotive Software & Cybersecurity
Cryptography Innovations in Hardware Processors
Siemens EDA Tools Now Qualified on TSMC's N3, N4 Processes
UMC Reports Sales for May 2021
NVM Express Announces the Rearchitected NVMe 2.0 Library of Specifications
Palma Ceia SemiDesign Announces New Wi-Fi HaLow Chips, PCS2100 and PCS2500 - Ideal for Industry 4.0
GUC Monthly Sales Report - May 2021
Wednesday, June 2, 2021
TSMC's Zhang: Automotive is Going HPC
Synopsys Expands Multi-Die Solution Leadership with Industry's Lowest Latency Die-to-Die Controller IP
SmartDV Announces Support for ARINC Standards with Design and Verification IP
Siemens enhances Nucleus ReadyStart for Arm platforms with enhanced debug, security and stability features
intoPIX delivers JPEG XS Compressed Solutions for Low Latency Video Streaming with NVIDIA GPUs
EdgeCortix Collaborates with Cadence to Accelerate AI Chip Design
Texas Instruments Continues As World's Top Analog IC Supplier
Brite Semiconductor Releases ONFI 4.2 IO and Physical Layer IP based on SMIC 14nm FinFET Process
Sondrel launches the fourth IP platform - SFA 350A - that delivers faster time to market for ADAS ASICs
Sondrel launches the fourth IP platform – SFA 350A – that delivers faster time to market for ADAS ASICs
Tuesday, June 1, 2021
TSMC to Build Semiconductor R&D Center in Japan
TSMC Widens Its Gap with Samsung in Foundry Business
Majority of Top 20 APAC Tech Firms Managed to Post Growth in 2020
Socionext's Advanced New Sensor Technology Ideal for A Wide Range of Applications
TSMC Technology Symposium: Siemens verification for TSMC 4nm and 3nm
Record Q1 foundry revenues
TSMC's 4nm process coming ahead of schedule
First step in its Multi-Codec HEVC and VVC Platform Initiative
TSMC Unveils Innovations at 2021 Online Technology Symposium
PUFsecurity and Andes Technology Cooperate to Integrate Crypto Coprocessor PUFiot into RISC-V AIoT Security Platform
NXP Ramps Automotive Processing Innovation with Two Processors on TSMC 16nm FinFET Technology
Arm empowers MCU software developers to capitalize on IoT potential
Aldec Launches HES-DVM Proto "Cloud Edition" - Giving Engineers Easier Access to FPGA-based ASIC & SoC Prototyping
PLDA and AnalogX Announce Market-leading CXL 2.0 Solution featuring Ultra-low Latency and Power
Monday, May 31, 2021
Intel Unveils New Additions to 11th Gen Processor Portfolio
European Processor Initiative Announces EPAC1.0 RISC-V Test Chip Taped-out
Synopsys DesignWare IP Achieves Broad Industry Adoption with Multiple First-Pass Customer Silicon Successes on TSMC's N5 Process
Siemens announces EDA milestones and tool certifications for TSMC's latest process technologies
Sequans Licenses CEVA 5G Modem IP for Broadband IoT Platform
EPI EPAC1.0 RISC-V Test Chip Taped-out
Analog Bits to Demonstrate 5nm IP Silicon at TSMC 2021 Online Technology Symposium
Sunday, May 30, 2021
Quarterly Revenue of Top 10 Foundries Breaks Records in 1Q21 Owing to Price Hikes Caused by Tight Foundry Capacities, Says TrendForce
Dolphin Design joins Arm Approved Design Partner Program
SEGGER's emRun Runtime Library Licensed by SiFive for Superior Code Size and Performance Improvements
Arm Upgrades Its Entire PC And Mobile Portfolio
Join Innosilicon at TSMC 2021 Online Technology Symposium
Cadence Collaborates with TSMC to Accelerate Mobile, AI and Hyperscale Computing Application Development on N3 and N4 Processes
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